Integrated MEMS devices with controlled pressure environments by means of enclosed volumes
    3.
    发明授权
    Integrated MEMS devices with controlled pressure environments by means of enclosed volumes 有权
    集成的MEMS器件,具有受压力环境的封闭体积

    公开(公告)号:US08513747B1

    公开(公告)日:2013-08-20

    申请号:US13711070

    申请日:2012-12-11

    Abstract: An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.

    Abstract translation: 集成MEMS器件包括晶片,其中晶片包含两个或更多个不同深度的空腔。 MEMS器件包括在第一深度的第一腔内的一个可移动结构和在第二深度的第二腔内的第二可移动结构。 空腔被密封以保持不同的可移动结构的不同压力以实现最佳操作。 可以在相同的多腔深度处理流程中形成MEMS止动件。 MEMS器件可以与CMOS晶片集成。

    Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics

    公开(公告)号:US10288427B2

    公开(公告)日:2019-05-14

    申请号:US14662711

    申请日:2015-03-19

    Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

    INTEGRATED MOTION PROCESSING UNIT (MPU) WITH MEMS INERTIAL SENSING AND EMBEDDED DIGITAL ELECTRONICS

    公开(公告)号:US20190226848A1

    公开(公告)日:2019-07-25

    申请号:US16373086

    申请日:2019-04-02

    Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

    Controlling and accessing content using motion processing on mobile devices
    8.
    发明授权
    Controlling and accessing content using motion processing on mobile devices 有权
    使用移动设备上的运动处理来控制和访问内容

    公开(公告)号:US09292102B2

    公开(公告)日:2016-03-22

    申请号:US13910485

    申请日:2013-06-05

    Abstract: Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer.

    Abstract translation: 手持电子设备,包括运动检测和处理。 在一个方面,一种手持电子设备包括设置在单个传感器晶片上的一组运动传感器,包括至少一个陀螺仪,其感测围绕至​​少三个轴的设备的旋转速率,以及至少一个感测设备的重力和线性加速度的加速度计 沿着至少三个轴。 存储器存储从所述至少一个陀螺仪和加速度计得到的传感器数据,其中所述传感器数据描述所述装置的运动,包括围绕所述装置的三个轴中的至少一个的所述装置的旋转,所述旋转引起与所述装置的相互作用。 存储器设置在相对于传感器晶片垂直定位且基本上平行于传感器晶片的电子晶片上。 电子晶片垂直粘合并电连接到传感器晶片。

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