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公开(公告)号：US20190206038A1
公开(公告)日：2019-07-04
申请号：US15857517
申请日：2017-12-28
Applicant: Intel Corporation
Inventor： Alireza Ashari , Curt Carboni , Jason Jones , Robert Wiedmaier , Di Xu , Wei Yan , Liang Zhang
Abstract: A method, apparatus and computer readable memory for solder paste inspection. A light source is configured to irradiate a sample solder joint comprising an organic material, an organic and metal material enclosed by an irregular boundary, and a metal material enclosed by a regular boundary. A first wavelength ultraviolet (UV) energy irradiates the sample to obtain first fluorescence energy, and a second wavelength UV energy irradiates the sample to obtain second fluorescence energy. A two-dimensional (2D) camera is configured to acquire a first image of the sample primarily from the first fluorescence energy and a second image of the sample primarily from the second fluorescence energy. Photo manipulation software is stored on at least one hardware processor, the photo manipulation software configured to overlay the first image and the second image to visually compare the boundary of the organic and metal material with the boundary of the metal material.
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公开(公告)号：US10401286B1
公开(公告)日：2019-09-03
申请号：US15934722
申请日：2018-03-23
Applicant: Intel Corporation
Inventor： Jianyong Mo , Darren Vance , Di Xu , Liang Zhang
Abstract: Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.
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公开(公告)号：US10794840B2
公开(公告)日：2020-10-06
申请号：US16473777
申请日：2017-03-17
Applicant: Intel Corporation
Inventor： Liang Zhang , Jianyong Mo , Darren A. Vance , Di Xu , Gregory S. Clemons , Robert F. Wiedmaier
IPC: G01N21/956 , G01N21/88 , G02B3/14 , G06T7/00 , H04N5/225
Abstract: Embodiments of the present disclosure provide techniques and configurations for an apparatus for package inspection. In some embodiments, the apparatus may include a light source to selectively project a first light defined by a first wavelength range to a surface of a package under inspection; an optical filter to selectively transmit, within a second wavelength range, a second light emitted by the surface of the package in response to the projection of the first light to the surface; a camera to generate one or more images of the surface, defined by the second light; and a controller coupled with the light source, optical filter, and camera, to process the one or more images, to detect a presence of a material of interest on the surface of the package, based at least in part on the first and second wavelength ranges. Other embodiments may be described and/or claimed.
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公开(公告)号：US10572992B2
公开(公告)日：2020-02-25
申请号：US15857517
申请日：2017-12-28
Applicant: Intel Corporation
Inventor： Alireza Ashari , Curt Carboni , Jason Jones , Robert Wiedmaier , Di Xu , Wei Yan , Liang Zhang
Abstract: A method, apparatus and computer readable memory for solder paste inspection. A light source is configured to irradiate a sample solder joint comprising an organic material, an organic and metal material enclosed by an irregular boundary, and a metal material enclosed by a regular boundary. A first wavelength ultraviolet (UV) energy irradiates the sample to obtain first fluorescence energy, and a second wavelength UV energy irradiates the sample to obtain second fluorescence energy. A two-dimensional (2D) camera is configured to acquire a first image of the sample primarily from the first fluorescence energy and a second image of the sample primarily from the second fluorescence energy. Photo manipulation software is stored on at least one hardware processor, the photo manipulation software configured to overlay the first image and the second image to visually compare the boundary of the organic and metal material with the boundary of the metal material.
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