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公开(公告)号：US09686888B2
公开(公告)日：2017-06-20
申请号：US14856836
申请日：2015-09-17
Applicant: Intel Corporation
Inventor： David W. Song , Je-Young Chang
IPC: H05K7/20 , H01L23/473 , H05K1/02 , H01L23/427
CPC classification number: H05K7/20272 , H01L23/427 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H05K1/0209 , H05K7/20218 , H05K7/2039 , H05K2201/066 , Y10T29/4913
Abstract: A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.
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公开(公告)号：US20160007499A1
公开(公告)日：2016-01-07
申请号：US14856836
申请日：2015-09-17
Applicant: Intel Corporation
Inventor： David W. Song , Je-Young Chang
IPC: H05K7/20
CPC classification number: H05K7/20272 , H01L23/427 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H05K1/0209 , H05K7/20218 , H05K7/2039 , H05K2201/066 , Y10T29/4913
Abstract: A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.
Abstract translation: 一种散热盖，其包括具有第一表面，相对的第二表面和从所述板第二表面延伸的至少一个侧壁的板。 散热盖还包括至少一个流体输送管道和至少一个流体移除管道，每个至少一个流体移除管道在板的第一和第二表面之间延伸，以及至少一个从板的第二表面延伸的间隔突起，以建立和保持 板的第二表面和微电子器件，当散热盖定位成从微电子器件移除热量时。
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公开(公告)号：US09165857B2
公开(公告)日：2015-10-20
申请号：US13672413
申请日：2012-11-08
Applicant: Intel Corporation
Inventor： David W. Song , Je-Yong Chang
IPC: H01L23/34 , H05K7/20 , H01L23/473 , H05K3/30 , H01L23/427 , H05K1/02
CPC classification number: H05K7/20272 , H01L23/427 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H05K1/0209 , H05K7/20218 , H05K7/2039 , H05K2201/066 , Y10T29/4913
Abstract: A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.
Abstract translation: 一种散热盖，其包括具有第一表面，相对的第二表面和从所述板第二表面延伸的至少一个侧壁的板。 散热盖还包括至少一个流体输送管道和至少一个流体移除管道，每个至少一个流体移除管道在板的第一和第二表面之间延伸，以及至少一个从板的第二表面延伸的间隔突起，以建立和保持 板的第二表面和微电子器件，当散热盖定位成从微电子器件移除热量时。
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公开(公告)号：US09791501B2
公开(公告)日：2017-10-17
申请号：US13625334
申请日：2012-09-24
Applicant: Intel Corporation
Inventor： Paul Diglio , David W. Song
CPC classification number: G01R31/2875 , F28F2013/005 , G01R31/2863
Abstract: Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations.
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