公开(公告)号：US5353194A

公开(公告)日：1994-10-04

申请号：US142723

申请日：1993-10-24

Applicant: Giuseppe Libretti ,  Paolo Casati

Inventor： Giuseppe Libretti ,  Paolo Casati

IPC: H01L25/07 ,  H01L23/14 ,  H01L25/065 ,  H01L25/18 ,  H05K7/20

CPC classification number: H01L23/142 ,  H01L25/0652 ,  H01L2224/48091 ,  H01L2224/48227

Abstract: A modular construction power circuit arrangement is disclosed which comprises a thin metal plate performing holder and heat sink functions, a multiplicity of electronic devices in the form of semiconductor material chips having metalized pads as their terminals, a printed circuit board attached to the thin metal plate, electric conductors between the metalized pads and the printed circuit on the board, terminating connectors which form a part of the printed circuit board for connecting the circuit arrangement to external circuits, and a plastics material body which conglomerates a portion of the thin metal plate, the semiconductor material chips, and the printed circuit board. At least one of the semiconductor material chips is attached directly to the thin metal plate and extends therefrom through an opening in the printed circuit board.

Abstract translation: 公开了一种模块化结构电力电路装置，其包括执行保持器和散热器功能的薄金属板，具有金属化焊盘作为其端子的半导体材料芯片形式的多个电子器件，附接到薄金属板的印刷电路板 ，金属化焊盘与板上的印刷电路之间的电导体，形成用于将电路装置连接到外部电路的印刷电路板的一部分的终端连接器以及聚集薄金属板的一部分的塑料材料体， 半导体材料芯片和印刷电路板。 半导体材料芯片中的至少一个直接附接到薄金属板，并从其穿过印刷电路板的开口延伸。

公开(公告)号：US5412248A

公开(公告)日：1995-05-02

申请号：US960529

申请日：1992-10-13

Applicant: Bruno Murari ,  Giuseppe Libretti

Inventor： Bruno Murari ,  Giuseppe Libretti

IPC: H01L23/04 ,  B60R16/02 ,  H01L23/31 ,  H01L23/32 ,  H01R13/52 ,  H01R13/66 ,  H01R31/06 ,  H01L23/48 ,  H01L29/41 ,  H01L29/52 ,  H01L29/60

CPC classification number: B60R16/02 ,  H01L23/3107 ,  H01R13/665 ,  H01R31/06 ,  H01L2924/0002 ,  H01R13/5219

Abstract: A packaging structure is disclosed for a semiconductor device, having a body configured to include at least one part provided with contact terminals and shaped to form a connector member for direct coupling to a standard connector member from an external circuit. A connector assembly is also disclosed which is fully sealed from moisture and comprises the packaging structure.

Abstract translation: 公开了一种用于半导体器件的封装结构，其具有被配置为包括设置有接触端子的至少一个部分的主体并成形为形成用于从外部电路直接耦合到标准连接器构件的连接器构件。 还公开了一种连接器组件，其从湿气完全密封并且包括该包装结构。

公开(公告)号：US5594276A

公开(公告)日：1997-01-14

申请号：US432835

申请日：1995-05-02

Applicant: Bruno Murari ,  Giuseppe Libretti

Inventor： Bruno Murari ,  Giuseppe Libretti

IPC: H01L23/04 ,  B60R16/02 ,  H01L23/31 ,  H01L23/32 ,  H01R13/52 ,  H01R13/66 ,  H01R31/06 ,  H01L23/48 ,  H01L29/41

CPC classification number: B60R16/02 ,  H01L23/3107 ,  H01R13/665 ,  H01R31/06 ,  H01L2924/0002 ,  H01R13/5219

Abstract: A packaging structure is disclosed for a semiconductor device, having a body configured to include at least one part provided with some terminating rheophores and shaped to form a connector member for direct coupling to a standard connector member from an external circuit. A connector assembly is also disclosed which is fully sealed from moisture and comprises the packaging structure. The invention has an advantageous application in the field of electric systems for motor vehicles.

Abstract translation: 公开了一种用于半导体器件的封装结构，其主体被配置为包括设置有一些端接电流导电体的至少一个部分，并成形为形成用于从外部电路直接耦合到标准连接器部件的连接器部件。 还公开了一种连接器组件，其从湿气完全密封并且包括该包装结构。 本发明在机动车辆用电气系统领域具有有利的应用。

公开(公告)号：US5187431A

公开(公告)日：1993-02-16

申请号：US716704

申请日：1991-06-18

Applicant: Giuseppe Libretti

Inventor： Giuseppe Libretti

IPC: G01R1/073 ,  G01R31/26 ,  H01L21/66 ,  H01R11/18 ,  H01R31/06

CPC classification number: H01R31/06 ,  G01R1/07378 ,  H01R12/52

Abstract: An universal connector employing a plurality of double female contacts installed with a certain clearance in receptacles of a body which may be suspended in a coupling position with a plurality of male contacts arranged on the top face of an EWS probe card and with a plurality of male contacts arranged on the bottom surface of a test card in a test-on-wafer station, provides a multicontact universal connection for any pair of so equipped cards of the inventories of probe cards and of test cards of the station. The connection is easily set up and exhibits excellent stability and uniformity characteristics of the electrical couplings, while reducing sensibly the time necessary for the setting-up and debugging of the test station for initiating a certain cycle of testing-on-wafer. The stability and reproducibility of the electrical couplings provided by the connection increases the precision of the measurements of critical parameters of the integrated devices with a positive effect on the production yield.