公开(公告)号：US20220300049A1

公开(公告)日：2022-09-22

申请号：US17203571

申请日：2021-03-16

Applicant: Intel Corporation

Inventor： Somvir Singh Dahiya ,  Stephen Gunther ,  Julien Sebot ,  Randy Osborne ,  Scot Kellar ,  Joshua Een

IPC: G06F1/20 ,  G06F1/3287 ,  G05B6/02

Abstract: A thermal management scheme, for a multichip module, that is aware of various dies in a stack (horizontal and/or vertical) and heat generated from them, local hot spots in a victim die, and hot spots in aggressor die(s). Each victim die receives telemetry information from thermal sensors located in aggressor dies as well as local thermal sensors in the victim die. The telemetry information is used to enable a virtual sensing scheme where temperature for a target die (e.g., a victim die) and/or its intellectual property (IP) domain is estimated or calculated. The estimated or calculated temperature is then used for performance management of the victim and/or aggressor dies in the stack.

公开(公告)号：US10404309B2

公开(公告)日：2019-09-03

申请号：US15278799

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Sankarananda Basak ,  Joshua Een ,  David W. Browning

IPC: H04M1/00 ,  H04B1/3888 ,  H04M1/02

Abstract: A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.

公开(公告)号：US20180091183A1

公开(公告)日：2018-03-29

申请号：US15278799

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Sankarananda Basak ,  Joshua Een ,  David W. Browning

IPC: H04B1/3888 ,  H04M1/02

CPC classification number: H04B1/3888 ,  H04M1/0202 ,  H04M1/0235

Abstract: A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.

公开(公告)号：US12242315B2

公开(公告)日：2025-03-04

申请号：US17203571

申请日：2021-03-16

Applicant: Intel Corporation

Inventor： Somvir Singh Dahiya ,  Stephen Gunther ,  Julien Sebot ,  Randy Osborne ,  Scot Kellar ,  Joshua Een

IPC: G06F1/32 ,  G05B6/02 ,  G06F1/20 ,  G06F1/3287 ,  G06F1/3203

Abstract: A thermal management scheme, for a multichip module, that is aware of various dies in a stack (horizontal and/or vertical) and heat generated from them, local hot spots in a victim die, and hot spots in aggressor die(s). Each victim die receives telemetry information from thermal sensors located in aggressor dies as well as local thermal sensors in the victim die. The telemetry information is used to enable a virtual sensing scheme where temperature for a target die (e.g., a victim die) and/or its intellectual property (IP) domain is estimated or calculated. The estimated or calculated temperature is then used for performance management of the victim and/or aggressor dies in the stack.