公开(公告)号：US10694641B2

公开(公告)日：2020-06-23

申请号：US15392589

申请日：2016-12-28

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  F28D15/02 ,  H05K1/02 ,  H01L23/427 ,  F28D15/04 ,  G06F1/20 ,  H01L21/48 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  F28F13/16 ,  F28C3/08 ,  G06F1/16 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US10917994B2

公开(公告)日：2021-02-09

申请号：US15393258

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H05K1/02 ,  H01L21/48 ,  H01L23/427 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  F28D15/04 ,  F28F13/16 ,  F28C3/08 ,  G06F1/16 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

公开(公告)号：US20170314871A1

公开(公告)日：2017-11-02

申请号：US15393251

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: F28D15/02 ,  F28D15/04 ,  F28F13/16 ,  F28D21/00

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in heat sinks are disclosed. An example embodiment includes: a base; and a plurality of fins in thermal coupling with the base, each fin of the plurality of fins having a wickless capillary driven constrained vapor bubble heat pipe embedded in the fin, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US11324139B2

公开(公告)日：2022-05-03

申请号：US16881409

申请日：2020-05-22

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H05K1/02 ,  H01L21/48 ,  H01L23/427 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  F28D15/04 ,  F28F13/16 ,  F28C3/08 ,  G06F1/16 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.

公开(公告)号：US20170318702A1

公开(公告)日：2017-11-02

申请号：US15392589

申请日：2016-12-28

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K7/20 ,  H05K3/00 ,  H01L21/48 ,  H01L23/538 ,  H01L23/427 ,  H05K1/02 ,  H05K1/18

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US20170314874A1

公开(公告)日：2017-11-02

申请号：US15393258

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: F28D15/04 ,  H05K7/20 ,  F28C3/08

CPC classification number: H05K7/20336 ,  F28C3/08 ,  F28D15/0233 ,  F28D15/025 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/046 ,  F28D2021/0029 ,  F28F13/16 ,  F28F2215/06 ,  G02B6/0085 ,  G02F1/133385 ,  G06F1/1601 ,  G06F1/20 ,  G06F1/203 ,  H01L21/4846 ,  H01L21/4871 ,  H01L23/427 ,  H01L23/5389 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/0017 ,  H05K3/0044 ,  H05K5/0017 ,  H05K7/20318 ,  H05K7/20809 ,  H05K2201/064

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

公开(公告)号：US10219409B2

公开(公告)日：2019-02-26

申请号：US15393263

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: G06F1/16 ,  H05K7/20 ,  G06F1/20 ,  H01L21/48 ,  H01L23/427 ,  H01L23/538 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  F28D15/02 ,  F28D15/04 ,  F28F13/16 ,  F28C3/08 ,  H05K5/00 ,  F28D21/00 ,  F21V8/00 ,  G02F1/1333

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in display devices are disclosed. An example embodiment includes: a display device layer fabricated from a substrate, the display device layer including a plurality of in-built channels integrated therein; and a plurality of wickless capillary driven constrained vapor bubble heat pipes being embedded into the plurality of in-built channels, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

公开(公告)号：US20190043782A1

公开(公告)日：2019-02-07

申请号：US15981081

申请日：2018-05-16

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Aravind Dasu ,  Mahesh A. Iyer

IPC: H01L23/427 ,  F28D15/04 ,  F28D15/06 ,  H01L25/065 ,  G06F17/50 ,  H01L23/34

Abstract: An integrated circuit package may include one or more integrated circuit dies and reconfigurable constrained vapor bubble (CVB) heat pipe structures formed on the integrated circuit dies. The reconfigurable CVB heat pipe structures may be adjusted using micro-electro-mechanical systems (MEMS) switches. By turning on a MEMS switch, the corresponding heat pipe structure will exhibit a first heat transfer efficiency. By turning off a MEMS switch, the corresponding heat pipe structure will exhibit a second heat transfer efficiency that is less than the first heat transfer efficiency. The reconfigurable CVB heat pipe structures may be statically programmed and/or dynamically adjusted as hot spot locations within the integrated circuit package migrate over time.

公开(公告)号：US20170318687A1

公开(公告)日：2017-11-02

申请号：US15393263

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Sumita Basu ,  Shantanu D. Kulkarni ,  Prosenjit Ghosh ,  Konstantin I. Kouliachev

IPC: H05K5/00 ,  G06F1/20 ,  G06F1/16 ,  H05K7/20 ,  F28D15/04 ,  F28D15/02 ,  G02F1/1333 ,  F21V8/00

CPC classification number: H05K7/20336 ,  F28C3/08 ,  F28D15/0233 ,  F28D15/025 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/046 ,  F28D2021/0029 ,  F28F13/16 ,  F28F2215/06 ,  G02B6/0085 ,  G02F1/133385 ,  G06F1/1601 ,  G06F1/20 ,  G06F1/203 ,  H01L21/4846 ,  H01L21/4871 ,  H01L23/427 ,  H01L23/5389 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/0017 ,  H05K3/0044 ,  H05K5/0017 ,  H05K7/20318 ,  H05K7/20809 ,  H05K2201/064

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in display devices are disclosed. An example embodiment includes: a display device layer fabricated from a substrate, the display device layer including a plurality of in-built channels integrated therein; and a plurality of wickless capillary driven constrained vapor bubble heat pipes being embedded into the plurality of in-built channels, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.