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公开(公告)号:US20240130068A1
公开(公告)日:2024-04-18
申请号:US18399565
申请日:2023-12-28
Applicant: Intel Corporation
Inventor: Nan Wang , Zhichao Z. Zhang , Lihui Wu , Jialiang Xu , Xiaoguo Liang , Bo Chen , Haifeng Gong
CPC classification number: H05K7/1492 , H01R12/79 , H05K1/0213 , H05K7/1402 , H05K2201/0154 , H05K2201/10386
Abstract: Technologies for a flexible three-dimensional power plane in a chassis are disclosed. In one embodiment, a flexible ribbon cable is laid along a circuit board tray. The flexible ribbon cable is secured to the tray using power bosses. The power bosses connect to one or more conductors on the ribbon cable. When the circuit board is mounted on the circuit board tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the circuit board tray. The ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board, without requiring large traces that take up space on the circuit board.
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公开(公告)号:US20240251522A1
公开(公告)日:2024-07-25
申请号:US18587499
申请日:2024-02-26
Applicant: Intel Corporation
Inventor: Yanbing Sun , Chao Sun , Jie Yan , Xiaoguo Liang , Lihui Wu
IPC: H05K7/20
CPC classification number: H05K7/20154 , H05K7/20209 , H05K7/209 , H05K7/20927
Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include a rotatable mount; a first heat sink including a first surface and a second surface, the first surface of the first heat sink to be thermally coupled to a semiconductor device on a substrate, the second surface of the first heat sink thermally coupled to the rotatable mount; and a second heat sink including a third surface, the third surface of the second heat sink coupled to the rotatable mount, the second heat sink structured to rotate relative to the first heat sink when a portion of the rotatable mount rotates between a first position and a second position.
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