公开(公告)号：US20180335465A1

公开(公告)日：2018-11-22

申请号：US15776979

申请日：2015-11-18

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Simranjit S. Khalsa ,  Hemachandar Tanukonda Devarajulu ,  Deepak Goyal ,  Zhiguo Qian

IPC: G01R31/11 ,  G01R31/28

CPC classification number: G01R31/11 ,  G01R31/2853 ,  G01R31/2896 ,  G01R31/311

Abstract: An apparatus comprises a signal generator circuit, a test probe, a signal sensor circuit, and a defect detection circuit. The signal generator circuit is configured to generate an impulse test signal having an impulse waveform and adjust a bandwidth of the impulse test signal. The test probe is electrically coupled to the signal generator circuit and configured to apply the impulse test signal to a device under test (DUT). The signal sensor circuit is configured to sense a conducted test signal produced by applying the impulse test signal to the DUT with the test probe. The defect detection circuit is configured to generate an indication of a defect in the DUT using the conducted test signal.

公开(公告)号：US10746780B2

公开(公告)日：2020-08-18

申请号：US15776979

申请日：2015-11-18

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Simranjit S. Khalsa ,  Hemachandar Tanukonda Devarajulu ,  Deepak Goyal ,  Zhiguo Qian

IPC: G01R31/11 ,  G01R31/28 ,  G01R31/311

Abstract: An apparatus comprises a signal generator circuit, a test probe, a signal sensor circuit, and a defect detection circuit. The signal generator circuit is configured to generate an impulse test signal having an impulse waveform and adjust a bandwidth of the impulse test signal. The test probe is electrically coupled to the signal generator circuit and configured to apply the impulse test signal to a device under test (DUT). The signal sensor circuit is configured to sense a conducted test signal produced by applying the impulse test signal to the DUT with the test probe. The defect detection circuit is configured to generate an indication of a defect in the DUT using the conducted test signal.

公开(公告)号：US11226353B2

公开(公告)日：2022-01-18

申请号：US16493503

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Chengqing Hu ,  Mayue Xie ,  Simranjit S. Khalsa ,  Deepak Goyal

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/11 ,  G01R31/28

Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.

公开(公告)号：US20210132113A1

公开(公告)日：2021-05-06

申请号：US16493503

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Chengqing Hu ,  Mayue Xie ,  Simranjit S. Khalsa ,  Deepak Goyal

IPC: G01R1/067 ,  G01R31/28

Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.