公开(公告)号：US20140147661A1

公开(公告)日：2014-05-29

申请号：US14092064

申请日：2013-11-27

Applicant: Hitachi, Ltd.

Inventor： Yusuke YASUDA ,  Toshiaki MORITA ,  Yoshio KOBAYASHI ,  Kazuhiro INOUE ,  Masachika HAMA

IPC: H01B3/12

CPC classification number: H01B3/12 ,  B01J13/0013 ,  B01J13/0034 ,  B01J13/0047 ,  C01F7/34 ,  C01F7/36 ,  C01F7/441 ,  C01P2004/64 ,  Y10T428/257

Abstract: An aluminum salt is dissolved into water as a solvent to prepare an aqueous solution of the aluminum salt. Urea is added to the aqueous solution of the aluminum salt to be dissolved into the solution. The solution is heated to produce a precipitation of aluminum hydroxide. A deflocculant is added to deflocculate the precipitation. Thus, a sol is produced which contains colloidal particles of aluminum hydroxide and crystalline particles of aluminum oxide. An even and dense alumina thin film can be produced by using the sol on a surface of a substrate made of a metal having a low melting point, such as copper or aluminum.

Abstract translation: 将铝盐溶解在水中作为溶剂以制备铝盐的水溶液。 将尿素加入到铝盐的水溶液中以溶解到溶液中。 将溶液加热以产生氢氧化铝沉淀。 添加絮凝剂来絮凝沉淀。 因此，制造含有氢氧化铝的胶体粒子和氧化铝的结晶粒子的溶胶。 通过在由具有低熔点的金属如铜或铝制成的基板的表面上使用溶胶，可以制造均匀且致密的氧化铝薄膜。

公开(公告)号：US20170278589A1

公开(公告)日：2017-09-28

申请号：US15510865

申请日：2015-11-18

Applicant: HITACHI, LTD.

Inventor： Yusuke YASUDA ,  Toshiaki MORITA ,  Yoshio KOBAYASHI ,  Takafumi MAEDA

IPC: H01B1/22 ,  H01R4/02 ,  B82Y30/00 ,  C01G3/02 ,  H01L21/52

CPC classification number: H01B1/22 ,  B22F1/007 ,  B22F3/1003 ,  B22F9/24 ,  B82Y30/00 ,  C01G3/02 ,  C01P2002/72 ,  C01P2004/62 ,  C01P2004/80 ,  C22C1/05 ,  H01L21/52 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01R4/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided are: a sintering binder including nanoparticles, a method for producing the sintering binder, and a method for bonding using the sintering binder. The sintering binder mainly includes cuprous oxide nanoparticles, combines particle stability with bondability, and less undergoes ion migration. A composite particle including metallic copper with the remainder being cuprous oxide and inevitable impurities is used for bonding typically of metals. The composite particle structurally includes metallic copper dispersed inside the particle and has an average particle size of 1000 nm or less.