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公开(公告)号:US20250053221A1
公开(公告)日:2025-02-13
申请号:US18933804
申请日:2024-10-31
Applicant: Intel Corporation
Inventor: Tarakesava Reddy Koki , Prabhakar Subrahmanyam , Zhongsheng Wang , Feroze Khan , Phani Alaparthi , Shreedhar Shahapur , Venkata Mahesh Gunnam , Krishnendu Saha
IPC: G06F1/3231
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to perform power-saving based on user presence, including a network interface to communicate with a cloud device, user presence detector circuitry to determine if a user is present or not present; workload distributor circuitry to distribute an AI workload to either first AI inference circuitry or second AI inference circuitry; and power circuitry to charge a battery at either a first charge level or a second charge level.
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公开(公告)号:US20240019914A1
公开(公告)日:2024-01-18
申请号:US18477881
申请日:2023-09-29
Applicant: Intel Corporation
Inventor: Krishnendu Saha , Pawan Shiv Vadakattu , Samarth Alva , Bala Subramanya
IPC: G06F1/20 , H05K7/20 , H02M7/5387
CPC classification number: G06F1/20 , H05K7/20172 , H02M7/5387
Abstract: In one embodiment, an AC ionic blower apparatus includes a housing defining a hole through the housing, a first electrode formed around the hole, a second electrode formed around the hole, and a dielectric material between the first electrode and the second electrode. The center of the second electrode is offset from the center of the first electrode.
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公开(公告)号:US20240351892A1
公开(公告)日:2024-10-24
申请号:US18759055
申请日:2024-06-28
Applicant: Intel Corporation
Inventor: Krishnendu Saha , Chethan Holla , Hari Shanker Thakur
IPC: C01B33/158 , C01B33/159 , C09D183/04 , G06F1/20 , H05K5/02
CPC classification number: C01B33/1585 , C01B33/159 , C09D183/04 , G06F1/206 , H05K5/02 , C01P2006/32
Abstract: Aerogel including low thermal conductivity gases and related apparatus and methods are disclosed. An example aerogel disclosed herein includes a framework including a plurality of pores and a gas in at least one of the plurality of pores, the gas having a lower thermal conductivity than air.
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