公开(公告)号：US20240241554A1

公开(公告)日：2024-07-18

申请号：US18285210

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Xiyong Tian ,  Chunlin Bai ,  Baoci George Sun ,  Li Zhang ,  Chiu Lun Ronald Cheng

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K7/20145

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first heat source, a second heat source, and a fan inside a fan enclosure between the first heat source and the second heat source. The fan enclosure includes a main vent to direct air from the fan towards a heatsink and one or more side vents to direct air from the fan towards the first heat source or the second heat source.

公开(公告)号：US11899502B2

公开(公告)日：2024-02-13

申请号：US17626750

申请日：2019-09-10

Applicant: Intel Corporation

Inventor： Vincent Hung ,  Jeff Ku ,  Andy B. Wang ,  Duck Young Kong ,  Chunlin Bai

IPC: G06F1/16

CPC classification number: G06F1/1656 ,  G06F1/1618 ,  G06F1/1679 ,  G06F1/1686

Abstract: Laptop computers with a movable accessory housing are described herein. An example laptop computer incudes a base, a lid moveably coupled to the base, a display carried by the lid, an arm pivotably coupled to the lid, and an accessory housing carried by the arm. The arm is pivotable to move the accessory housing between a first position in which the accessory housing is disposed along a bottom edge of the lid and a second position in which the accessory housing is disposed along a top edge of the lid.

公开(公告)号：US20250123657A1

公开(公告)日：2025-04-17

申请号：US18694685

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Denica N. Larsen ,  Chunlin Bai ,  Prosenjit Ghosh ,  Surya Pratap Mishra

IPC: G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a chassis, where the chassis includes a first chassis portion and a second chassis portion, a flexible display supported by the chassis, and a hinge. The hinge includes a first chassis attachment housing coupled to the first chassis portion, a first chassis portion lift arm coupled to the first chassis attachment housing, a first hinge pivot coupled to the first chassis portion lift arm, a second chassis attachment housing coupled to the second chassis portion, a second chassis portion lift arm coupled to the second chassis attachment housing, and a second hinge pivot coupled to the second chassis portion lift arm. The first chassis portion lift arm extends to increase a first distance between the first chassis attachment housing and the first hinge pivot and the second chassis portion lift arm extends to increase a second distance between the second chassis attachment housing and the second hinge pivot as the flexible display is bent.

公开(公告)号：US20230127021A1

公开(公告)日：2023-04-27

申请号：US18146311

申请日：2022-12-23

Applicant: Intel Corporation

Inventor： Chunlin Bai ,  Xiyong Tian ,  Baoci Sun

IPC: H05K7/20 ,  G06F1/20

Abstract: Techniques for fan mechanisms with adjustable side vents are disclosed. In one embodiment, a fan housing has several side vents that can direct airflow to components around the fan housing. Vent covers can block the vents, directing the airflow to the primary vent and the heatsink for the processor and other components. When the speed of a fan in the fan housing is increased, the vent covers open, directing airflow to components around the fan housing. In another embodiment, several vent channels are defined in the vent housing. A motor connected to a vent barrier can move the vent barrier to block or unblock the vent channels, allowing for control of airflow. In another embodiment, a fan channel module with one or more vent channels can be attached to the fan housing, allowing for a flexible array of airflow patterns for the same fan housing.

公开(公告)号：US20230093901A1

公开(公告)日：2023-03-30

申请号：US18071317

申请日：2022-11-29

Applicant: Intel Corporation

Inventor： Tsung-Hsing Hsu ,  Chunlin Bai ,  Surya Pratap Mishra ,  Jordan Maslov ,  Prosenjit Ghosh ,  James M. Yoder

IPC: G06F1/16

Abstract: Methods, apparatus, systems, and articles of manufacture related to foldable electronic devices are disclosed herein. An example apparatus disclosed herein includes a gear set, a first pair of rotational arms coupled to the gear set, and a first guide set carried by the first pair of rotational arms and couplable to a display of the electronic device, the first guide set having a first guide on a first side of the gear set and a second guide on a second side of the gear set, the second side opposite the first side, wherein the gear set is to rotate the first pair of rotational arms to move the electronic device between an opened orientation and a closed orientation, the first pair of rotational arms to bring the first guide of the first guide set into proximity with the second guide of the first guide set in the closed orientation to cause the display to have a waterdrop cross-sectional shape in the closed orientation.

公开(公告)号：US20230409088A1

公开(公告)日：2023-12-21

申请号：US18242978

申请日：2023-09-06

Applicant: Intel Corporation

Inventor： Chunlin Bai ,  Binglin Xu ,  Guangrui Liang

IPC: G06F1/16 ,  H05K5/02

CPC classification number: G06F1/166 ,  G06F1/1675 ,  H05K5/0226

Abstract: The present disclosure is directed at automatically opening hinged components of computing devices. One of the computing devices and a hinged component may include an electrical winding or coil while the other may include a magnet. When current is applied to the electrical winding (e.g., in a direction opposite of the North/South direction of the magnets' magnetic field), the electrical winding may generate a magnetic field opposite that repels the magnet's magnetic field. The magnetic repulsion may cause the hinged component to separate from the rest of the computing device, thereby opening the hinged component. When the current is removed from the electrical winding, the electrical winding may no longer generate a magnetic field, enabling the hinged component to be closed.

公开(公告)号：USD941333S1

公开(公告)日：2022-01-18

申请号：US29748021

申请日：2020-08-26

Applicant: Intel Corporation

Designer： Chunlin Bai ,  Celia H. Yang ,  Yiming He ,  Lunkai Zou ,  Maojun Li

公开(公告)号：US20180329462A1

公开(公告)日：2018-11-15

申请号：US15776916

申请日：2015-12-26

Applicant: INTEL CORPORATION

Inventor： Denica N. Larsen ,  Chunlin Bai ,  Prosenjit Ghosh

IPC: G06F1/16

CPC classification number: G06F1/1681

Abstract: An apparatus including a hinge assembly is described herein. The hinge assembly including a plurality of substantially parallel hinges, each said hinge of the plurality being attached to at least one adjacent said hinge, wherein a first outermost hinge is coupled to a first housing and a second outermost hinge is coupled to a second housing, each said hinge of the plurality to provide a respective range of rotation to the hinge assembly such that the first and second housings may be rotated relative to each other about the hinge assembly within a range of approximately between 0 degrees and 360 degrees.

公开(公告)号：US11789499B2

公开(公告)日：2023-10-17

申请号：US17057038

申请日：2018-12-18

Applicant: Intel Corporation

Inventor： Chunlin Bai ,  Binglin Xu ,  Guangrui Liang

IPC: G06F1/16 ,  H05K5/02

CPC classification number: G06F1/166 ,  G06F1/1675 ,  H05K5/0226

Abstract: The present disclosure is directed at automatically opening hinged components of computing devices. One of the computing device and a hinged component may include an electrical winding or coil while the other may include a magnet. When current is applied to the electrical winding (e.g., in a direction opposite of the North/South direction of the magnets' magnetic field), the electrical winding may generate a magnetic field opposite that repels the magnet's magnetic field. The magnetic repulsion may cause the hinged component to separate from the rest of the computing device, thereby opening the hinged component. When the current is removed from the electrical winding, the electrical winding may no longer generate a magnetic field, enabling the hinged component to be closed.

公开(公告)号：US20230207424A1

公开(公告)日：2023-06-29

申请号：US18145231

申请日：2022-12-22

Applicant: Intel Corporation

Inventor： Linghe Sui ,  Jun Liu ,  Jiancheng Tao ,  Tao Wang ,  Chunlin Bai ,  Hongjun She ,  Dengfeng Huang

IPC: H01L23/427 ,  H01L25/18

CPC classification number: H01L23/427 ,  H01L25/18

Abstract: A vapor chamber architecture for multiple cavity/heat source system designs. The vapor chamber architecture can be customized in dimensions to cool two or more spatially separated, and potentially heterogeneous, heat sources in a system floor plan. The vapor chamber architecture can additionally be customized to concurrently manage the cooling requirements for the two or more heat sources that have different power consumptions and sizes. The provided vapor chamber architecture can be manufactured using etching processes, additive manufacturing processes, or the like.