公开(公告)号：US20190200450A1

公开(公告)日：2019-06-27

申请号：US16328412

申请日：2017-09-19

Applicant: Intel Corporation

Inventor： Richard I. MELLITZ ,  Brandon GORE ,  Beom-Taek LEE

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H01R12/71

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01R12/716 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: Methods and apparatus for utilizing flexible (flex) circuit technology and/or axial cable to facilitate routing of high-speed data channels are described herein. Under one aspect, a high-speed data channel if routed between an integrated circuit (IC) and a high-speed data connector mounted to a multilayer printed circuit board as part of a circuit assembly. The circuit assembly includes a signal pathway providing a high-speed data channel from the integrated circuit to the high-speed data connector, wherein a portion of the signal pathway includes a flex circuit or axial cable.

公开(公告)号：US20210289617A1

公开(公告)日：2021-09-16

申请号：US17333723

申请日：2021-05-28

Applicant: Intel Corporation

Inventor： Richard I. MELLITZ ,  Brandon GORE ,  Beom-Taek LEE

IPC: H05K1/02 ,  H01R12/71 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: Methods and apparatus to facilitate routing of high-speed data channels are described herein. Under one aspect, a high-speed data channel is routed between an integrated circuit (IC) and a high-speed data connector mounted to a multilayer printed circuit board as part of a circuit assembly. The circuit assembly includes a signal pathway providing a high-speed data channel from the integrated circuit to the high-speed data connector, wherein a portion of the signal pathway includes an axial cable, such as a twin axial cable. The high-speed data channel may comprise a multi-lane data channel and may be bi-directional.