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公开(公告)号:US20180287773A1
公开(公告)日:2018-10-04
申请号:US15475827
申请日:2017-03-31
Applicant: INTEL CORPORATION
Inventor: TELESPHOR KAMGAING , GEORGIOS C. DOGIAMIS , SASHA N. OSTER
IPC: H04L7/00 , H04L7/033 , H04B10/61 , H04B10/548
CPC classification number: H04L7/0075 , H04B10/548 , H04B10/6165 , H04B10/90 , H04L7/0331
Abstract: The present disclosure is directed to systems and methods for communicating between rack mounted devices disposed in the same or different racks separated by distances of less than a meter to a few tens of meters. The system includes a CMOS first mm-wave engine that includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. The CMOS first mm-wave engine communicably couples to a CMOS second mm-wave engine that also includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. In some implementations, at least a portion of the mm-wave transceiver circuitry may be fabricated using III-V semiconductor manufacturing methods. The use of mm-wave communication techniques beneficially improves data integrity and increases achievable datarates, and reduces power costs.
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公开(公告)号:US20180090848A1
公开(公告)日:2018-03-29
申请号:US15277504
申请日:2016-09-27
Applicant: INTEL CORPORATION
Inventor: ADEL A. ELSHERBINI , SASHA N. OSTER , JOHANNA M. SWAN , GEORGIOS C. DOGIAMIS , SHAWNA M. LIFF , ALEKSANDAR ALEKSOV , TELESPHOR KAMGAING
Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.
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公开(公告)号:US20200098710A1
公开(公告)日:2020-03-26
申请号:US16465545
申请日:2016-12-30
Applicant: Intel Corporation
Inventor: VIYAY K. NAIR , SASHA N. OSTER , JOHANNA M. SWAN , TELESPHOR KAMGAING , GEORGIOS C. DOGIAMIS , ADEL A. ELSHERBINI
IPC: H01L23/66 , H01L23/538 , H01P3/16
Abstract: Waveguides disposed in either an interposer layer or directly in the semiconductor package substrate may be used to transfer signals between semiconductor dies coupled to the semiconductor package. For example, inter-semiconductor die communications using mm-wave carrier signals launched into waveguides specifically tuned to optimize transmission parameters of such signals. The use of such high frequencies beneficially provides for reliable transmission of modulated high data rate signals with lower losses than conductive traces and less cross-talk. The use of mm-wave waveguides provides higher data transfer rates per bump for bump-limited dies as well as beneficially providing improved signal integrity even at such higher data transfer rates. Such mm-wave waveguides may be built directly into semiconductor package layers or may be incorporated into one or more interposed layers that are physically and communicably coupled between the semiconductor dies and the semiconductor package substrate.
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公开(公告)号:US20180005496A1
公开(公告)日:2018-01-04
申请号:US15201205
申请日:2016-07-01
Applicant: Intel Corporation
Inventor: GEORGIOS C. DOGIAMIS , RAJASHREE BASKARAN
Abstract: A wearable electronic device includes a displaceable member communicably coupled to a haptic control circuit. The haptic control circuit is communicably coupled to a configurable haptic output device. A user input, received at the displaceable member generates an input signal that includes information and/or data indicative of at least one displacement parameter associated with the displacement of the displaceable member. The input signal is communicated to the haptic control circuit. The haptic control circuit determines a haptic output parameter that corresponds to the received displacement parameter.
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