公开(公告)号：US20170234822A1

公开(公告)日：2017-08-17

申请号：US15043701

申请日：2016-02-15

申请人： Infineon Technologies AG

发明人： Guenther RUHL ,  Thomas HIRSCH ,  Gerhard POEPPEL ,  Herbert ROEDIG

IPC分类号： G01N27/22 ,  G01N15/10

CPC分类号： G01N27/221 ,  G01N1/2214 ,  G01N15/0606 ,  G01N15/10 ,  G01N2001/4088 ,  G01N2015/1087 ,  G01N2015/1093 ,  G01N2027/222

摘要： According to various embodiments, a sensor arrangement for particle analysis may include: a base electrode configured to generate an electrical field for particle attraction; a support layer disposed over the base electrode; a sensor array disposed over the support layer and including or formed from a plurality of sensor elements, wherein each sensor element of the plurality of sensor elements is configured to generate or modify an electrical signal in response to a particle at least one of adsorbed to and approaching the sensor element; and an electrical contact structure may include or be formed from a plurality of contact lines, wherein each contact line of the plurality of contact lines is electrically connected to a respective sensor element of the plurality of sensor elements, such that each sensor element of the plurality of sensor elements is addressable via the contact structure.

公开(公告)号：US20160336226A1

公开(公告)日：2016-11-17

申请号：US15151857

申请日：2016-05-11

申请人： Infineon Technologies AG

发明人： Edward FUERGUT ,  Irmgard ESCHER-POEPPEL ,  Stephanie FASSL ,  Paul GANITZER ,  Gerhard POEPPEL ,  Werner SCHUSTEREDER ,  Harald WIEDENHOFER

IPC分类号： H01L21/768 ,  H01L21/324 ,  H01L21/321 ,  H01L21/268 ,  H01L23/528 ,  H01L23/31

CPC分类号： H01L21/324 ,  H01L21/0455 ,  H01L21/0485 ,  H01L21/2254 ,  H01L21/2258 ,  H01L21/268 ,  H01L21/28512 ,  H01L21/28575 ,  H01L23/3157

摘要： Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.

摘要翻译： 各种实施例提供了一种减少至少部分地封装在封装材料中的电子器件中的薄层电阻的方法，其中所述方法包括：提供包括多层结构并且被封装材料至少部分封装的电子器件; 并且将能量局部地引入到多层结构中以降低薄层电阻。