公开(公告)号：US09842762B1

公开(公告)日：2017-12-12

申请号：US15349306

申请日：2016-11-11

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Berthold Reimer ,  Boris Bayha

IPC: H01L27/108 ,  H01L21/3105 ,  H01L21/02 ,  H01L21/44 ,  H01L21/302 ,  H01L21/311 ,  H01L21/762 ,  H01L21/263 ,  H01L21/66

CPC classification number: H01L21/7624 ,  H01L21/02236 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/2633 ,  H01L21/302 ,  H01L21/31053 ,  H01L21/31111 ,  H01L21/31116 ,  H01L22/26

Abstract: The present disclosure provides a method of manufacturing a semiconductor wafer having a semiconductor-on-insulator (SOI) configuration, the method including providing a semiconductor starting wafer, the semiconductor starting wafer having a base substrate, a semiconductor layer formed over the base substrate and a buried insulating material layer formed between the semiconductor substrate and the base substrate, exposing the semiconductor starting wafer to a first oxidization process, wherein an oxide surface region is formed by oxidizing an upper surface region of the semiconductor layer, thinning the oxide surface region, exposing the semiconductor starting wafer to a second oxidization process, wherein a thickness of the oxide surface region is locally increased, and removing the oxide surface region, wherein the semiconductor layer is exposed.

公开(公告)号：US20180269081A1

公开(公告)日：2018-09-20

申请号：US15463478

申请日：2017-03-20

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Boris Bayha ,  Martin Trentzsch

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/6773 ,  H01L21/67248 ,  H01L21/67389 ,  H01L21/67393 ,  H01L21/67769

Abstract: The present disclosure provides systems and techniques in which an ambient may be controlled on the basis of a current status of a micro-processed substrate so as to maintain the status within predefined limits. In illustrative embodiments, the substrate may be stored in an ambient, for which temperature and/or contents of one or more gaseous species may be controlled so as to reduce the change of status. Consequently, in particular, queue times may be significantly prolonged, thereby imparting superior flexibility to scheduling the overall process flow in a complex manufacturing environment.