公开(公告)号：US20220077302A1

公开(公告)日：2022-03-10

申请号：US17526986

申请日：2021-11-15

Applicant: Intel Corporation

Inventor： Sairam SUBRAMANIAN ,  Walid M. HAFEZ ,  Sridhar GOVINDARAJU ,  Mark LIU ,  Szuya S. LIAO ,  Chia-Hong JAN ,  Nick LINDERT ,  Christopher KENYON

IPC: H01L29/66 ,  H01L29/06 ,  H01L27/088 ,  H01L21/8234 ,  H01L21/762 ,  H01L21/768

Abstract: Dual self-aligned gate endcap (SAGE) architectures, and methods of fabricating dual self-aligned gate endcap (SAGE) architectures, are described. In an example, an integrated circuit structure includes a first semiconductor fin having a cut along a length of the first semiconductor fin. A second semiconductor fin is parallel with the first semiconductor fin. A first gate endcap isolation structure is between the first semiconductor fin and the second semiconductor fin. A second gate endcap isolation structure is in a location of the cut along the length of the first semiconductor fin.

公开(公告)号：US20230089815A1

公开(公告)日：2023-03-23

申请号：US17993438

申请日：2022-11-23

Applicant: Intel Corporation

Inventor： Leonard GULER ,  Nick LINDERT ,  Biswajeet GUHA ,  Swaminathan SIVAKUMAR ,  Tahir GHANI

IPC: H01L29/78 ,  H01L29/417 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/66 ,  H01L29/06 ,  H01L21/762 ,  H01L21/02

Abstract: Fin trim plug structures for imparting channel stress are described. In an example, an integrated circuit structure includes a fin including silicon, the fin having a top and sidewalls. The fin has a trench separating a first fin portion and a second fin portion. A first gate structure including a gate electrode is over the top of and laterally adjacent to the sidewalls of the first fin portion. A second gate structure including a gate electrode is over the top of and laterally adjacent to the sidewalls of the second fin portion. An isolation structure is in the trench of the fin, the isolation structure between the first gate structure and the second gate structure. The isolation structure includes a first dielectric material laterally surrounding a recessed second dielectric material distinct from the first dielectric material, the recessed second dielectric material laterally surrounding an oxidation catalyst layer.

公开(公告)号：US20200220016A1

公开(公告)日：2020-07-09

申请号：US16240166

申请日：2019-01-04

Applicant: Intel Corporation

Inventor： Leonard GULER ,  Nick LINDERT ,  Biswajeet GUHA ,  Swaminathan SIVAKUMAR ,  Tahir GHANI

IPC: H01L29/78 ,  H01L29/417 ,  H01L21/8234 ,  H01L29/06 ,  H01L29/66 ,  H01L27/088

Abstract: Fin trim plug structures for imparting channel stress are described. In an example, an integrated circuit structure includes a fin including silicon, the fin having a top and sidewalls. The fin has a trench separating a first fin portion and a second fin portion. A first gate structure including a gate electrode is over the top of and laterally adjacent to the sidewalls of the first fin portion. A second gate structure including a gate electrode is over the top of and laterally adjacent to the sidewalls of the second fin portion. An isolation structure is in the trench of the fin, the isolation structure between the first gate structure and the second gate structure. The isolation structure includes a first dielectric material laterally surrounding a recessed second dielectric material distinct from the first dielectric material, the recessed second dielectric material laterally surrounding an oxidation catalyst layer.

公开(公告)号：US20220077145A1

公开(公告)日：2022-03-10

申请号：US17529029

申请日：2021-11-17

Applicant: Intel Corporation

Inventor： Walid M. HAFEZ ,  Sridhar GOVINDARAJU ,  Mark LIU ,  Szuya S. LIAO ,  Chia-Hong JAN ,  Nick LINDERT ,  Christopher KENYON ,  Sairam SUBRAMANIAN

IPC: H01L27/088 ,  H01L23/528 ,  H01L29/06 ,  H01L29/66 ,  H01L21/8234

Abstract: Unidirectional self-aligned gate endcap (SAGE) architectures with gate-orthogonal walls, and methods of fabricating unidirectional self-aligned gate endcap (SAGE) architectures with gate-orthogonal walls, are described. In an example, integrated circuit structure includes a first semiconductor fin having a cut along a length of the first semiconductor fin. A second semiconductor fin has a cut along a length of the second semiconductor fin. A gate endcap isolation structure is between the first semiconductor fin and the second semiconductor fin. The gate endcap isolation structure has a substantially uniform width along the lengths of the first and second semiconductor fins.

公开(公告)号：US20190304971A1

公开(公告)日：2019-10-03

申请号：US15941647

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Walid M. HAFEZ ,  Sridhar GOVINDARAJU ,  Mark LIU ,  Szuya S. LIAO ,  Chia-Hong JAN ,  Nick LINDERT ,  Christopher KENYON ,  Sairam SUBRAMANIAN

IPC: H01L27/088 ,  H01L23/528 ,  H01L29/06

Abstract: Unidirectional self-aligned gate endcap (SAGE) architectures with gate-orthogonal walls, and methods of fabricating unidirectional self-aligned gate endcap (SAGE) architectures with gate-orthogonal walls, are described. In an example, integrated circuit structure includes a first semiconductor fin having a cut along a length of the first semiconductor fin. A second semiconductor fin has a cut along a length of the second semiconductor fin. A gate endcap isolation structure is between the first semiconductor fin and the second semiconductor fin. The gate endcap isolation structure has a substantially uniform width along the lengths of the first and second semiconductor fins.

公开(公告)号：US20190305112A1

公开(公告)日：2019-10-03

申请号：US15943556

申请日：2018-04-02

Applicant: Intel Corporation

Inventor： Sairam SUBRAMANIAN ,  Walid M. HAFEZ ,  Sridhar GOVINDARAJU ,  Mark LIU ,  Szuya S. LIAO ,  Chia-Hong JAN ,  Nick LINDERT ,  Christopher KENYON

IPC: H01L29/66 ,  H01L29/06 ,  H01L21/768 ,  H01L21/8234 ,  H01L21/762 ,  H01L27/088

Abstract: Dual self-aligned gate endcap (SAGE) architectures, and methods of fabricating dual self-aligned gate endcap (SAGE) architectures, are described. In an example, an integrated circuit structure includes a first semiconductor fin having a cut along a length of the first semiconductor fin. A second semiconductor fin is parallel with the first semiconductor fin. A first gate endcap isolation structure is between the first semiconductor fin and the second semiconductor fin. A second gate endcap isolation structure is in a location of the cut along the length of the first semiconductor fin.

公开(公告)号：US20170213768A1

公开(公告)日：2017-07-27

申请号：US15328473

申请日：2014-08-29

Applicant: Intel Corporation

Inventor： Joseph M. STEIGERWALD ,  Nick LINDERT

IPC: H01L21/8234 ,  H01L29/417 ,  H01L29/66 ,  H01L21/304 ,  H01L21/308 ,  H01L23/535 ,  H01L27/088 ,  H01L29/78

CPC classification number: H01L21/823475 ,  H01L21/304 ,  H01L21/3085 ,  H01L21/823431 ,  H01L23/535 ,  H01L27/0886 ,  H01L29/41791 ,  H01L29/66795 ,  H01L29/785 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Embodiments of the present disclosure describe techniques for filling a high aspect ratio, narrow structure with multiple metal layers and associated configurations. In one embodiment, an apparatus includes a transistor structure comprising a semiconductor material, a dielectric material having a recess defined over the transistor structure, the recess having a height in a first direction, an electrode terminal disposed in the recess and coupled with the transistor structure, wherein a first portion of the electrode terminal comprises a first metal in direct contact with the transistor structure and a second portion of the electrode terminal comprises a second metal disposed on the first portion and wherein an interface between the first portion and the second portion is planar and extends across the recess in a second direction that is substantially perpendicular to the first direction. Other embodiments may be described and/or claimed.