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1.发明授权Ethers of oligomeric phenol-dialdehyde condensation products and a vinyl-benzyl compound 失效低聚苯酚 - 二醛缩合产物的醚和乙烯基 - 苄基化合物
公开(公告)号：US4816498A
公开(公告)日：1989-03-28
申请号：US126313
申请日：1987-11-30
CPC分类号： H01B3/44 , C08G8/28 , H05K1/0326
摘要： Oligomeric condensation products of certain dialdehydes and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of glyoxal with from 3 to 4 molar proportions of phenol and end-capped with from 50 to 85% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.
摘要翻译： 某些二醛和酚的低聚缩合产物可以用乙烯基苄基部分和某些其它部分（特别是烷基）封端，以提供在制备层压电路板时特别有价值的热固性树脂。 通过1摩尔比例的乙二醛与3至4摩尔比例的苯酚反应并用50至85％乙烯基苄基和其余为1至11个碳原子的烷基封端的树脂制备的树脂是特别有用的。
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2.发明授权Vinyl-benzyl ethers of phenol-dicyclopentadiene adducts as new thermosetting resins for composites 失效苯酚 - 二环戊二烯加成物的乙烯基 - 苄基醚作为复合材料的新型热固性树脂
公开(公告)号：US4824920A
公开(公告)日：1989-04-25
申请号：US126312
申请日：1987-11-30
申请人： Joseph J. Zupancic , Jeffrey P. Conrad , James A. Wrezel , Andrew M. Zweig , Jean M. J. Frechet
发明人： Joseph J. Zupancic , Jeffrey P. Conrad , James A. Wrezel , Andrew M. Zweig , Jean M. J. Frechet
摘要： The resins resulting from converting dicyclopentadiene-phenol adducts to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from therma, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.
摘要翻译： 将二环戊二烯 - 苯酚加合物转化成其相应的乙烯基苄基醚所产生的树脂是嵌入纤维以生产复合材料的优异基体。 这种树脂，特别是作为具有不同分子量分布的材料的混合物，是玻璃化转变温度好于固化温度的无定形材料，并且其溶解度允许高固含量的溶液，以便提供具有高树脂含量的涂层。 由热，光化学或自由基引发的聚合产生的广泛交联的聚合物具有优异的用于多层电路板的热和电特性。
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3.发明授权Ethers of oligomeric phenol-diketone condensation products and a vinyl-benzyl compound 失效低聚苯酚 - 二酮缩合产物和乙烯基 - 苄基化合物的醚
公开(公告)号：US4921923A
公开(公告)日：1990-05-01
申请号：US272954
申请日：1988-11-18
CPC分类号： H01B3/44 , C08G8/28 , H05K1/03 , H05K1/0326
摘要： Oligomeric condensation products of certain diketones and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of diacetylbenzene with from 3.5 to 4.0 molar proportions of phenol and end-capped with from 50 to 100% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.
摘要翻译： 某些二酮和酚的低聚缩合产物可以用乙烯基苄基部分和某些其它部分（特别是烷基）封端以提供在制备层压电路板中特别有价值的热固性树脂。 通过1摩尔比例的二乙酰苯与3.5至4.0摩尔比例的苯酚反应并用50至100％乙烯基苄基封端的残基制备的树脂，其余为1至11个碳原子的烷基是特别有用的。
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4.发明授权Styrene terminated multifunctional oligomeric phenols as new thermosetting resins for composites 失效苯乙烯封端的多官能低聚酚作为复合材料的新型热固性树脂
公开(公告)号：US4855375A
公开(公告)日：1989-08-08
申请号：US276598
申请日：1988-11-28
IPC分类号： C07C43/225 , C08G8/08 , C08G8/28 , C08G8/36 , H05K1/03
CPC分类号： C08G8/36 , C07C43/225 , C08G8/08 , C08G8/28 , H05K1/0326
摘要： Thermosetting resins which are essentially vinylbenzyl end-capped ethers of the oligomeric condensation products of certain dihydric phenols and formaldehyde are readily polymerized to give an extensively cross-linked polymer particularly useful in printed circuit boards and similar laminates. Effective cost reduction may be enjoyed by replacing up to 50% of the vinylbenzyl moieties by other groups, such as alkyl and benzyl groups, without destroying the usefulness of the resulting thermosetting resins. The vinylbenzyl ether product from bisphenol-A is especially recommended.
摘要翻译： 基本上是某些二元酚和甲醛的低聚缩合产物的乙烯基苄基封端醚的热固性树脂很容易聚合，得到在印刷电路板和类似层压材料中特别有用的广泛交联的聚合物。 通过用其它基团（例如烷基和苄基）代替多达50％的乙烯基苄基部分可以有效降低成本，而不会破坏所得的热固性树脂的有用性。 特别推荐双酚-A的乙烯基苄基醚产物。
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公开(公告)号：US4786700A
公开(公告)日：1988-11-22
申请号：US947590
申请日：1986-12-30
IPC分类号： C08F212/34 , H05K1/03 , C08F216/12
CPC分类号： H05K1/0326 , C08F212/34
摘要： Homogeneous thermosetting copolymers comprising a mixture of styrene-terminated tetrakisphenols and compounds containing at least one pendant vinyl group as exemplified by styrene-terminated tetrakisphenol ethane and styrene-terminated bisphenol A will possess desirable characteristics such as low dielectric constants and high glass transition temperatures. These polymers may be utilized as a component in laminates or circuit boards which are employed in relatively complicated pieces of electronic equipment.
摘要翻译： 包含苯乙烯封端的四苯酚和含有至少一个乙烯基侧链的化合物的混合物的均匀的热固性共聚物如苯乙烯封端的四苯酚乙苯和苯乙烯封端的双酚A所例举将具有期望的特性，例如低介电常数和高玻璃化转变温度。 这些聚合物可以用作在相对复杂的电子设备中使用的层压板或电路板中的组件。
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6.发明授权Styrene terminated multifunctional oligomeric phenols as new thermosetting resins for composites 失效苯乙烯封端的多官能低聚酚作为复合材料的新型热固性树脂
公开(公告)号：US4900794A
公开(公告)日：1990-02-13
申请号：US369369
申请日：1989-06-21
IPC分类号： C07C43/225 , C08G8/08 , C08G8/28 , H05K1/03
CPC分类号： C08G8/08 , C07C43/225 , C08G8/28 , H05K1/0326 , Y10T428/31504
摘要： Thermosetting resins which are essentially vinylbenzyl end-capped ethers of the oligomeric condensation products of certain dihydric phenols and formaldehyde are readily polymerized to give an extensively cross-linked polymer particularly useful in printed circuit boards and similar laminates. Effective cost reduction may be enjoyed by replacing up to 50% of the vinylbenzyl moieties by other groups, such as alkyl and benzyl groups, without destroying the usefulness of the resulting thermosetting resins. The vinylbenzyl ether product from bisphenol-A is especially recommended.
摘要翻译： 基本上是某些二元酚和甲醛的低聚缩合产物的乙烯基苄基封端醚的热固性树脂很容易聚合，得到在印刷电路板和类似层压材料中特别有用的广泛交联的聚合物。 通过用其它基团（例如烷基和苄基）代替多达50％的乙烯基苄基部分可以有效降低成本，而不会破坏所得的热固性树脂的有用性。 特别推荐双酚-A的乙烯基苄基醚产物。
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公开(公告)号：US4728708A
公开(公告)日：1988-03-01
申请号：US947007
申请日：1986-12-29
IPC分类号： C07C43/215 , C07C43/225 , C08F12/34 , H05K1/03 , C08F279/00
CPC分类号： C07C43/215 , C07C43/225 , C08F12/34 , H05K1/0326
摘要： Thermoset polymers of styrene terminated tetrakis phenols may be prepared from resins which possess the generic formula ##STR1## in which R is selected from the group consisting of alkyl, cycloalkyl, alkaryl and substituted alkaryl radicals and X is independently selected from the group consisting of hydrogen and halogen atoms. These polymers will be utilized as a component in laminates on circuit boards which are employed in relatively complicated pieces of electronic equipment.
摘要翻译： 苯乙烯封端的四苯酚的热固性聚合物可以由具有通式
+ TR 的树脂制备，其中R选自烷基，环烷基，烷芳基和取代的烷芳基，X独立地选自 由氢和卤原子组成的组。 这些聚合物将用作电路板中用于相对复杂的电子设备中的层压板中的组分。 -
公开(公告)号：US07754828B2
公开(公告)日：2010-07-13
申请号：US12317136
申请日：2008-12-19
申请人： Pankaj V. Shah , Joseph J. Zupancic
发明人： Pankaj V. Shah , Joseph J. Zupancic
IPC分类号： C08F283/04
CPC分类号： C08G18/6696 , C08G18/68 , C09J175/14
摘要： A two-component bonding agent composition. The composition contains: (a) an isocyanate component comprising a difunctional isocyanate-terminated prepolymer having polymerized residues of at least one difunctional aromatic isocyanate and at least one difunctional polymer of ethylene oxide, propylene oxide or a combination thereof; (b) a polyol component comprising a triglyceride having hydroxyl functional groups; and (c) an adhesion promoter.
摘要翻译： 双组分粘合剂组合物。 组合物包含：（a）异氰酸酯组分，其包含具有至少一个双官能芳族异氰酸酯和至少一种环氧乙烷，环氧丙烷或其组合的双功能聚合物的聚合残基的双官能异氰酸酯封端的预聚物; （b）包含具有羟基官能团的甘油三酯的多元醇组分; 和（c）粘合促进剂。
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公开(公告)号：US5185209A
公开(公告)日：1993-02-09
申请号：US676675
申请日：1991-03-28
申请人： Joseph J. Zupancic
发明人： Joseph J. Zupancic
IPC分类号： G03F7/038 , H01L21/312 , H05K1/03
CPC分类号： H05K1/0313 , G03F7/0388 , H01L21/312 , Y10T428/31678 , Y10T428/31688
摘要： A predetermined pattern of a dielectric polymer is formed on a substrate from a prepolymer which is an ether of the oligomeric condensation product of a dihydric phenol and formaldehyde having the formula ##STR1##
摘要翻译： 介电聚合物的预定图案由预聚物形成在基材上，预聚物是二元酚和甲醛的低聚缩合产物的醚，其具有式
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公开(公告)号：US5102972A
公开(公告)日：1992-04-07
申请号：US557232
申请日：1990-07-25
IPC分类号： C08G73/12
CPC分类号： C08G73/12 , C08G73/124 , C08G73/125
摘要： A class of di-ortho-substituted bismaleimides undergo uncatalyzed Michael addition with polyhydric phenols to afford chain-extended bismaleimides having a significantly wider processing window than the non-extended parent. The fully cured resins show improved fracture toughness, generally have comparable or superior dielectric constant and dielectric loss, and show no degradation in other properties such as resistance to moisture, to methylene chloride, and coefficient of thermal expansion.
摘要翻译： 一类二邻位取代的双马来酰亚胺用多元酚进行未催化的迈克尔加成以提供具有比非延伸的亲本显着更宽的加工窗口的链延伸的双马来酰亚胺。 完全固化的树脂显示出改善的断裂韧性，通常具有相当或优异的介电常数和介电损耗，并且在其它性能如耐水性，二氯甲烷和热膨胀系数方面没有降低。
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