公开(公告)号：US20200022282A1

公开(公告)日：2020-01-16

申请号：US16580538

申请日：2019-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Travis J. Gaskill

IPC: H05K7/20 ,  F28D15/02 ,  H01L23/427

Abstract: An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.

公开(公告)号：US11058032B2

公开(公告)日：2021-07-06

申请号：US16580538

申请日：2019-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Travis J. Gaskill

IPC: H05K7/20 ,  H01L23/427 ,  F28D15/02 ,  B23P15/26

Abstract: An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.

公开(公告)号：US20200245503A1

公开(公告)日：2020-07-30

申请号：US16258887

申请日：2019-01-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David Chialastri ,  Travis J. Gaskill ,  Vincent W. Michna ,  Nilashis Dey ,  Patrick Raymond

IPC: H05K7/20 ,  F25D23/12

Abstract: A method for balancing air flow impedance within an enclosure. The method includes determining a configuration of each hardware module of a plurality of hardware modules arranged in a housing of the enclosure. The method also includes determining impedance settings for a plurality of adjustable air flow impedance elements within the housing, based at least in part on the configurations of the plurality of hardware modules, that will balance air flow impedances of the plurality of hardware modules. The method further includes setting the plurality of adjustable air flow impedance elements according to the determined impedance settings.

公开(公告)号：US10462932B2

公开(公告)日：2019-10-29

申请号：US15800695

申请日：2017-11-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Travis J. Gaskill

IPC: H05K7/20 ,  F28D15/02 ,  H01L23/427

Abstract: An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.

公开(公告)号：US20190131204A1

公开(公告)日：2019-05-02

申请号：US15800695

申请日：2017-11-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Travis J. Gaskill

IPC: H01L23/367 ,  H01L23/427 ,  G06F1/20 ,  F28D15/02

CPC classification number: H05K7/20336 ,  F28D15/0275 ,  H01L23/427

Abstract: An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.