公开(公告)号：US20180204973A1

公开(公告)日：2018-07-19

申请号：US15853778

申请日：2017-12-23

Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE

Inventor： Tak JEUNG ,  Won-Sik CHOI ,  Jun-Beom PARK ,  Jong-Hyeob BAEK

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62 ,  H01L21/66 ,  H01L33/32 ,  H01L33/06

CPC classification number: H01L33/0079 ,  H01L22/20 ,  H01L25/0753 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/32 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0066

Abstract: The present invention is intended to provide a light-emitting diode (LED) structure which can be easily transferred onto another substrate, a transfer assembly whose adhesive strength with LED structures can be maintained in spite of repetitive transfer processes, LED structures and a transfer assembly for selectively transferring the LED structures, and a transfer method using the same.