公开(公告)号：US20170278589A1

公开(公告)日：2017-09-28

申请号：US15510865

申请日：2015-11-18

Applicant: HITACHI, LTD.

Inventor： Yusuke YASUDA ,  Toshiaki MORITA ,  Yoshio KOBAYASHI ,  Takafumi MAEDA

IPC: H01B1/22 ,  H01R4/02 ,  B82Y30/00 ,  C01G3/02 ,  H01L21/52

CPC classification number: H01B1/22 ,  B22F1/007 ,  B22F3/1003 ,  B22F9/24 ,  B82Y30/00 ,  C01G3/02 ,  C01P2002/72 ,  C01P2004/62 ,  C01P2004/80 ,  C22C1/05 ,  H01L21/52 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01R4/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided are: a sintering binder including nanoparticles, a method for producing the sintering binder, and a method for bonding using the sintering binder. The sintering binder mainly includes cuprous oxide nanoparticles, combines particle stability with bondability, and less undergoes ion migration. A composite particle including metallic copper with the remainder being cuprous oxide and inevitable impurities is used for bonding typically of metals. The composite particle structurally includes metallic copper dispersed inside the particle and has an average particle size of 1000 nm or less.