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公开(公告)号：US20190140106A1
公开(公告)日：2019-05-09
申请号：US15913897
申请日：2018-03-06
Inventor： Tai-Jui Wang , Yung-Hui Yeh , Jui-Wen Yang , Hsiao-Chiang Yao , Chun-Hung Chu
IPC: H01L29/786 , H01L29/66 , H01L29/49 , H01L27/12 , H01L21/02 , C23C16/24 , C23C16/34 , C23C16/40 , H01L51/05
Abstract: A thin film transistor including a flexible substrate, a semiconductor layer, a first gate, and a first gate dielectric layer is provided. The semiconductor layer is located on the flexible substrate. The first gate is located on the flexible substrate and corresponds to a portion of the semiconductor layer. The first gate dielectric layer is located between the first gate and the semiconductor layer. The first gate dielectric layer is in contact with the semiconductor layer, and the hydrogen atom concentration of the first gate dielectric layer is less than 6.5×1020 atoms/cm3. A method of manufacturing the thin film transistor is also provided.
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公开(公告)号：US10165688B2
公开(公告)日：2018-12-25
申请号：US15137007
申请日：2016-04-25
Applicant: Industrial Technology Research Institute
Inventor： Sheng-Po Wang , Heng-Yin Chen , Cheng-Chung Lee , Jia-Chong Ho , Yung-Hui Yeh , Tai-Jui Wang
Abstract: A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.
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公开(公告)号：US20170118853A1
公开(公告)日：2017-04-27
申请号：US15099611
申请日：2016-04-15
Applicant: Industrial Technology Research Institute
Inventor： Chien-Ju Lee , Yung-Hui Yeh
CPC classification number: G06F1/1616 , G06F1/1652 , G09F9/301 , H04M1/0216 , H04M1/0237 , H04M1/0247 , H04M1/0268
Abstract: A foldable body is adapted to be connected between two neighboring ones of a plurality of supporting units, such that the two neighboring supporting units are moved relative to each other to flatten or bend a flexible display panel mounted on a supporting surface of each of the supporting units. The foldable body includes a main track and a main shaft. The main track is fixedly connected to one of the two neighboring supporting units. The main shaft is fixedly connected to the other of the two neighboring supporting units and is coupled to the main track to be translated and rotated in the main track. The two neighboring supporting units are connected by the foldable body, such that the supporting units are moved, such as being translated, rotated, or both, relative to each other, to bend at least a portion of the flexible display panel.
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公开(公告)号：US20170020002A1
公开(公告)日：2017-01-19
申请号：US15137007
申请日：2016-04-25
Applicant: Industrial Technology Research Institute
Inventor： Sheng-Po Wang , Heng-Yin Chen , Cheng-Chung Lee , Jia-Chong Ho , Yung-Hui Yeh , Tai-Jui Wang
CPC classification number: H05K1/189 , H01L23/49827 , H01L23/5385 , H05K1/144 , H05K3/007 , H05K3/429 , H05K3/4644 , H05K3/4682 , H05K2201/10128
Abstract: A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.
Abstract translation: 提供了包括第一柔性基板，电子部件和控制装置的柔性电子装置。 电子部件包括导电层。 控制装置包括至少一个集成电路和电路层组。 电路层组包括多个电路层和至少一个第一电介质层，并且第一电介质层的至少一部分插入在两个相邻的电路层之间。 集成电路通过电路层组和导电层电连接到电子部件。 导电层的至少一部分和一个电路层的至少一部分被一体地形成，并且导电层和电路层均设置在第一柔性基板上。 还提供了一种柔性电子装置的制造方法。
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公开(公告)号：US20140312343A1
公开(公告)日：2014-10-23
申请号：US14287077
申请日：2014-05-26
Applicant: Industrial Technology Research Institute
Inventor： Yung-Hui Yeh , Chih-Ming Lai
IPC: H01L29/786 , H01L29/66
CPC classification number: H01L29/7869 , H01L27/1225 , H01L27/1248 , H01L29/66969
Abstract: A method for manufacturing a semiconductor device includes forming a metal oxide semiconductor layer and a first insulating layer on a substrate. A gate is formed on the first insulating layer. The first insulating layer is patterned by using the gate as an etching mask so as to expose the metal oxide semiconductor layer to serve as a source region and a drain region. A dielectric layer is formed on the substrate to cover the gate and the oxide semiconductor layer, where the dielectric layer has at least one of hydrogen group and hydroxyl group. A heating treatment is performed so that the at least one of hydrogen group and hydroxyl group reacts with the source region and the drain region. A source electrode and a drain electrode electrically connected to the source region and the drain region respectively are formed on the dielectric layer.
Abstract translation: 一种制造半导体器件的方法包括在衬底上形成金属氧化物半导体层和第一绝缘层。 在第一绝缘层上形成栅极。 通过使用栅极作为蚀刻掩模来对第一绝缘层进行构图，以使金属氧化物半导体层暴露于源极区和漏极区。 在基板上形成介电层以覆盖栅极和氧化物半导体层，其中电介质层具有氢基和羟基中的至少一个。 进行加热处理，使得氢基和羟基中的至少一个与源极区和漏极区反应。 在电介质层上分别形成与源极区域和漏极区域电连接的源极电极和漏极电极。
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Patent Agency Ranking
公开(公告)号：US10964912B2
公开(公告)日：2021-03-30
申请号：US16379815
申请日：2019-04-10
Inventor： Yung-Hui Yeh , Jui-Chang Chuang , Li-Ching Wang , Cheng-Yueh Chang , Chyi-Ming Leu , Shih-Ming Chen
Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.
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公开(公告)号：US10168733B2
公开(公告)日：2019-01-01
申请号：US15099611
申请日：2016-04-15
Applicant: Industrial Technology Research Institute
Inventor： Chien-Ju Lee , Yung-Hui Yeh
Abstract: A foldable body is adapted to be connected between two neighboring ones of a plurality of supporting units, such that the two neighboring supporting units are moved relative to each other to flatten or bend a flexible display panel mounted on a supporting surface of each of the supporting units. The foldable body includes a main track and a main shaft. The main track is fixedly connected to one of the two neighboring supporting units. The main shaft is fixedly connected to the other of the two neighboring supporting units and is coupled to the main track to be translated and rotated in the main track. The two neighboring supporting units are connected by the foldable body, such that the supporting units are moved, such as being translated, rotated, or both, relative to each other, to bend at least a portion of the flexible display panel.
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8.发明授权Driver circuit with device variation compensation and operation method thereof 有权具有器件变动补偿的驱动电路及其运算方法公开(公告)号：US09543954B2
公开(公告)日：2017-01-10
申请号：US14592910
申请日：2015-01-09
Applicant: Industrial Technology Research Institute
Inventor： Chi-Liang Wu , Ya-Hsiang Tai , Yung-Hui Yeh , Zong-Hua Cai
IPC: H03K3/00 , H03K19/0185
CPC classification number: H03K19/018507 , H03K19/00384
Abstract: A driver circuit with device variation compensation function and an operation method thereof are provided. The driver circuit includes a pull-up switch unit, an isolating switch and a pull-down switch unit. A first terminal of the pull-up switch unit is coupled to a first voltage. A second terminal of the pull-up switch unit is coupled to an output terminal of the driver circuit. A first terminal of the isolating switch is coupled to the second terminal of the pull-up switch unit. A first terminal of the pull-down switch unit is coupled to a second terminal of the isolating switch. A second terminal of the pull-down switch unit is coupled to a second voltage. The pull-down switch unit has a device variation compensation function.
Abstract translation: 提供一种具有装置变动补偿功能的驱动电路及其操作方法。 驱动电路包括上拉开关单元，隔离开关和下拉开关单元。 上拉开关单元的第一端子耦合到第一电压。 上拉开关单元的第二端子耦合到驱动器电路的输出端子。 隔离开关的第一端子耦合到上拉开关单元的第二端子。 下拉开关单元的第一端子耦合到隔离开关的第二端子。 下拉开关单元的第二端子耦合到第二电压。 下拉开关单元具有器件变化补偿功能。
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公开(公告)号：US09408300B2
公开(公告)日：2016-08-02
申请号：US14620214
申请日：2015-02-12
Applicant: Industrial Technology Research Institute
Inventor： Cheng-Che Wu , Chen-Chu Tsai , Chien-Jung Huang , Yung-Hui Yeh , Heng-Yin Chen
CPC classification number: H05K1/028 , H05K1/0281 , H05K3/0032 , H05K3/007 , H05K2201/0145 , H05K2201/0154 , H05K2201/10106 , H05K2201/10128 , H05K2201/2009 , H05K2203/1178
Abstract: According to embodiments of the disclosure, a flexible device and a fabrication method thereof are provided. The flexible device has a first area and a second area, and the stiffness of a portion of the first area is greater than the stiffness of the second area. The flexible device may include a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other. The second surface has a coarse structure. The surface roughness of the second surface is greater in the first area than in the second area. The rigid element is disposed on the first surface of the flexible substrate and located in the first area. The stiffness of the rigid element is greater than the stiffness of the flexible substrate. A projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.
Abstract translation: 根据本公开的实施例，提供了柔性装置及其制造方法。 柔性装置具有第一区域和第二区域，并且第一区域的一部分的刚度大于第二区域的刚度。 柔性装置可以包括柔性基底和刚性元件。 柔性基板包括彼此相对的第一表面和第二表面。 第二表面具有粗糙的结构。 在第一区域中第二表面的表面粗糙度大于第二区域中的表面粗糙度。 刚性元件设置在柔性基板的第一表面上并且位于第一区域中。 刚性元件的刚度大于柔性基板的刚度。 柔性基板上的粗糙结构的投影区域与刚性元件的区域重叠。
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公开(公告)号：US20200052243A1
公开(公告)日：2020-02-13
申请号：US16379815
申请日：2019-04-10
Inventor： Yung-Hui Yeh , Jui-Chang Chuang , Li-Ching Wang , Cheng-Yueh Chang , Chyi-Ming Leu , Shih-Ming Chen
Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.
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