公开(公告)号：US20240266151A1

公开(公告)日：2024-08-08

申请号：US18617587

申请日：2024-03-26

Applicant: Lam Research Corporation

Inventor： Michael C. Kellogg ,  Adam Mace ,  Alexei Marakhtanov ,  John Holland ,  Zhigang Chen ,  Felix Kozakevich ,  Alexander Matyushkin

IPC: H01J37/32

CPC classification number: H01J37/32642

Abstract: Systems and methods for securing an edge ring to a support ring are described. The edge ring is secured to the support ring via multiple fasteners that are inserted into a bottom surface of the edge ring. The securing of the edge ring to the support ring provides stability of the edge ring during processing of a substrate within a plasma chamber. In addition, the securing of the edge ring to the support ring secures the edge ring to the plasma chamber because the support ring is secured to an insulator ring, which is connected to an insulator wall of the plasma chamber. Moreover, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms during the processing of the substrate and are pushed up vertically using the clasp mechanisms to remove the edge ring and the support ring from the plasma chamber.

公开(公告)号：US20240162015A1

公开(公告)日：2024-05-16

申请号：US18405997

申请日：2024-01-05

Applicant: Lam Research Corporation

Inventor： Michael C. Kellogg ,  Adam Mace ,  Alexei Marakhtanov ,  John Holland ,  Zhigang Chen ,  Felix Kozakevich ,  Alexander Matyushkin

IPC: H01J37/32

CPC classification number: H01J37/32642

Abstract: Systems and methods for securing an edge ring to a support ring are described. The edge ring is secured to the support ring via multiple fasteners that are inserted into a bottom surface of the edge ring. The securing of the edge ring to the support ring provides stability of the edge ring during processing of a substrate within a plasma chamber. In addition, the securing of the edge ring to the support ring secures the edge ring to the plasma chamber because the support ring is secured to an insulator ring, which is connected to an insulator wall of the plasma chamber. Moreover, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms during the processing of the substrate and are pushed up vertically using the clasp mechanisms to remove the edge ring and the support ring from the plasma chamber.

公开(公告)号：US20210354231A1

公开(公告)日：2021-11-18

申请号：US17281949

申请日：2019-09-17

Applicant: Lam Research Corporation

Inventor： Adam Mace

IPC: B23K20/233 ,  B23K20/12

Abstract: Systems and methods for joining a substrate of metallic material to a substrate of ceramic material using friction stir welding are provided. In one example, a method includes arranging an edge of the substrate of metallic material next to an edge of the substrate of ceramic material, and advancing a spinning engagement element of a friction stir welding tool through an edge zone of the substrate of metallic material located adjacent the edge of the substrate of metallic material, thereby to form a friction stir weld between the substrate of metallic material and the substrate of ceramic material. The method may also include advancing the spinning engagement element through the edge zone of the substrate of metallic material without touching, by the engagement element, the edge of the substrate of ceramic material.

公开(公告)号：US20140217895A1

公开(公告)日：2014-08-07

申请号：US13756986

申请日：2013-02-01

Applicant: LAM RESEARCH CORPORATION

Inventor： Matt Busche ,  Adam Mace ,  Michael Kang ,  Allan Ronne

IPC: H01J37/32

CPC classification number: H01J37/32522 ,  H01J37/32119

Abstract: A temperature controlled dielectric window of an inductively coupled plasma processing chamber includes a dielectric window forming a top wall of the plasma processing chamber having at least first and second channels therein. A liquid circulating system includes a source of cold liquid circulating in a first closed loop which is not in fluid communication with the channels, a source of hot liquid circulating in a second closed loop which is in fluid communication with the channels, and first and second heat exchangers. The cold liquid passes through the first heat exchanger at a controllable flow rate and temperature of the hot liquid is adjusted by heat exchange with the cold liquid as the hot liquid passes through the first heat exchanger and then through the inlet of the first channel. The cold liquid passes through the second heat exchanger at a controllable flow rate and temperature of the hot liquid is adjusted by heat exchange with the cold liquid as the hot liquid passes through the second heat exchanger and then through the inlet of the second channel.

Abstract translation: 电感耦合等离子体处理室的温度控制电介质窗包括形成等离子体处理室的顶壁的电介质窗口，其中至少具有第一和第二通道。 液体循环系统包括在与通道不流体连通的第一闭环中循环的冷液体源，在与通道流体连通的第二闭环中循环的热液体源，以及第一和第二 热交换器。 冷液体以可控的流速通过第一热交换器，当热液体通过第一热交换器然后通过第一通道的入口时，通过与冷液体的热交换来调节热液体的温度。 冷液体以可控的流速通过第二热交换器，当热液体通过第二热交换器然后通过第二通道的入口时，通过与冷液体的热交换来调节热液体的温度。

公开(公告)号：US20220005675A1

公开(公告)日：2022-01-06

申请号：US17293002

申请日：2019-11-19

Applicant: Lam Research Corporation

Inventor： Anthony de la Llera ,  Adam Mace

IPC: H01J37/32

Abstract: In some examples, a substrate processing system comprises a processing chamber, a dual-phase cooling system, and a back-pressure regulator which regulates the pressure of the dual-phase coolant. The dual-phase cooling system regulates the temperature of the processing chamber or a first component thereof. The dual-phase cooling system includes a cooling loop in thermal communication with the processing chamber or the component. The cooling loop contains a dual-phase coolant in fluid communication with a heat exchanger. The processing chamber or the first component includes a top plate or a cool plate comprising one or more e passageways forming part of the cooling loop.

公开(公告)号：US08970114B2

公开(公告)日：2015-03-03

申请号：US13756986

申请日：2013-02-01

Applicant: Lam Research Corporation

Inventor： Matt Busche ,  Adam Mace ,  Michael Kang ,  Allan Ronne

IPC: H01J7/24 ,  H01J37/32

CPC classification number: H01J37/32522 ,  H01J37/32119

Abstract: A temperature controlled dielectric window of an inductively coupled plasma processing chamber includes a dielectric window forming a top wall of the plasma processing chamber having at least first and second channels therein. A liquid circulating system includes a source of cold liquid circulating in a first closed loop which is not in fluid communication with the channels, a source of hot liquid circulating in a second closed loop which is in fluid communication with the channels, and first and second heat exchangers. The cold liquid passes through the first heat exchanger at a controllable flow rate and temperature of the hot liquid is adjusted by heat exchange with the cold liquid as the hot liquid passes through the first heat exchanger and then through the inlet of the first channel. The cold liquid passes through the second heat exchanger at a controllable flow rate and temperature of the hot liquid is adjusted by heat exchange with the cold liquid as the hot liquid passes through the second heat exchanger and then through the inlet of the second channel.

Abstract translation: 电感耦合等离子体处理室的温度控制电介质窗包括形成等离子体处理室的顶壁的电介质窗口，其中至少具有第一和第二通道。 液体循环系统包括在与通道不流体连通的第一闭环中循环的冷液体源，在与通道流体连通的第二闭环中循环的热液体源，以及第一和第二 热交换器。 冷液体以可控的流速通过第一热交换器，当热液体通过第一热交换器然后通过第一通道的入口时，通过与冷液体的热交换来调节热液体的温度。 冷液体以可控的流速通过第二热交换器，当热液体通过第二热交换器然后通过第二通道的入口时，通过与冷液体的热交换来调节热液体的温度。