利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.014 秒)

    Method of making an encapsulated plasma sensitive device
    2.
    发明授权
    Method of making an encapsulated plasma sensitive device 有权
    制造封装等离子体敏感器件的方法

    公开(公告)号：US07510913B2

    公开(公告)日：2009-03-31

    申请号：US11439474

    申请日：2006-05-23

    申请人： Lorenza Moro ,  Xi Chu ,  Martin Philip Rosenblum ,  Kenneth Jeffrey Nelson ,  Paul E. Burrows ,  Mark E. Gross ,  Mac R. Zumhoff ,  Peter M. Martin ,  Charles C. Bonham ,  Gordon L. Graff

    发明人： Lorenza Moro ,  Xi Chu ,  Martin Philip Rosenblum ,  Kenneth Jeffrey Nelson ,  Paul E. Burrows ,  Mark E. Gross ,  Mac R. Zumhoff ,  Peter M. Martin ,  Charles C. Bonham ,  Gordon L. Graff

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： C23C14/0694 ,  H01L51/5256 ,  H01L51/56

    摘要： A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.

    摘要翻译： 一种制造封装等离子体敏感装置的方法。 该方法包括：提供与衬底相邻的等离子体敏感器件; 使用选自非等离子体工艺或改进的溅射工艺的工艺在等离子体敏感器件上沉积等离子体保护层; 以及沉积与所述等离子体保护层相邻的至少一个势垒堆叠，所述至少一个势垒堆叠包括至少一个去耦层和至少一个势垒层，所述等离子体敏感器件封装在所述衬底和所述至少一个阻挡层之间， 其中使用等离子体工艺沉积去耦层，阻挡层或两者，所述封装等离子体敏感器件与不具有等离子体保护层的封装的等离子体感应器件相比，具有由等离子体引起的损伤量减少。 还描述了封装的等离子体敏感器件。

    FINGER MOUNTED VACUUM PICKUP TOOL
    3.
    发明申请
    FINGER MOUNTED VACUUM PICKUP TOOL 有权

    公开(公告)号：US20230054307A1

    公开(公告)日：2023-02-23

    申请号：US17889379

    申请日：2022-08-16

    申请人： Kenneth Jeffrey Nelson

    发明人： Kenneth Jeffrey Nelson

    IPC分类号： B25J15/06 ,  B25J1/02

    摘要： A finger mounted vacuum pickup tool for picking up a material may include a finger band configured to accommodate insertion of a user’s finger therein; a ring cap attached to the finger band; and a vacuum cup attached to the ring cap, the vacuum cup including a cup portion and a protrusion extending from a rear surface of the cup portion, the protrusion having a vacuum cup channel extending therethrough, wherein the vacuum cup is configured to create a vacuum seal against the material. The ring cap may include a ring cap inlet channel extending from the vacuum cup to a vent port. The tool may further include an actuation button positioned within the vent port or a vacuum supply tube operatively attached to the ring cap.

    Apparatus for depositing a multilayer coating on discrete sheets
    4.
    发明授权
    Apparatus for depositing a multilayer coating on discrete sheets 有权
    用于在离散片材上沉积多层涂层的装置

    公开(公告)号：US08808457B2

    公开(公告)日：2014-08-19

    申请号：US10412133

    申请日：2003-04-11

    申请人： John Chris Pagano ,  Kenneth Jeffrey Nelson ,  Paul E. Burrows ,  Mark Edward Gross ,  Mac R. Zumhoff ,  Peter Maclyn Martin ,  Charles C. Bonham ,  Gordon Lee Graff ,  Lorenza Moro ,  Xi Chu

    发明人： John Chris Pagano ,  Kenneth Jeffrey Nelson ,  Paul E. Burrows ,  Mark Edward Gross ,  Mac R. Zumhoff ,  Peter Maclyn Martin ,  Charles C. Bonham ,  Gordon Lee Graff ,  Lorenza Moro ,  Xi Chu

    IPC分类号： C23C16/00 ,  C23C14/00 ,  B05D7/00 ,  C23C14/58 ,  C23C16/54 ,  H01L21/67 ,  H01L51/00 ,  H01L51/56

    CPC分类号： B05D7/50 ,  C23C14/58 ,  C23C16/54 ,  H01L21/67236 ,  H01L51/001 ,  H01L51/56

    摘要： A tool for depositing multilayer coatings onto a substrate. The tool includes a housing defining a vacuum chamber connected to a vacuum source, deposition stations each configured to deposit a layer of multilayer coating on the substrate, a curing station, and a contamination reduction device. At least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. In one tool configuration, the substrate may travel back and forth through the tool as many times as needed to achieve the desired number of layers of multilayer coating. In another, the tool may include numerous housings adjacently spaced such that the substrate may make a single unidirectional pass. The contamination reduction device may be configured as one or more migration control chambers about at least one of the deposition stations, and further includes cooling devices, such as chillers, to reduce the presence of vaporous layer precursors. The tool is particularly well-suited to depositing multilayer coatings onto flexible substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.

    摘要翻译： 用于将多层涂层沉积到基底上的工具。 该工具包括限定连接到真空源的真空室的壳体，每个沉积站被配置成在衬底上沉积多层涂层，固化站和污染减少装置。 沉积站中的至少一个被配置成沉积无机层，而至少一个其它沉积站配置成沉积有机层。 在一个工具配置中，基板可以根据需要多次前进穿过工具以实现所需数量的多层涂层。 另一方面，该工具可以包括相邻间隔开的许多外壳，使得基板可以进行单个单向通过。 污染减少装置可以被配置为围绕至少一个沉积站的一个或多个迁移控制室，并且还包括冷却装置，例如冷却器，以减少气相层前体的存在。 该工具特别适用于将多层涂层沉积在柔性基板上，以及封装放置在柔性基板上的环境敏感设备。