公开(公告)号：US20230145304A1

公开(公告)日：2023-05-11

申请号：US17749016

申请日：2022-05-19

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Chun-Hung LAI ,  Chun-Chin FAN

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L23/49822 ,  H01L24/13 ,  H01L21/4857 ,  H01L21/4853 ,  H01L2224/13021 ,  H01L2224/13144 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13176 ,  H01L2224/13124 ,  H01L2224/13157 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/1318 ,  H01L2224/13149 ,  H01L2224/13118 ,  H01L2224/13578 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/1369 ,  H01L24/16 ,  H01L2224/16238 ,  H01L2224/1182 ,  H01L24/11 ,  H01L2221/68345 ,  H01L21/6835

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; and a second insulating layer disposed on the first metal bump, wherein the second insulating layer includes a first opening exposing a portion of the first metal bump, wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.

公开(公告)号：US20230038309A1

公开(公告)日：2023-02-09

申请号：US17736112

申请日：2022-05-04

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Chun-Hung LAI ,  Yeong-E CHEN ,  Chuan-Ming YEH ,  Ching-Wei CHEN

IPC: H05K1/02

Abstract: A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.