公开(公告)号：US11762427B2

公开(公告)日：2023-09-19

申请号：US17418464

申请日：2019-02-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chih-Hsiung Liao

IPC: G06F1/16

CPC classification number: G06F1/1656 ,  G06F1/1616

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

公开(公告)号：US10768672B2

公开(公告)日：2020-09-08

申请号：US16074455

申请日：2016-10-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Yu-Chen So ,  Chienchih Chiu ,  Chih-Hsiung Liao ,  Lien-Chia Chiu

IPC: G06F1/16

Abstract: In example implementations, a hinge is provided. The hinge comprises a first hinge plate having at least one opening, where the first hinge plate is coupled to a system cover via at least one fastener fitted through the at least one opening. The hinge comprises a second hinge plate movably coupled to the first hinge plate, where the second hinge plate comprises a tab member that is coupled to a display cover via an insert molding process. The hinge comprises a hinge cap to enclose a portion of the first hinge plate and the second hinge plate that are movable coupled.

公开(公告)号：US12152310B2

公开(公告)日：2024-11-26

申请号：US16978733

申请日：2018-06-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chih-Hsiung Liao

IPC: C25D11/24 ,  C09D5/00 ,  C09D7/20 ,  C09D183/04 ,  C25D11/18 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  H05K5/04

Abstract: The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.

公开(公告)号：US11920244B2

公开(公告)日：2024-03-05

申请号：US16982694

申请日：2018-07-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chi-Hao Chang ,  Ya-Ting Yeh ,  Kuan-Ting Wu ,  Chih-Hsiung Liao

IPC: C23C28/00 ,  C23C14/16 ,  C25D11/02 ,  C25D11/30 ,  G06F1/16

CPC classification number: C23C28/345 ,  C23C14/16 ,  C23C28/322 ,  C25D11/026 ,  C25D11/30 ,  G06F1/1656

Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

公开(公告)号：US20210363654A1

公开(公告)日：2021-11-25

申请号：US16978733

申请日：2018-06-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chih-Hsiung Liao

IPC: C25D11/24 ,  C09D5/00 ,  C09D7/20 ,  C09D183/04 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  C25D11/18 ,  H05K5/04

Abstract: The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.

公开(公告)号：US20210363646A1

公开(公告)日：2021-11-25

申请号：US16982694

申请日：2018-07-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chi Hao Chang ,  Ya-Ting Yeh ,  Kuan-Ting Wu ,  Chih-Hsiung Liao

IPC: C23C28/00 ,  C23C14/16 ,  C25D11/02 ,  C25D11/30 ,  G06F1/16

Abstract: The application discloses examples of a device housing of an electronic device comprising a magnesium-alloy substrate. The device housing further comprising a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.