公开(公告)号：US11357096B2

公开(公告)日：2022-06-07

申请号：US16027737

申请日：2018-07-05

Applicant: Intel Corporation

Inventor： Michael J. Hill ,  Huong T. Do ,  Anne Augustine

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H01L23/367 ,  H01L23/498 ,  H01F27/28 ,  H01F41/04 ,  H01L21/48 ,  H05K1/18

Abstract: Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.

公开(公告)号：US20220240370A1

公开(公告)日：2022-07-28

申请号：US17720171

申请日：2022-04-13

Applicant: Intel Corporation

Inventor： Michael J. Hill ,  Huong T. Do ,  Anne Augustine

IPC: H05K1/02 ,  H05K1/16 ,  H01L23/367 ,  H01L23/498 ,  H01F27/28 ,  H01F41/04 ,  H01L21/48 ,  H05K1/18

Abstract: Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.

公开(公告)号：US11690165B2

公开(公告)日：2023-06-27

申请号：US17720171

申请日：2022-04-13

Applicant: Intel Corporation

Inventor： Michael J. Hill ,  Huong T. Do ,  Anne Augustine

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H01L23/367 ,  H01L23/498 ,  H01F27/28 ,  H01F41/04 ,  H01L21/48 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H01F27/2804 ,  H01F41/041 ,  H01L21/486 ,  H01L21/4857 ,  H01L23/367 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/165 ,  H05K1/181 ,  H01F2027/2809 ,  H05K2201/09672 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.

公开(公告)号：US20200015348A1

公开(公告)日：2020-01-09

申请号：US16027737

申请日：2018-07-05

Applicant: Intel Corporation

Inventor： Michael J. Hill ,  Huong T. Do ,  Anne Augustine

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/16 ,  H01L23/367 ,  H01L23/498 ,  H01F27/28 ,  H01F41/04 ,  H01L21/48

Abstract: Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.