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公开(公告)号：US20220246791A1
公开(公告)日：2022-08-04
申请号：US17725741
申请日：2022-04-21
Applicant: InnoLux Corporation
Inventor： Kai CHENG , Tsau-Hua HSIEH , Fang-Ying LIN , Tung-Kai LIU , Hui-Chieh WANG , Chun-Hsien LIN , Jui-Feng KO
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
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公开(公告)号：US20240250219A1
公开(公告)日：2024-07-25
申请号：US18403510
申请日：2024-01-03
Applicant: InnoLux Corporation
Inventor： Kai CHENG , Fang-Ying LIN , Ming-Chang LIN , Tsau-Hua HSIEH
IPC: H01L33/48 , H01L25/075 , H01L25/16
CPC classification number: H01L33/486 , H01L25/0753 , H01L25/167
Abstract: A manufacturing method of an electronic device includes: providing a first substrate, which has a base layer and a plurality of electronic components disposed on the base layer; adhering adhesive material to each of the plurality of electronic components; providing a target substrate, wherein the target substrate and the first substrate are separated from each other by a distance; and transferring at least part of the plurality of electronic components adhered with the adhesive material to the target substrate through a laser process, wherein at least part of the plurality of electronic components are attached to the target substrate via the adhesive material.
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公开(公告)号：US20190044023A1
公开(公告)日：2019-02-07
申请号：US16002156
申请日：2018-06-07
Applicant: InnoLux Corporation
Inventor： Kai CHENG , Tsau-Hua HSIEH , Fang-Ying LIN , Tung-Kai LIU , Hui-Chieh WANG , Chun-Hsien LIN , Jui-Feng KO
IPC: H01L33/00 , H01L33/62 , H01L25/075
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
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公开(公告)号：US20240266331A1
公开(公告)日：2024-08-08
申请号：US18618008
申请日：2024-03-27
Applicant: InnoLux Corporation
Inventor： Tung-Kai LIU , Tsau-Hua HSIEH , Fang-Ying LIN , Kai CHENG , Hui-Chieh WANG , Shun-Yuan HU
IPC: H01L25/075 , H01L23/00 , H01L33/00 , H01L33/50 , H01L33/62
CPC classification number: H01L25/0753 , H01L24/00 , H01L33/0095 , H01L33/505 , H01L33/62 , H01L2933/0041 , H01L2933/0066
Abstract: Methods for manufacturing an electronic device and a transfer device are provided. The method for manufacturing the electronic device includes the following steps. A plurality of elements are provided, wherein each of the elements includes a first bonding pad. A substrate including a plurality of second bonding pads is provided. The plurality of elements are transferred to a transfer head. A portion of the elements is selectively transferred to the substrate, wherein the step of selectively transferring includes projecting a laser-light onto the portion of the elements so that the first bonding pad of the portion of the elements is bonded to at least one of the second bonding pads on the substrate.
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Patent Agency Ranking
公开(公告)号：US20210384174A1
公开(公告)日：2021-12-09
申请号：US17410445
申请日：2021-08-24
Applicant: InnoLux Corporation
Inventor： Tung-Kai LIU , Tsau-Hua HSIEH , Fang-Ying LIN , Kai CHENG , Hui-Chieh WANG , Shun-Yuan HU
IPC: H01L25/075 , H01L33/62 , H01L33/50 , H01L23/00 , H01L33/00
Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ≦ ∫ T 1 T 2 A ( T ) dT - ∫ T 1 T 3 E ( T ) dT
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公开(公告)号：US20200259044A1
公开(公告)日：2020-08-13
申请号：US16858826
申请日：2020-04-27
Applicant: InnoLux Corporation
Inventor： Kai CHENG , Tsau-Hua HSIEH , Fang-Ying LIN , Tung-Kai LIU , Hui-Chieh WANG , Chun-Hsien LIN , Jui-Feng KO
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
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公开(公告)号：US20200258870A1
公开(公告)日：2020-08-13
申请号：US16862896
申请日：2020-04-30
Applicant: InnoLux Corporation
Inventor： Tung-Kai LIU , Tsau-Hua HSIEH , Fang-Ying LIN , Kai CHENG , Hui-Chieh WANG , Shun-Yuan HU
IPC: H01L25/075 , H01L33/62 , H01L33/50 , H01L23/00 , H01L33/00
Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: Q≤|∫T1T2A(T)dT−∫T1T3E(T)dT|
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公开(公告)号：US20220246790A1
公开(公告)日：2022-08-04
申请号：US17725732
申请日：2022-04-21
Applicant: InnoLux Corporation
Inventor： Kai CHENG , Tsau-Hua HSIEH , Fang-Ying LIN , Tung-Kai LIU , Hui-Chieh WANG , Chun-Hsien LIN , Jui-Feng KO
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.
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公开(公告)号：US20190043843A1
公开(公告)日：2019-02-07
申请号：US16028764
申请日：2018-07-06
Applicant: InnoLux Corporation
Inventor： Tung-Kai LIU , Tsau-Hua HSIEH , Fang-Ying LIN , Kai CHENG , Hui-Chieh WANG , Shun-Yuan HU
IPC: H01L25/075 , H01L33/62 , H01L33/50
Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0≤|∫T1T2A(T)dT−∫T1T3E(T)dT|
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