CASE STRUCTURE FOR SERVER
    1.
    发明申请
    CASE STRUCTURE FOR SERVER 审中-公开
    服务器案例结构

    公开(公告)号:US20090102334A1

    公开(公告)日:2009-04-23

    申请号:US11876394

    申请日:2007-10-22

    CPC classification number: H05K7/1487 H05K5/0221

    Abstract: A case structure suitable for a server is provided, which includes a first plate and a second plate. A fixing pillar is disposed on the first plate, and the second plate has a fixing rack with a locking portion and an assembly spring with a lock cooperating hole for being penetrated by the fixing pillar. The locking portion is used to lock an engaging portion of the fixing pillar so as to fix the second plate to an assembly position. When the assembly spring is activated by forces and departs from the fixing pillar, the second plate can be shifted from the assembly position to a disassembly position and departs from the first plate.

    Abstract translation: 提供了适合于服务器的壳体结构,其包括第一板和第二板。 固定柱设置在第一板上,第二板具有带有锁定部分的固定架和具有锁定协作孔的组合弹簧,用于被固定支柱穿透。 锁定部分用于锁定固定柱的接合部分,以将第二板固定到组装位置。 当组装弹簧被力并且从固定柱离开时,第二板可以从组装位置移动到拆卸位置并从第一板离开。

    Natural tourmaline anion fiber and filter and producing method
    4.
    发明授权
    Natural tourmaline anion fiber and filter and producing method 有权
    天然电气阴离子纤维和过滤器及其制备方法

    公开(公告)号:US08231968B2

    公开(公告)日:2012-07-31

    申请号:US11416155

    申请日:2006-05-03

    Abstract: The present invention provides to a method of producing fiber from tourmaline anion fiber; of which, polypropylene or polyethylene chip, TPE and submicrometer tourmaline particle are prepared and then rolled into submicrometer tourmaline agglomerate through granulation by double screw; then, take submicrometer tourmaline agglomerate and polypropylene or polyethylene chip, of which the content of tourmaline agglomerate accounts for 1˜10% of gross weight, and TPE for 1˜40% of gross weight; tourmaline agglomerate and polypropylene or polyethylene are melted into composite fiber or filter material via spinning, such that the fiber or filter material can yield anion and present outstanding gas permeability and mechanical property.

    Abstract translation: 本发明提供一种由电气石阴离子纤维生产纤维的方法; 其中制备聚丙烯或聚乙烯芯片,TPE和亚微米电气石颗粒,然后通过双螺杆粉碎成亚微米电气石团聚体; 然后,采用亚微米电气石聚集体和聚丙烯或聚乙烯芯片,其中电气石聚集体含量占总重量的1〜10%,TPE占总重量的1〜40%; 电气石聚集体和聚丙烯或聚乙烯通过纺丝熔化成复合纤维或过滤材料,使得纤维或过滤材料可产生阴离子并具有优异的气体渗透性和机械性能。

    ANTENNA STRUCTURE
    5.
    发明申请
    ANTENNA STRUCTURE 失效
    天线结构

    公开(公告)号:US20090027275A1

    公开(公告)日:2009-01-29

    申请号:US11828934

    申请日:2007-07-26

    CPC classification number: H01Q1/38 H01Q1/242 H01Q5/371 H01Q7/00

    Abstract: An antenna structure includes a connection portion. A feed portion connecting to the connection portion defines a feed point thereon. An inductance portion extends from the connection portion, and a free end of the inductance portion connects to a ground end. A capacitance portion that is in a long narrow strip shape extends from the connection portion and is parallel with and adjacent to the ground end. And radiating portions connect to the connection portion respectively. The antenna structure employs the inductance portion, the capacitance portion and the ground end to simulate a LC parallel connection to substitute for an inductor and a capacitor. Therefore, the antenna structure achieves an aim of adjusting a resonance frequency and an impedance matching without the inductor and the capacitor, simplifying the design of the antenna structure, decreasing the manufacture cost and attaining a good performance.

    Abstract translation: 天线结构包括连接部分。 连接到连接部分的馈送部分在其上限定馈电点。 电感部分从连接部分延伸出来,电感部分的自由端连接到接地端。 长条状的电容部从连接部延伸出来,与接地端平行且相邻。 并且散热部分分别连接到连接部分。 天线结构采用电感部分,电容部分和接地端来模拟LC并联连接以代替电感器和电容器。 因此,天线结构实现了调谐谐振频率和阻抗匹配的目的,而不需要电感器和电容器,从而简化了天线结构的设计,降低了制造成本并获得了良好的性能。

    Embedded antenna
    6.
    发明申请
    Embedded antenna 审中-公开
    嵌入式天线

    公开(公告)号:US20080081574A1

    公开(公告)日:2008-04-03

    申请号:US11528506

    申请日:2006-09-28

    CPC classification number: H01Q1/243 H01Q5/364 H01Q5/371 H01Q9/0414

    Abstract: An embedded antenna used in mobile phone includes a lower and a higher frequency portions connecting with the lower frequency portion via a first connecting portion. The lower frequency portion is a bended structure in planar inverted F antenna (PIFA) shape. The higher frequency portion is a loop antenna working in two different higher frequencies, including a first higher frequency portion and a second higher frequency portion connecting with the first one via a second connecting portion. The first connecting portion defines a feeding portion and a grounding portion. The second higher frequency portion defines another grounding portion. An electric current is formed between the first and the second higher frequency portions and can heighten the gain and the frequency band of the antenna. Additionally, a loudspeaker is disposed in a receiving space formed between the lower and higher frequency portions to save space with lowest influence to the antenna.

    Abstract translation: 用于移动电话的嵌入式天线包括经由第一连接部分与较低频率部分连接的较低频率部分和较高频率部分。 较低频率部分是平面倒F天线(PIFA)形状中的弯曲结构。 较高频率部分是以两个不同的较高频率工作的环形天线,包括经由第二连接部分与第一高频部分连接的第一较高频率部分和第二较高频率部分。 第一连接部分限定了馈送部分和接地部分。 第二较高频率部分限定另一接地部分。 在第一和第二较高频率部分之间形成电流,并且可以提高天线的增益和频带。 此外,扬声器设置在形成在下部和较高频率部分之间的接收空间中,以节省对天线的影响最小的空间。

    Natural tourmaline anion fiber and filter and producing method
    7.
    发明申请
    Natural tourmaline anion fiber and filter and producing method 有权
    天然电气阴离子纤维和过滤器及其制备方法

    公开(公告)号:US20070259178A1

    公开(公告)日:2007-11-08

    申请号:US11416155

    申请日:2006-05-03

    Abstract: The present invention provides to a method of producing fiber from tourmaline anion fiber; of which, polypropylene or polyethylene chip, TPE and submicrometer tourmaline particle are prepared and then rolled into submicrometer tourmaline agglomerate through granulation by double screw; then, take submicrometer tourmaline agglomerate and polypropylene or polyethylene chip, of which the content of tourmaline agglomerate accounts for 1˜10% of gross weight, and TPE for 1˜40% of gross weight; tourmaline agglomerate and polypropylene or polyethylene are melted into composite fiber or filter material via spinning, such that the fiber or filter material can yield anion and present outstanding gas permeability and mechanical property.

    Abstract translation: 本发明提供一种由电气石阴离子纤维生产纤维的方法; 其中制备聚丙烯或聚乙烯芯片,TPE和亚微米电气石颗粒,然后通过双螺杆粉碎成亚微米电气石团聚体; 然后采用亚微米电气石聚集体和聚丙烯或聚乙烯芯片,其中电气石聚集体含量占总重量的1〜10%,TPE占总重量的1〜40%; 电气石聚集体和聚丙烯或聚乙烯通过纺丝熔化成复合纤维或过滤材料,使得纤维或过滤材料可产生阴离子并具有优异的气体渗透性和机械性能。

    Transfer method using thermal transfer film
    9.
    发明授权
    Transfer method using thermal transfer film 失效
    转印方法采用热转印膜

    公开(公告)号:US08685191B2

    公开(公告)日:2014-04-01

    申请号:US12025783

    申请日:2008-02-05

    CPC classification number: B41M5/035 B41M7/009 B44C1/1716

    Abstract: A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.

    Abstract translation: 提供至少包括基材,半固化保护层和油墨层的热转印膜。 半固化保护层涂覆在基板上,半固化保护层的材料包括热固化树脂和辐射固化树脂。 此外,半固化保护层的树脂至少部分固化。 油墨层涂覆在半固化保护层上。

    THIN MEMS MICROPHONE MODULE
    10.
    发明申请
    THIN MEMS MICROPHONE MODULE 审中-公开
    微型MEMS麦克风模块

    公开(公告)号:US20130320465A1

    公开(公告)日:2013-12-05

    申请号:US13483352

    申请日:2012-05-30

    CPC classification number: H04R1/04 H04R19/005 H04R2201/003

    Abstract: A MEMS microphone module includes a first circuit board and a second circuit board attached to the first circuit board. A MEMS chip and an ASIC chip are respectively received in one of two concavities of the first circuit board. A first ground layer of the first circuit board and a second ground layer of the second circuit board are electrically coupled to each other to define a ground shielding structure. By this way, an EMI shielding can be applied by the ground shielding structure to the MEMS chip and the ASIC chip.

    Abstract translation: MEMS麦克风模块包括第一电路板和附接到第一电路板的第二电路板。 MEMS芯片和ASIC芯片分别被接收在第一电路板的两个凹部之一中。 第一电路板的第一接地层和第二电路板的第二接地层彼此电耦合以限定接地屏蔽结构。 通过这种方式,EMI屏蔽可以通过接地屏蔽结构施加到MEMS芯片和ASIC芯片。

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