公开(公告)号：US09342154B2

公开(公告)日：2016-05-17

申请号：US14590877

申请日：2015-01-06

Applicant: InvenSense, Inc.

Inventor： Steven S. Nasiri ,  Joseph Jiang ,  David Sachs

IPC: G06F3/0346 ,  G06F3/01 ,  G06F3/038 ,  A63F13/211

CPC classification number: G06F3/0346 ,  A63F13/211 ,  A63F2300/105 ,  A63F2300/209 ,  B81B7/02 ,  G01C19/42 ,  G01P15/02 ,  G06F3/017 ,  G06F3/038

Abstract: Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.

公开(公告)号：US09533880B2

公开(公告)日：2017-01-03

申请号：US14853873

申请日：2015-09-14

Applicant: InvenSense, Inc.

Inventor： Steven S. Nasiri ,  Anthony F. Flannery, Jr.

IPC: H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  B81C1/00 ,  H01L21/18 ,  B81B3/00 ,  B81C3/00 ,  B23K20/02

CPC classification number: B81C1/00238 ,  B23K20/023 ,  B81B3/0018 ,  B81B7/007 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/094 ,  B81C1/00269 ,  B81C3/001 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/038 ,  B81C2203/0792 ,  H01L21/187

Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

Abstract translation: 公开了一种在两个基板之间将锗键合到铝以产生牢固的电气和机械接触的方法。 铝 - 锗键具有以下独特的属性组合：（1）可形成气密封; （2）可用于在两个基板之间形成导电路径; （3）可以对其进行图案化，使得该导电路径被定位; （4）可以用作为标准铸造CMOS工艺的铝制成。 这具有允许晶片级接合或封装而不向CMOS晶片添加任何附加工艺层的显着优点。

公开(公告)号：US08513747B1

公开(公告)日：2013-08-20

申请号：US13711070

申请日：2012-12-11

Applicant: InvenSense, Inc.

Inventor： Kegang Huang ,  Martin Lim ,  Steven S. Nasiri

IPC: H01L29/84

CPC classification number: B81B3/0051 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0271 ,  B81C1/00293 ,  H01L29/0657

Abstract: An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.

Abstract translation: 集成MEMS器件包括晶片，其中晶片包含两个或更多个不同深度的空腔。 MEMS器件包括在第一深度的第一腔内的一个可移动结构和在第二深度的第二腔内的第二可移动结构。 空腔被密封以保持不同的可移动结构的不同压力以实现最佳操作。 可以在相同的多腔深度处理流程中形成MEMS止动件。 MEMS器件可以与CMOS晶片集成。

公开(公告)号：US10288427B2

公开(公告)日：2019-05-14

申请号：US14662711

申请日：2015-03-19

Applicant: InvenSense, Inc.

Inventor： Steven S. Nasiri ,  David Sachs ,  Babak Taheri

IPC: G01P1/02 ,  G01P15/18 ,  G01P15/00 ,  G01C19/5776 ,  G01P15/08 ,  G01P15/125 ,  G01C19/5769

Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

公开(公告)号：US09811174B2

公开(公告)日：2017-11-07

申请号：US14698768

申请日：2015-04-28

Applicant: InvenSense, Inc.

Inventor： Steven S. Nasiri ,  Joseph Jiang ,  David Sachs

IPC: G06F3/0346 ,  G01C19/42 ,  B81B7/02 ,  G01P15/02

CPC classification number: G06F3/0346 ,  A63F13/211 ,  A63F2300/105 ,  A63F2300/209 ,  B81B7/02 ,  G01C19/42 ,  G01P15/02 ,  G06F3/017 ,  G06F3/038

Abstract: Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.

公开(公告)号：US20190226848A1

公开(公告)日：2019-07-25

申请号：US16373086

申请日：2019-04-02

Applicant: InvenSense, Inc.

Inventor： Steven S. Nasiri ,  David Sachs ,  Babak Taheri

IPC: G01C19/5776 ,  G01C19/5769 ,  G01P15/08 ,  G01P15/125 ,  G01P1/02 ,  G01P15/18

Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

公开(公告)号：US09751752B2

公开(公告)日：2017-09-05

申请号：US15364478

申请日：2016-11-30

Applicant: INVENSENSE, INC.

Inventor： Steven S. Nasiri ,  Anthony F. Flannery, Jr.

IPC: H01L29/04 ,  H01L31/036 ,  H01L31/0376 ,  H01L31/20 ,  H01L27/14 ,  H01L29/82 ,  H01L29/84 ,  B81C1/00 ,  H01L21/18 ,  B81B3/00 ,  B81C3/00 ,  B23K20/02 ,  B81B7/00

CPC classification number: B81C1/00238 ,  B23K20/023 ,  B81B3/0018 ,  B81B7/007 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/094 ,  B81C1/00269 ,  B81C3/001 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/038 ,  B81C2203/0792 ,  H01L21/187

Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

公开(公告)号：US09292102B2

公开(公告)日：2016-03-22

申请号：US13910485

申请日：2013-06-05

Applicant: InvenSense, Inc.

Inventor： Steven S. Nasiri ,  David Sachs

IPC: G06F3/03 ,  A63F13/20 ,  G03B17/00 ,  G06F1/16 ,  G06F3/01 ,  G06F3/0346 ,  G06F3/0485 ,  H04M1/725

CPC classification number: A63F13/428 ,  A63F13/06 ,  A63F13/211 ,  A63F13/92 ,  A63F2300/105 ,  A63F2300/204 ,  A63F2300/6676 ,  G03B17/00 ,  G06F1/1626 ,  G06F1/1694 ,  G06F3/017 ,  G06F3/0346 ,  G06F3/0485 ,  G06F2200/1614 ,  G06F2200/1637 ,  G06F2203/04806 ,  H04M1/72583 ,  H04M2250/12

Abstract: Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer.

Abstract translation: 手持电子设备，包括运动检测和处理。 在一个方面，一种手持电子设备包括设置在单个传感器晶片上的一组运动传感器，包括至少一个陀螺仪，其感测围绕至​​少三个轴的设备的旋转速率，以及至少一个感测设备的重力和线性加速度的加速度计 沿着至少三个轴。 存储器存储从所述至少一个陀螺仪和加速度计得到的传感器数据，其中所述传感器数据描述所述装置的运动，包括围绕所述装置的三个轴中的至少一个的所述装置的旋转，所述旋转引起与所述装置的相互作用。 存储器设置在相对于传感器晶片垂直定位且基本上平行于传感器晶片的电子晶片上。 电子晶片垂直粘合并电连接到传感器晶片。

公开(公告)号：US09139428B2

公开(公告)日：2015-09-22

申请号：US14157456

申请日：2014-01-16

Applicant: InvenSense, Inc.

Inventor： Steven S. Nasiri ,  Anthony F. Flannery, Jr.

IPC: H01L29/80 ,  H01L31/0288 ,  H01L31/112 ,  B81C3/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00238 ,  B23K20/023 ,  B81B3/0018 ,  B81B7/007 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/094 ,  B81C1/00269 ,  B81C3/001 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/038 ,  B81C2203/0792 ,  H01L21/187

Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

Abstract translation: 公开了一种在两个基板之间将锗键合到铝以产生牢固的电气和机械接触的方法。 铝 - 锗键具有以下独特的属性组合：（1）可形成气密封; （2）可用于在两个基板之间形成导电路径; （3）可以对其进行图案化，使得该导电路径被定位; （4）可以用作为标准铸造CMOS工艺的铝制成。 这具有允许晶片级接合或封装而不向CMOS晶片添加任何附加工艺层的显着优点。

公开(公告)号：US09846175B2

公开(公告)日：2017-12-19

申请号：US14606858

申请日：2015-01-27

Applicant: InvenSense, Inc.

Inventor： Steven S. Nasiri ,  Goksen G. Yaralioglu ,  Joseph Seeger ,  Babak Taheri

IPC: G01P15/125 ,  G01P15/08 ,  G01P15/18 ,  B60R21/0132

CPC classification number: G01P15/0888 ,  B60R2021/01327 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18

Abstract: A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers. Each of the at least two proof masses is anchored to the sense substrate via at least one flexure and electrically isolated from each other; and the at least two proof masses are capable of rotating in-plane about a Z-axis relative to the sense substrate, wherein the Z-axis is normal to the substrate. Each of the transducers can sense rotation of each proof mass with respect to the sense substrate in response to a rotation of the rotational sensor.