PRINTED CIRCUIT BOARD COMPRISING BLIND PRESS-FIT VIAS
    2.
    发明申请
    PRINTED CIRCUIT BOARD COMPRISING BLIND PRESS-FIT VIAS 有权
    印刷电路板包括BLIND PRESS-FIT VIAS

    公开(公告)号:US20150372403A1

    公开(公告)日:2015-12-24

    申请号:US14311293

    申请日:2014-06-21

    Abstract: An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface.

    Abstract translation: 一种装置包括具有第一表面和第二表面的印刷电路板(PCB),穿过第一表面并且部分地延伸通过PCB朝向第二表面延伸的多个盲压配合通孔,盲压配合通孔被配置为 接收要连接到PCB的至少一个部件的压入连接器;以及多个电连接器,其布置在与所述盲压配合过孔相对的所述第二表面的区域中,并被配置为与设置的一个或多个信号处理部件 在第二个表面。

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