公开(公告)号：US20130267098A1

公开(公告)日：2013-10-10

申请号：US13864317

申请日：2013-04-17

Applicant: Hitachi High-Technologies Corporation

Inventor： Kenji MAEDA ,  Ken YOSHIOKA ,  Hiromichi KAWASAKI ,  Takahiro SHIMOMURA

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01J37/3211 ,  C23C16/45557 ,  C23C16/505 ,  C23C16/507 ,  C23C16/52 ,  H01J37/321 ,  H01J37/32155 ,  H01J37/32174 ,  H01J37/32183 ,  H01J37/32816 ,  H01L21/02 ,  H01L21/02041 ,  H01L21/02104 ,  H01L21/30 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67069

Abstract: A plasma processing apparatus is offered which has evacuable vacuum vessel, processing chamber disposed inside the vacuum vessel and having inside space in which plasma for processing sample to be processed is generated and in which the sample is placed, unit for supplying gas for plasma generation into processing chamber, vacuum evacuation unit for evacuating inside of processing chamber, helical resonator configured of helical resonance coil disposed outside the vacuum vessel and electrically grounded shield disposed outside the coil, RF power supply of variable frequency for supplying RF electric power in given range to the resonance coil, and frequency matching device capable of adjusting frequency of the RF power supply so as to minimize reflected RF power. The resonance coil has electrical length that is set to integral multiple of one wavelength at given frequency. The helical resonance coil has feeding point connected to ground potential using variable capacitive device.

公开(公告)号：US20150221477A1

公开(公告)日：2015-08-06

申请号：US14603246

申请日：2015-01-22

Applicant: Hitachi High-Technologies Corporation

Inventor： Kenji MAEDA ,  Ken YOSHIOKA ,  Hiromichi KAWASAKI ,  Takahiro SHIMOMURA

IPC: H01J37/32 ,  C23C16/52 ,  H01L21/30 ,  H01L21/67 ,  H01L21/02 ,  C23C16/505 ,  C23C16/455

CPC classification number: H01J37/3211 ,  C23C16/45557 ,  C23C16/505 ,  C23C16/507 ,  C23C16/52 ,  H01J37/321 ,  H01J37/32155 ,  H01J37/32174 ,  H01J37/32183 ,  H01J37/32816 ,  H01L21/02 ,  H01L21/02041 ,  H01L21/02104 ,  H01L21/30 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67069

Abstract: A plasma processing apparatus is offered which has evacuable vacuum vessel, processing chamber disposed inside the vacuum vessel and having inside space in which plasma for processing sample to be processed is generated and in which the sample is placed, unit for supplying gas for plasma generation into processing chamber, vacuum evacuation unit for evacuating inside of processing chamber, helical resonator configured of helical resonance coil disposed outside the vacuum vessel and electrically grounded shield disposed outside the coil, RF power supply of variable frequency for supplying RF electric power in given range to the resonance coil, and frequency matching device capable of adjusting frequency of the RF power supply so as to minimize reflected RF power. The resonance coil has electrical length that is set to integral multiple of one wavelength at given frequency. The helical resonance coil has feeding point connected to ground potential using variable capacitive device.

Abstract translation: 提供了一种等离子体处理装置，其具有可抽真空的真空容器，处理室设置在真空容器的内部，并且具有内部空间，其中产生用于处理待处理样品的等离子体，其中放置样品，用于将等离子体产生的气体供应到 处理室，用于在处理室内抽真空的真空抽气单元，设置在真空容器外部的螺旋谐振线圈构成的螺旋谐振器和设置在线圈外部的电接地屏蔽，RF频率可变频率供给给定范围内的RF电力 谐振线圈和频率匹配装置，其能够调整RF电源的频率，以便使反射的RF功率最小化。 谐振线圈具有设定为给定频率的一个波长的整数倍的电长度。 螺旋谐振线圈使用可变电容器件将馈电点连接到地电位。