公开(公告)号：US20220150006A1

公开(公告)日：2022-05-12

申请号：US17093679

申请日：2020-11-10

Applicant: Intel Corporation

Inventor： Michael SHUSTERMAN ,  John FALLIN ,  Ana M. YEPES ,  Dong-Ho HAN ,  Nasser A. KURD ,  Tomer LEVY ,  Ehud RESHEF ,  Arik GIHON ,  Ido OUZIELI ,  Yevgeni SABIN ,  Maor TAL ,  Zhongsheng WANG ,  Amit ZEEVI

IPC: H04L5/00 ,  H04W72/04

Abstract: A wireless communication device for communicating across a wireless communication channel includes one or more processors configured to determine whether a further device is generating a radio frequency interference at an operating frequency; transmit a request message to the further device requesting the further device vacate the operating frequency based on the determination that the further device is generating radio frequency interference; receive a response message from the further device; and generate an instruction based on the response message.

公开(公告)号：US20180005947A1

公开(公告)日：2018-01-04

申请号：US15201337

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Vijay KASTURI ,  Ana M. YEPES ,  Chung-Hao CHEN ,  Bradley A. JACKSON

IPC: H01L23/538 ,  H01L23/15 ,  H01L21/48

CPC classification number: H01L23/5385 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/5387 ,  H01L2224/16225

Abstract: Techniques and mechanisms for interconnecting circuitry disposed on a transparent substrate. In an embodiment, a multilayer circuit is bonded to the transparent substrate, the multilayer circuit including conductive traces that are variously offset at different respective levels from a side of the transparent substrate. Circuit components, such as packaged or unpackaged integrated circuit devices, are coupled each to respective input and/or output (IO) contacts of the multilayer circuit, where the conductive traces and the IO contacts interconnect the circuit components with each other. In another embodiment, the multilayer circuit is a flexible circuit that is bent to interconnect circuit components which are disposed on opposite respective sides of the transparent substrate.