公开(公告)号：US06721511B1

公开(公告)日：2004-04-13

申请号：US09385418

申请日：1999-08-30

申请人： Kimio Tatsuno ,  Koji Yoshida ,  Kazuyuki Fukuda ,  Hiroshi Naka ,  Satoru Kikuchi

发明人： Kimio Tatsuno ,  Koji Yoshida ,  Kazuyuki Fukuda ,  Hiroshi Naka ,  Satoru Kikuchi

IPC分类号： H04B1012

CPC分类号： G02B6/12019 ,  G02B6/12009 ,  G02B6/264 ,  G02B6/2746 ,  G02B6/29361 ,  G02B6/29367 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4292

摘要： An optical communication equipment includes a semiconductor laser element, an image-forming element, an optical fiber and a substrate for mounting the semiconductor laser element, the image-forming element and the optical fiber. An optical output of the semiconductor laser element is adapted to be provided to the optical fiber via the image-forming element. The image-forming element is mounted in a V-groove formed in the substrate and having a substantially “V”-shaped cross-section. A shortest distance between a light spot of the semiconductor laser element and an optical axis of the image-forming element is 1 mm at most and the image-forming element substantially satisfies the sine condition.

摘要翻译： 光通信设备包括半导体激光元件，图像形成元件，光纤和用于安装半导体激光元件的基板，图像形成元件和光纤。 半导体激光元件的光输出适于通过图像形成元件提供给光纤。 图像形成元件安装在形成在基板中的V形槽中并且具有基本上“V”形的横截面。 半导体激光元件的光点与图像形成元件的光轴之间的最短距离最多为1mm，并且图像形成元件基本上满足正弦条件。

公开(公告)号：US06220764B1

公开(公告)日：2001-04-24

申请号：US09480478

申请日：2000-01-11

申请人： Takeshi Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

发明人： Takeshi Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

IPC分类号： G02B636

CPC分类号： G02B6/4204 ,  G02B6/3865 ,  G02B6/3873 ,  G02B6/421 ,  G02B6/4292 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

摘要翻译： 用于光学器件和光纤的光学模块由预成型塑料封装构成。 在形成塑料包装时，成型树脂的主流动方向基本上与光纤的光轴平行。 光学模块通过使用压力的注射方法模制树脂然后使树脂固化而形成。 当通过综合成型形成塑料包装时，树脂的流动方向与要安装在光学模块中的光纤的光轴方向平行。 结果，对于综合成型，施加到光纤的成型压力降低。 通过使用形成的树脂壳体，所得到的包装与树脂的流动方向相比具有高刚性和低热膨胀性，从而减小施加到光纤上的外部应力和热应力。

公开(公告)号：US07165898B2

公开(公告)日：2007-01-23

申请号：US10787086

申请日：2004-02-27

申请人： Takeshil Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

发明人： Takeshil Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

IPC分类号： G02B6/36

CPC分类号： G02B6/4204 ,  G02B6/3865 ,  G02B6/3873 ,  G02B6/421 ,  G02B6/4292 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

摘要翻译： 用于光学器件和光纤的光学模块由预成型塑料封装构成。 在形成塑料包装时，成型树脂的主流动方向基本上平行于光纤的光轴。 光学模块通过使用压力注射成型树脂然后使树脂固化而形成。 当通过综合成型形成塑料包装时，树脂的流动方向与要安装在光学模块中的光纤的光轴方向平行。 结果，对于综合成型，施加到光纤的成型压力降低。 通过使用形成的树脂壳体，所得到的包装与树脂的流动方向相比具有高刚性和低热膨胀性，从而减小施加到光纤上的外部应力和热应力。

公开(公告)号：US06457877B2

公开(公告)日：2002-10-01

申请号：US09788341

申请日：2001-02-21

申请人： Takeshil Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

发明人： Takeshil Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

IPC分类号： G02B642

CPC分类号： G02B6/4204 ,  G02B6/3865 ,  G02B6/3873 ,  G02B6/421 ,  G02B6/4292 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

摘要翻译： 用于光学器件和光纤的光学模块由预成型塑料封装构成。 在形成塑料包装时，成型树脂的主流动方向基本上平行于光纤的光轴。 光学模块通过使用压力的注射方法模制树脂然后使树脂固化而形成。 当通过综合成型形成塑料包装时，树脂的流动方向与要安装在光学模块中的光纤的光轴方向平行。 结果，对于综合成型，施加到光纤的成型压力降低。 通过使用形成的树脂壳体，所得到的包装与树脂的流动方向相比具有高刚性和低热膨胀性，从而减小施加到光纤上的外部应力和热应力。

公开(公告)号：US06726375B2

公开(公告)日：2004-04-27

申请号：US10219268

申请日：2002-08-16

申请人： Takeshil Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

发明人： Takeshil Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

IPC分类号： G02B642

CPC分类号： G02B6/4204 ,  G02B6/3865 ,  G02B6/3873 ,  G02B6/421 ,  G02B6/4292 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

摘要翻译： 用于光学器件和光纤的光学模块由预成型塑料封装构成。 在形成塑料包装时，成型树脂的主流动方向基本上平行于光纤的光轴。 光学模块通过使用压力注射成型树脂然后使树脂固化而形成。 当通过综合成型形成塑料包装时，树脂的流动方向与要安装在光学模块中的光纤的光轴方向平行。 结果，对于综合成型，施加到光纤的成型压力降低。 通过使用形成的树脂壳体，所得到的包装与树脂的流动方向相比具有高刚性和低热膨胀性，从而减小施加到光纤上的外部应力和热应力。

公开(公告)号：US06282352B1

公开(公告)日：2001-08-28

申请号：US09402585

申请日：2000-01-07

申请人： Takeshi Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

发明人： Takeshi Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

IPC分类号： G02B636

CPC分类号： G02B6/4204 ,  G02B6/3865 ,  G02B6/3873 ,  G02B6/421 ,  G02B6/4292 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

公开(公告)号：US5737467A

公开(公告)日：1998-04-07

申请号：US569915

申请日：1995-12-08

申请人： Takeshi Kato ,  Shinji Tsuji ,  Kimio Tatsuno ,  Satoru Kikuchi ,  Masahiro Ojima ,  Yoichi Yasuda

发明人： Takeshi Kato ,  Shinji Tsuji ,  Kimio Tatsuno ,  Satoru Kikuchi ,  Masahiro Ojima ,  Yoichi Yasuda

IPC分类号： G02B6/30 ,  G02B6/42 ,  G02B6/36

CPC分类号： G02B6/421 ,  G02B6/30 ,  G02B6/4242 ,  G02B6/4261 ,  G02B6/4265

摘要： An optical fiber is held in a ferrule, and then the ferrule is located in a positioning groove formed in a substrate, thereby aligning the optical fiber with an optical device bonded to a surface of the substrate. Then, a lid is placed on the substrate in such a manner that the ferrule is located in a positioning groove formed in the lid and that the optical device is received in a cavity formed in the lid. The ferrule is thus held between the two grooves, and in this condition a resin is filled in the two grooves, thereby retaining the ferrule. Then, the lid is sealingly secured to the substrate. After these parts are thus assembled together, this assembly is put in dies, and then a package is molded.

摘要翻译： 将光纤保持在套圈中，然后套圈位于形成在基板中的定位槽中，从而使光纤与结合到基板的表面的光学装置对准。 然后，将盖子放置在基板上，使得套圈位于形成在盖中的定位槽中，并且光学装置被容纳在形成在盖中的空腔中。 因此，套圈保持在两个槽之间，并且在这种情况下，树脂被填充在两个槽中，从而保持套圈。 然后，盖被密封地固定到基板上。 在将这些部件组装在一起之后，将该组件放入模具中，然后封装成型。

公开(公告)号：US06668140B2

公开(公告)日：2003-12-23

申请号：US10003527

申请日：2001-12-06

申请人： Kimio Tatsuno ,  Kouji Yoshida ,  Takeshi Kato ,  Toshinori Hirataka ,  Norihiro Yazaki ,  Shoichi Takahashi ,  Hiroshi Naka

发明人： Kimio Tatsuno ,  Kouji Yoshida ,  Takeshi Kato ,  Toshinori Hirataka ,  Norihiro Yazaki ,  Shoichi Takahashi ,  Hiroshi Naka

IPC分类号： H04B1000

CPC分类号： G02B6/4212 ,  G02B6/305 ,  G02B6/4203 ,  G02B6/4207 ,  G02B6/4224 ,  G02B6/4239

摘要： In a module for optical communication comprising an optical fiber including an axial-end surface, and an optical element including an optical surface facing to the axial-end surface in such a manner that a light is transmitted between the optical surface and the axial-end surface, a synthetic resin is arranged between the optical surface and the axial-end surface so that the light is transmitted through the synthetic resin between the optical surface and the axial-end surface.

摘要翻译： 在一种用于光通信的模块中，包括包括轴向端面的光纤和包括面向轴向端面的光学表面的光学元件，使得光在光学表面和轴向端之间传播 表面，在光学表面和轴向端面之间设置合成树脂，使得光在光学表面和轴向端面之间透过合成树脂。

公开(公告)号：US06341027B1

公开(公告)日：2002-01-22

申请号：US09037541

申请日：1998-03-10

申请人： Kimio Tatsuno ,  Kouji Yoshida ,  Takeshi Kato ,  Toshinori Hirataka ,  Norihiro Yazaki ,  Shoichi Takahashi ,  Hiroshi Naka

发明人： Kimio Tatsuno ,  Kouji Yoshida ,  Takeshi Kato ,  Toshinori Hirataka ,  Norihiro Yazaki ,  Shoichi Takahashi ,  Hiroshi Naka

IPC分类号： H04B1000

CPC分类号： G02B6/4212 ,  G02B6/305 ,  G02B6/4203 ,  G02B6/4207 ,  G02B6/4224 ,  G02B6/4239

摘要： A module for optical communication includes an optical fiber having an axial-end surface and an optical element having an optical surface facing the axial-end surface in such a manner that light is transmitted between the optical surface and the axial-end surface. The optical surface defines a first plane that is not perpendicular to the longitudinal axis of the optical fiber. A synthetic resin is provided between the optical surface of the optical element and the axial-end surface of the optical fiber so that light is transmitted through the synthetic resin.

摘要翻译： 用于光通信的模块包括具有轴向端面的光纤和具有面向轴向端面的光学表面的光学元件，使得光在光学表面和轴向端表面之间传播。 光学表面限定不垂直于光纤纵轴的第一平面。 在光学元件的光学表面和光纤的轴向端面之间设置合成树脂，使得光透过合成树脂。

公开(公告)号：US06488416B1

公开(公告)日：2002-12-03

申请号：US09662338

申请日：2000-09-14

申请人： Masato Shishikura ,  Koji Yoshida ,  Kimio Tatsuno ,  Hirohisa Sano

发明人： Masato Shishikura ,  Koji Yoshida ,  Kimio Tatsuno ,  Hirohisa Sano

IPC分类号： G02B642

CPC分类号： G02B6/4201 ,  G02B6/4292

摘要： A conventional problem is to provide an optical module capable of being reflow mounted together with electronic components collectively, and, at the same time, securing a mechanical strength that can bear a large stress at the time of an attachment/detachment of the optical fiber. A solution to the above-mentioned problem can be attained by using an optical connector removable type optical module for reflow mounting having a fixing structure for fixing itself to a mount board, including a receptacle part installed to an optical module 19 to which an optical connector 1 is detachably connected; electric terminals 4 for reflow mounting that are arranged corresponding to lands 8 on a mount board 6; and stud parts 5 that are able to fit in fixing holes 7 on the mount board 6.

摘要翻译： 常规的问题是提供一种能够一体地与电子部件一起回流安装的光学模块，同时确保在光纤的安装/拆卸时可承受较大应力的机械强度。 对于上述问题的解决方案可以通过使用用于回流安装的光学连接器可拆卸型光学模块来实现，该光学连接器可拆卸型光学模块具有用于将自身固定到安装板上的固定结构，其包括安装到光学模块19的插座部分，光学连接器 1可拆卸地连接; 用于回流安装的电端子4，其对应于安装板6上的焊盘8; 以及能够装配在安装板6上的固定孔7中的螺柱部件5。