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    MODULE CONNECTIVITY DEVICE
    1.
    发明申请
    MODULE CONNECTIVITY DEVICE 有权
    模块连接设备

    公开(公告)号：US20160124470A1

    公开(公告)日：2016-05-05

    申请号：US14897965

    申请日：2013-07-22

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Kevin B. Leigh ,  George D. Megason ,  Eugene E. Freeman ,  William James Walker

    IPC: G06F1/18 ,  H01H23/12 ,  H01R25/00 ,  H05K7/14

    CPC classification number: G06F1/18 ,  G06F1/183 ,  H01H23/12 ,  H01H2231/002 ,  H01R25/006 ,  H05K7/1492

    Abstract: A module connectivity device includes a stationary pivot plenum, a number of rocker-arm assemblies movably coupled to the stationary pivot plenum in which the rocker-arm assemblies move between an open position and a closed position, and a number of module connectors movably coupled to the rocker-arm assemblies, in which the module connectors move between a disengaged position and an engaged position with respect to the connectors on system modules. A module connectivity system includes a number of rocker-arm assemblies and a number of module connectors movably coupled to the number of rocker-arm assemblies. The system also includes a module connectivity manager to manage the connectivity of the module connectors.

    Abstract translation: 模块连接装置包括固定的枢转气室，多个摇臂组件，其可移动地联接到固定枢轴气室，摇臂组件在打开位置和关闭位置之间移动，多个模块连接件可移动地联接到 摇臂组件，其中模块连接器相对于系统模块上的连接器在脱离位置和接合位置之间移动。 模块连接系统包括多个摇臂组件和可移动地联接到多个摇臂组件的多个模块连接件。 该系统还包括一个模块连接管理器来管理模块连接器的连接。

    MULTI-CHIP SOCKET
    4.
    发明申请
    MULTI-CHIP SOCKET 有权
    多芯片插座

    公开(公告)号：US20140315435A1

    公开(公告)日：2014-10-23

    申请号：US14323619

    申请日：2014-07-03

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Kevin B. Leigh ,  George D. Megason

    IPC: H01R12/71 ,  H01R43/20

    CPC classification number: H05K7/2039 ,  H01L23/13 ,  H01L23/32 ,  H01L23/36 ,  H01L2924/0002 ,  H01R12/712 ,  H01R43/205 ,  H05K3/32 ,  H05K7/10 ,  H05K2201/10325 ,  H05K2201/10962 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: A multi-chip socket includes a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip. A second cavity has a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip. The first support surface is in a first plane, and the second support surface is in a second plane, where the first plane is angled with respect to the second plane.

    Abstract translation: 多芯片插座包括具有第一支撑表面的第一空腔，以支撑包括第一芯片的第一部件，第一支撑表面布置成接触和支撑第一芯片。 第二空腔具有第二支撑表面，以支撑包括第二芯片的第二部件，第二支撑表面布置成接触和支撑第二芯片。 第一支撑表面在第一平面中，并且第二支撑表面处于第二平面中，其中第一平面相对于第二平面成角度。

    Base layer architecture infrastructure device
    5.
    发明授权
    Base layer architecture infrastructure device 有权

    公开(公告)号：US10653039B2

    公开(公告)日：2020-05-12

    申请号：US14898686

    申请日：2013-07-15

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Kevin B. Leigh ,  George D. Megason

    IPC: H05K7/20 ,  H05K7/14

    Abstract: A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers.

    BASE LAYER ARCHITECTURE INFRASTRUCTURE DEVICE
    8.
    发明申请
    BASE LAYER ARCHITECTURE INFRASTRUCTURE DEVICE 审中-公开
    基层架构基础设施

    公开(公告)号：US20160150681A1

    公开(公告)日：2016-05-26

    申请号：US14898686

    申请日：2013-07-15

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Kevin B. Leigh ,  George D. Megason

    IPC: H05K7/20 ,  H05K7/14

    CPC classification number: H05K7/20709 ,  H05K7/1492 ,  H05K7/20509

    Abstract: A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers.

    Abstract translation: 基础层架构（BLA）基础设施设备包括向盒提供电力的功率基础层（PBL），冷却基座层（冷TBL）以冷却盒，热热基层（热TBL）以去除热量 从盒式存储器向光盘发送光信号的光基层（OBL）和射频基层（RBL），以将射频信号传送到盒。 每个基层包括用于将基层耦合到支架的机架接口和用于将基层耦合到盒的多个盒接口。 BLA基础设施系统包括包括多个基本层的BLA基础设施设备。 基层的数量可拆卸地耦合到机架和系统管理装置以管理基础层的数量。

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