公开(公告)号：US20220010452A1

公开(公告)日：2022-01-13

申请号：US17482513

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Chandrasekharan NAIR ,  Darko GRUJICIC ,  Rengarajan SHANMUGAM ,  Srinivasan RAMAN ,  Roy DITTLER ,  Daniel SOWA ,  Robert BARESEL, II ,  Marcel WALL ,  Rahul MANEPALLI

IPC: C25D17/06 ,  C25D17/12 ,  C25D17/00 ,  H01L21/67

Abstract: The present disclosure is directed to an electroless plating process using a panel basket for holding semiconductor panels comprising a plurality of metal pads and shielding the metal pads from contaminants and over-etching and under-etching caused by the contaminants.