公开(公告)号：US11830863B2

公开(公告)日：2023-11-28

申请号：US17539088

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Suresh V. Pothukuchi ,  Andrew Alduino ,  Ravindranath V. Mahajan ,  Srikant Nekkanty ,  Ling Liao ,  Harinadh Potluri ,  David M. Bond ,  Sushrutha Reddy Gujjula ,  Donald Tiendung Tran ,  David Hui ,  Vladimir Tamarkin

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

CPC classification number: H01L25/167 ,  H01L23/367 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/473 ,  H01L23/5385 ,  H01L23/5386 ,  H04Q11/0005 ,  H01L2023/4031 ,  H04Q2011/0039

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20250006651A1

公开(公告)日：2025-01-02

申请号：US18345820

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Francisco Maya ,  Khant Minn ,  Suresh V. Pothukuchi ,  Arnab Sarkar ,  Mohit Bhatia ,  Bhaskar Jyoti Krishnatreya ,  Siyan Dong

IPC: H01L23/544 ,  H01L23/00

Abstract: An apparatus comprising a first integrated circuit device, the first integrated circuit device comprising a fiducial having a length size greater than a width size of the fiducial, wherein the fiducial comprises at least one first area and at least one second area, wherein the at least one first area is to stop light from a light source and the at least one second area is to pass light from the light source during a determination of an alignment between the first integrated circuit device and a second integrated circuit device.

公开(公告)号：US12148744B2

公开(公告)日：2024-11-19

申请号：US17132976

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Zhichao Zhang ,  Kemal Aygün ,  Suresh V. Pothukuchi ,  Xiaoqian Li ,  Omkar Karhade

IPC: H04B10/00 ,  G02B6/42 ,  H01L25/00 ,  H01L25/18 ,  H01L23/373 ,  H01L23/538

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

公开(公告)号：US11217573B2

公开(公告)日：2022-01-04

申请号：US16809515

申请日：2020-03-04

Applicant: Intel Corporation

Inventor： Suresh V. Pothukuchi ,  Andrew Alduino ,  Ravindranath V. Mahajan ,  Srikant Nekkanty ,  Ling Liao ,  Harinadh Potluri ,  David M. Bond ,  Sushrutha Reddy Gujjula ,  Donald Tiendung Tran ,  David Hui ,  Vladimir Tamarkin

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.