Abstract:
Methods for preparing CMOS transistors having longer effective gate lengths and the resulting devices are disclosed. Embodiments include forming a dummy gate bound by spacers on opposing sides thereof, on a substrate; removing the dummy gate to form a trench between the spacers; modifying a gate channel portion of the substrate between the spacers to form inner or outer sidewalls; depositing a conformal high-k dielectric layer on the modified gate channel portion; and forming a metal gate in the trench.
Abstract:
The present disclosure relates to a method which includes generating a device layout of an eBeam based overlay (EBO OVL) structure with a minimum design rule, simulating a worst case process margin for the generated device layout of the EBO OVL structure, enabling a plurality of devices for the simulated worst case process margin for the generated device layout of the EBO OVL structure, and breaking a plurality of design rules for the enabled plurality of devices of the EBO OVL structure to generate an OVL measurement layout of the EBO OVL structure.