公开(公告)号：US20240292557A1

公开(公告)日：2024-08-29

申请号：US18650553

申请日：2024-04-30

Applicant: Intel Corporation

Inventor： Pharveen Parameswaran ,  Santhosh Ap ,  Poh Ling Lee ,  Prasanna Pichumani ,  Vijith Halestoph R ,  Syed Bukhari Syed Shafi ,  Anas Zakaria

IPC: H05K7/14

CPC classification number: H05K7/1405

Abstract: A surface-mounted retaining assembly is provided for retaining an electronic component. The electronic component may comprise an internal expansion card of an electronic device, and may comprise an M.2 module. The retaining assembly utilizes a spring-loaded retaining mechanism and may be bonded to a printed circuit board (PCB) via a small footprint solder pad. The retaining assembly eliminates the need for through-hole or surface-mounted standoffs, and thus increases the usable routing area on all layers. Additionally, the retaining assembly does not require a threaded component, and is suitable for low profile applications for which threaded components are infeasible.

公开(公告)号：US20240312736A1

公开(公告)日：2024-09-19

申请号：US18185460

申请日：2023-03-17

Applicant: Intel Corporation

Inventor： Abhishek Srivastav ,  Smit Kapila ,  Prakash Kurma Raju ,  Sumod Cherukkate ,  Vijith Halestoph R ,  Srikanth Potluri

IPC: H01H13/14 ,  G06F3/02 ,  H01H13/70 ,  H04R1/02 ,  H04R7/04

CPC classification number: H01H13/14 ,  G06F3/0202 ,  H01H13/70 ,  H04R1/028 ,  H04R7/04 ,  H01H2239/048 ,  H04R2499/15

Abstract: Keyboards for electronic devices with keys having integrated speakers are disclosed herein. An example keyboard includes a key having a key cap and a speaker coupled to the key cap. The speaker is disposed in or at least partially covered by the key cap.

公开(公告)号：US20240098938A1

公开(公告)日：2024-03-21

申请号：US18526948

申请日：2023-12-01

Applicant: Intel Corporation

Inventor： Ravishankar Srikanth ,  Vijith Halestoph R ,  Prakash Kurma Raju ,  Arnab Sen ,  Isha Garg ,  Ezekiel Poulose ,  Avinash Manu Aravindan

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20154 ,  H05K7/2039

Abstract: Techniques for a vapor chamber with less dead space are disclosed. In an illustrative embodiment, a vapor chamber is formed by folding a sheet and sealing the edges. The edges seal the vapor chamber but take up a relatively large amount of space without allowing for vapor to be transported in that space. The folded edge takes up less space, reducing the overall footprint of the vapor chamber. The vapor chamber with a smaller footprint can allow for, e.g., more space for motherboard area, more space for a battery, and/or a smaller form factor overall.