公开(公告)号：US20220407202A1

公开(公告)日：2022-12-22

申请号：US17350791

申请日：2021-06-17

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Veronica STRONG ,  Aleksandar ALEKSOV

IPC: H01P3/00 ,  H01L23/15 ,  H01L23/498 ,  H01L23/66

Abstract: Embodiments disclosed herein include coplanar waveguides and methods of forming coplanar waveguides. In an embodiment, a coplanar waveguide comprises a core, and a signal trace on the core. In an embodiment, the signal trace has a first edge and a second edge. In an embodiment, a first ground trace is over the core, and the first ground trace is adjacent to the first edge of the signal trace. In an embodiment, a first ground via plane is below the first ground trace. The coplanar waveguide may further comprise a second ground trace over the core, and the second ground trace is adjacent to the second edge of the signal trace. In an embodiment, a second ground via plane below the second ground trace.

公开(公告)号：US20220406696A1

公开(公告)日：2022-12-22

申请号：US17349697

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Telesphor KAMGAING ,  Veronica STRONG ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H01L23/00

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment the package substrate comprises a core and buildup layers on the core. In an embodiment, first level interconnect (FLI) pads are on a topmost buildup layer, and the FLI pads have a pitch. In an embodiment, a plurality of vertically oriented planes are embedded in the core, and the vertically oriented planes are spaced at the pitch.

公开(公告)号：US20210194966A1

公开(公告)日：2021-06-24

申请号：US16757751

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Erich N. EWY ,  Johanna M. SWAN ,  Telesphor KAMGAING

IPC: H04L29/08 ,  H01P3/08 ,  H04L5/14 ,  G08C23/06 ,  H04B1/3822 ,  B60R16/023 ,  B60R16/03

Abstract: Embodiments include a sensor node, an active sensor node, and a vehicle with a communication system that includes sensor nodes. The sensor node include a package substrate, a diplexer/combiner block on the package substrate, a transceiver communicatively coupled to the diplexer/combiner block, and a first mm-wave launcher coupled to the diplexer/combiner block. The sensor node may have a sensor communicatively coupled to the transceiver, the sensor is communicatively coupled to the transceiver by an electrical cable and located on the package substrate. The sensor node may include that the sensor operates at a frequency band for communicating with an electronic control unit (ECU) communicatively coupled to the sensor node. The sensor node may have a filter communicatively coupled to the diplexer/combiner block, the transceiver communicatively coupled to the filter, the filter substantially removes frequencies from RF signals other than the frequency band of the sensor.

公开(公告)号：US20200312796A1

公开(公告)日：2020-10-01

申请号：US16651939

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Henning BRAUNISCH ,  Feras EID ,  Georgios C. DOGIAMIS

IPC: H01L23/64 ,  H01L23/367 ,  H01L23/498 ,  H01L49/02 ,  H01L21/48

Abstract: An inductor in a device package and a method of forming the inductor in the device package are described. The inductor includes a first conductive layer disposed on a substrate. The inductor also has one or more hybrid magnetic additively manufactured (HMAM) layers disposed over and around the first conductive layer to form one or more via openings over the first conductive layer. The inductor further includes one or more vias disposed into the one or more via openings, wherein the one or more vias are only disposed on the portions of the exposed first conductive layer. The inductor has a dielectric layer disposed over and around the one or more vias, the HMAM layers, and the substrate. The inductor also has a second conductive layer disposed over the one or more vias and the dielectric layer.

公开(公告)号：US20200287520A1

公开(公告)日：2020-09-10

申请号：US16648639

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Feras EID ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC: H03H9/54 ,  H03H9/13 ,  H03H9/56 ,  H03H9/05

Abstract: Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter includes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

公开(公告)号：US20200259478A1

公开(公告)日：2020-08-13

申请号：US16648115

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Feras EID ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/13 ,  H03H9/54 ,  H03H9/52

Abstract: Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.

公开(公告)号：US20200075491A1

公开(公告)日：2020-03-05

申请号：US16611841

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Feras EID ,  Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Johanna M. SWAN

IPC: H01L23/538 ,  H01L23/64 ,  H01G7/06 ,  H01L27/01

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a tunable ferroelectric capacitor formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. The tunable ferroelectric capacitor (e.g., varactor) includes first and second conductive electrodes and a ferroelectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：US20190141456A1

公开(公告)日：2019-05-09

申请号：US16096568

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Feras EID ,  Adel A. ELSHERBINI ,  Johanna SWAN ,  Shawna M. LIFF ,  Thomas L. SOUNART ,  Sasha N. OSTER

IPC: H04R17/00 ,  B06B1/06

CPC classification number: H04R17/005 ,  B06B1/0622 ,  B06B1/0625 ,  B06B1/0644 ,  H04R2201/028

Abstract: Embodiments of the invention include an acoustic transducer device having a base structure that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. In one example, for a transmit mode, a voltage signal is applied between the first and second electrodes and this causes a stress in the piezoelectric material which causes a stack that is formed with the first electrode, the piezoelectric material, and the second electrode to vibrate and hence the base structure to vibrate and generate acoustic waves.

公开(公告)号：US20180331051A1

公开(公告)日：2018-11-15

申请号：US15776021

申请日：2015-12-22

Applicant: Georgios C. DOGLAMIS ,  Telesphor KAMGAING ,  Eric J. LI ,  Javier A. FALCON ,  INTEL CORPORATION

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Eric J. LI, Sr. ,  Javier A. FALCON ,  Yoshihiro TOMITA ,  Vijay K. NAIR ,  Shawna M. LIFF

IPC: H01L23/66 ,  H01L23/552 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180003677A1

公开(公告)日：2018-01-04

申请号：US15199901

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Adel A. ELSHERBINI ,  Johanna M. SWAN ,  Shawna M. LIFF

IPC: G01N29/02 ,  B81B3/00 ,  G01N33/00 ,  G01N33/543 ,  G01N33/22 ,  G01N29/036

CPC classification number: G01N29/022 ,  B81B3/0021 ,  B81B2201/0214 ,  G01N29/036 ,  G01N29/2437 ,  G01N33/0047 ,  G01N33/227 ,  G01N33/54373 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0423

Abstract: Embodiments of the invention include a chemical species-sensitive device that includes an input transducer to receive input signals, a base structure that is coupled to the input transducer and positioned in proximity to a cavity of an organic substrate, a chemically sensitive functionalization material attached to the base structure, and an output transducer to generate output signals. For a chemical sensing functionality, a desired chemical species attaches to the chemically sensitive functionalization material which causes a change in mass of the base structure and this change in mass causes a change in a mechanical resonant frequency of the chemical species-sensitive device.