公开(公告)号：US10170712B2

公开(公告)日：2019-01-01

申请号：US15563969

申请日：2015-05-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Wei Kuang Chu ,  Kuan-Ting Wu ,  Kevin Voss

IPC: H01L27/32 ,  H01L51/00 ,  G02F1/01 ,  H01L51/52 ,  H01L33/46 ,  H01L33/58 ,  H01L33/62 ,  H01L51/56 ,  G04B37/14 ,  G04G9/00 ,  H01L25/04 ,  H01L25/075 ,  H01L27/15

Abstract: Provided in one example is an article. The article includes a substrate. The article includes a first layer disposed over at least a portion of the substrate, the first layer comprising a reflector. The article includes a second layer disposed over at least a portion of the first layer, the second layer comprising an electrode. The article includes a third layer disposed over at least a portion of the second layer, the third layer comprising a polymer and a light source. The article includes a fourth layer disposed over at least a portion of the third layer, the fourth layer comprising a diffusor. The article includes a fifth layer disposed over at least a portion of the fourth layer, the fifth layer comprising at least one of a photochromic material and a thermochromic material.

公开(公告)号：US11259423B2

公开(公告)日：2022-02-22

申请号：US16074175

申请日：2016-10-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Kevin Voss ,  Ai-Tsung Li ,  Wei Kuang Chu ,  Wei-Chung Chen

IPC: B32B3/00 ,  H05K5/02 ,  B32B3/26 ,  B32B7/14 ,  G06F1/16 ,  H05K5/00

Abstract: Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

公开(公告)号：US10851460B2

公开(公告)日：2020-12-01

申请号：US16074552

申请日：2016-10-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Kevin Voss ,  Chi-Hao Chang

IPC: C23C28/00 ,  C23C14/16 ,  C23C30/00 ,  H01L23/427 ,  B82Y30/00 ,  H01L23/373

Abstract: In example implementations, a vapor chamber is provided. The vapor chamber includes a metallic housing. A nickel coating is applied on inside walls of the metallic housing. A silica derived carbon nanotube (CNT) aerogel coating is applied on the nickel coating on the inside walls of the metallic housing. The silica derived CNT aerogel coating is sprayed onto the nickel coating, dried and cured.

公开(公告)号：US10398041B2

公开(公告)日：2019-08-27

申请号：US15746129

申请日：2015-08-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  Kuan-Ting Wu ,  Kevin Voss ,  Ya-Ting Yeh

Inventor： Kuan-Ting Wu ,  Kevin Voss ,  Ya-Ting Yeh

IPC: C03C17/42 ,  H05K5/02 ,  B05D3/06 ,  B05D3/10 ,  B05D3/12

Abstract: Various examples provide a method of making a hydrophobic surface for an object. According to the method, a hydrophobic coating may be applied to an original surface of the object. A microstructure may be formed on the original surface of the object. The hydrophobic surface of the object may be obtained with the microstructure submerged by the hydrophobic coating. The microstructure may be a rough structure including micro-sired portions, and may have greater hardness than the hydrophobic coating.

公开(公告)号：US09873236B2

公开(公告)日：2018-01-23

申请号：US15517699

申请日：2014-12-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kevin Voss ,  KT (Kuan-Ting) Wu ,  James Chang

IPC: H01L23/58 ,  B32B3/30 ,  B32B7/02 ,  B05D5/08 ,  B05D7/00 ,  B32B33/00

CPC classification number: B32B3/30 ,  B05D5/083 ,  B05D7/52 ,  B32B7/02 ,  B32B33/00 ,  H04M1/0202

Abstract: A coated substrate may provide soft touch and superhydrophobicity. In example implementations herein, a substrate may be provided with a microstructure on at least a portion of at least one surface of the substrate. A first, water-based soft touch coating may be on at least a portion of the microstructure. A second, solvent-based superhydrophobic coating may be on at least a portion of the first coating.

公开(公告)号：US11031319B2

公开(公告)日：2021-06-08

申请号：US16323090

申请日：2016-10-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  David A Pipho ,  Kevin Voss

IPC: H01L23/433 ,  H01L21/56 ,  H01L23/02 ,  H01L23/42 ,  H01L21/48 ,  H01L23/367

Abstract: In one example, an apparatus is described, which includes an electronic component, a thermal dissipation unit, a thermal interface material disposed between the electronic component and the thermal dissipation unit, and an adhesive sealant applied around the thermal interface material between the electronic component and the thermal dissipation unit.

公开(公告)号：US20190335596A1

公开(公告)日：2019-10-31

申请号：US16504133

申请日：2019-07-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Kevin Voss ,  Terrisa Yeh

IPC: H05K5/02 ,  C03C17/42

Abstract: Various examples provide a method of making a hydrophobic surface for an object. According to the method, a hydrophobic coating may be applied to an original surface of the object. A microstructure may be formed on the original surface of the object. The hydrophobic surface of the object may be obtained with the microstructure submerged by the hydrophobic coating. The microstructure may be a rough structure including micro-sized portions, and may have greater hardness than the hydrophobic coating.