Integrated heater on MEMS cap for wafer scale packaged MEMS sensors
    2.
    发明授权
    Integrated heater on MEMS cap for wafer scale packaged MEMS sensors 有权
    MEMS盖上的集成加热器,用于晶圆级封装的MEMS传感器

    公开(公告)号:US09302902B2

    公开(公告)日:2016-04-05

    申请号:US14176964

    申请日:2014-02-10

    Abstract: A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.

    Abstract translation: 公开了一种用于控制MEMS传感器的温度的系统和方法。 在第一方面,该系统包括封装MEMS传感器的MEMS盖和垂直地布置到MEMS盖的CMOS模头。 该系统包括集成到MEMS盖中的加热器。 集成加热器被激活以控制MEMS传感器的温度。 在第二方面,该方法包括用MEMS盖封装MEMS传感器,并将CMOS管芯耦合到MEMS盖。 该方法包括将加热器集成到MEMS盖中。 集成加热器被激活以控制MEMS传感器的温度。

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