公开(公告)号：US08808457B2

公开(公告)日：2014-08-19

申请号：US10412133

申请日：2003-04-11

申请人： John Chris Pagano ,  Kenneth Jeffrey Nelson ,  Paul E. Burrows ,  Mark Edward Gross ,  Mac R. Zumhoff ,  Peter Maclyn Martin ,  Charles C. Bonham ,  Gordon Lee Graff ,  Lorenza Moro ,  Xi Chu

发明人： John Chris Pagano ,  Kenneth Jeffrey Nelson ,  Paul E. Burrows ,  Mark Edward Gross ,  Mac R. Zumhoff ,  Peter Maclyn Martin ,  Charles C. Bonham ,  Gordon Lee Graff ,  Lorenza Moro ,  Xi Chu

IPC分类号： C23C16/00 ,  C23C14/00 ,  B05D7/00 ,  C23C14/58 ,  C23C16/54 ,  H01L21/67 ,  H01L51/00 ,  H01L51/56

CPC分类号： B05D7/50 ,  C23C14/58 ,  C23C16/54 ,  H01L21/67236 ,  H01L51/001 ,  H01L51/56

摘要： A tool for depositing multilayer coatings onto a substrate. The tool includes a housing defining a vacuum chamber connected to a vacuum source, deposition stations each configured to deposit a layer of multilayer coating on the substrate, a curing station, and a contamination reduction device. At least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. In one tool configuration, the substrate may travel back and forth through the tool as many times as needed to achieve the desired number of layers of multilayer coating. In another, the tool may include numerous housings adjacently spaced such that the substrate may make a single unidirectional pass. The contamination reduction device may be configured as one or more migration control chambers about at least one of the deposition stations, and further includes cooling devices, such as chillers, to reduce the presence of vaporous layer precursors. The tool is particularly well-suited to depositing multilayer coatings onto flexible substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.

摘要翻译： 用于将多层涂层沉积到基底上的工具。 该工具包括限定连接到真空源的真空室的壳体，每个沉积站被配置成在衬底上沉积多层涂层，固化站和污染减少装置。 沉积站中的至少一个被配置成沉积无机层，而至少一个其它沉积站配置成沉积有机层。 在一个工具配置中，基板可以根据需要多次前进穿过工具以实现所需数量的多层涂层。 另一方面，该工具可以包括相邻间隔开的许多外壳，使得基板可以进行单个单向通过。 污染减少装置可以被配置为围绕至少一个沉积站的一个或多个迁移控制室，并且还包括冷却装置，例如冷却器，以减少气相层前体的存在。 该工具特别适用于将多层涂层沉积在柔性基板上，以及封装放置在柔性基板上的环境敏感设备。