-
公开(公告)号:US11121097B1
公开(公告)日:2021-09-14
申请号:US16881736
申请日:2020-05-22
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Vibhor Jain , Sebastian T. Ventrone , Siva P. Adusumilli , John J. Ellis-Monaghan , Ajay Raman
Abstract: The present disclosure relates to a metal layer for an active x-ray attack prevention device for securing integrated circuits. In particular, the present disclosure relates to a structure including a semiconductor material, one or more devices on a front side of the semiconductor material, a backside patterned metal layer under the one or more devices, located and structured to protect the one or more devices from an active intrusion, and at least one contact providing an electrical connection through the semiconductor material to a front side of the backside patterned metal layer. The backside patterned metal layer is between a wafer and one of the semiconductor material and an insulator layer.
-
公开(公告)号:US11054854B1
公开(公告)日:2021-07-06
申请号:US17032027
申请日:2020-09-25
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Sebastian T. Ventrone , Johnatan Kantarovsky
Abstract: Embodiments of the disclosure provide systems and methods to operate a logic circuit with non-deterministic clock edge variations. A system may include a clock coupled to a logic circuit, the logic circuit having a set of source latches coupled to a set of capture latches through a set of logic cones. The clock includes a fixed clock component configured to generate a clock signal having a first clock edge, and a jitter clock component coupled to the fixed clock component and configured to modify the clock signal to have a second clock edge based on a non-deterministic value. The clock transmits the clock signal with the second clock edge to drive the set of source latches and the set of capture latches of the logic circuit. A clock controller coupled to the jitter clock component generates the non-deterministic value.
-
3.
公开(公告)号:US11171095B1
公开(公告)日:2021-11-09
申请号:US16855185
申请日:2020-04-22
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Vibhor Jain , Ajay Raman , Sebastian T. Ventrone , John J. Ellis-Monaghan , Siva P. Adusumilli , Yves T. Ngu
IPC: H01L23/00
Abstract: The present disclosure relates to an active x-ray attack prevention structure for secure integrated circuits. In particular, the present disclosure relates to a structure including a functional circuit, and at least one latchup sensitive diode circuit configured to induce a latchup condition in the functional circuit, placed in proximity of the functional circuit.
-
公开(公告)号:US11901304B2
公开(公告)日:2024-02-13
申请号:US17323423
申请日:2021-05-18
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Sunil K. Singh , Vibhor Jain , Siva P. Adusumilli , Sebastian T. Ventrone , Johnatan A. Kantarovsky , Yves T. Ngu
IPC: H01L23/544 , H01L23/48 , H01L23/00
CPC classification number: H01L23/544 , H01L23/481 , H01L23/57 , H01L23/573 , H01L2223/5442 , H01L2223/54433
Abstract: The disclosure provides an integrated circuit (IC) structure with fluorescent materials, and related methods. An IC structure according to the disclosure may include a layer of fluorescent material on an IC component. The layer of fluorescent material defines a portion of an identification marker for the IC structure.
-
公开(公告)号:US11380622B2
公开(公告)日:2022-07-05
申请号:US16953441
申请日:2020-11-20
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Vibhor Jain , Sunil K. Singh , Johnatan A. Kantarovsky , Siva P. Adusumilli , Sebastian T. Ventrone , John J. Ellis-Monaghan , Yves T. Ngu
IPC: H01L23/544 , H01L23/00
Abstract: The disclosure provides a method to authenticate an integrated circuit (IC) structure. The method may include forming a first authentication film (AF) material within the IC structure. A composition of the first AF material is different from an adjacent material within the IC structure. The method includes converting the first AF material into a void within the IC structure. Additionally, the method includes creating an authentication map of the IC structure to include a location of the void in the IC structure for authentication of the IC structure.
-
公开(公告)号:US11437329B2
公开(公告)日:2022-09-06
申请号:US17070377
申请日:2020-10-14
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Johnatan A. Kantarovsky , Vibhor Jain , Siva P. Adusumilli , Ajay Raman , Sebastian T. Ventrone , Yves T. Ngu
IPC: H01L23/552 , H01L23/00 , H01L23/522 , H01L49/02
Abstract: The present disclosure relates to integrated circuits, and more particularly, to an anti-tamper x-ray blocking package for secure integrated circuits and methods of manufacture and operation. In particular, the present disclosure relates to a structure including: one or more devices on a front side of a semiconductor material; a plurality of patterned metal layers under the one or more devices, located and structured to protect the one or more devices from an active intrusion; an insulator layer between the plurality of patterned metal layers; and at least one contact providing an electrical connection through the semiconductor material to a front side of the plurality of metals.
-
公开(公告)号:US20220375871A1
公开(公告)日:2022-11-24
申请号:US17323423
申请日:2021-05-18
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Sunil K. Singh , Vibhor Jain , Siva P. Adusumilli , Sebastian T. Ventrone , Johnatan A. Kantarovsky , Yves T. Ngu
IPC: H01L23/544 , H01L23/48 , G01N21/64
Abstract: The disclosure provides an integrated circuit (IC) structure with fluorescent materials, and related methods. An IC structure according to the disclosure may include a layer of fluorescent material on an IC component. The layer of fluorescent material defines a portion of an identification marker for the IC structure.
-
公开(公告)号:US11366154B2
公开(公告)日:2022-06-21
申请号:US16527146
申请日:2019-07-31
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Sebastian T. Ventrone , Richard S. Graf , Ezra D. B. Hall , Jack R. Smith
Abstract: An integrated circuit (IC) includes functional logic therein that can be enabled by application of a predefined thermal cycle. The IC includes an enabling fuse operatively coupled to the functional logic, the functional logic being disabled unless enabled by activation of the enabling fuse. A set of thermal sensors are arranged in a physically distributed manner through at least a portion of the IC. A test control macro operatively couples to the set of thermal sensors and the enabling fuse for activating the enabling fuse to enable the functional logic in response to application of a thermal cycle that causes the set of thermal sensors to sequentially experience a thermal condition matching a thermal sequence enabling test. A related method and system for applying the predefined thermal cycle are also provided.
-
公开(公告)号:US20220165676A1
公开(公告)日:2022-05-26
申请号:US16953441
申请日:2020-11-20
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Vibhor Jain , Sunil K. Singh , Johnatan A. Kantarovsky , Siva P. Adusumilli , Sebastian T. Ventrone , John J. Ellis-Monaghan , Yves T. Ngu
IPC: H01L23/544 , H01L23/00
Abstract: The disclosure provides a method to authenticate an integrated circuit (IC) structure. The method may include forming a first authentication film (AF) material within the IC structure. A composition of the first AF material is different from an adjacent material within the IC structure. The method includes converting the first AF material into a void within the IC structure. Additionally, the method includes creating an authentication map of the IC structure to include a location of the void in the IC structure for authentication of the IC structure.
-
-
-
-
-
-
-
-