公开(公告)号：US20220277928A1

公开(公告)日：2022-09-01

申请号：US17628282

申请日：2020-07-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Changyou JING ,  Benny WU ,  Oleksandr MIKHNENKO ,  Slobodan MITROVIC

IPC: H01J37/32

Abstract: Systems and methods of the disclosure perform in situ sensing and real time compensation of various non-uniformities in substrate processing systems. A plasma non-uniformity is sensed by determining a temperature distribution across a matrix of a plurality of micro-heaters disposed in the substrate support. Alternatively, the plasma non-uniformity is sensed by determining heat flux through the substrate support using the matrix heaters and one or more heaters used to heat one or more zones of the substrate support. The plasma non-uniformity is compensated by adjusting one or more parameters such as power supplied to the matrix heaters, RF power supplied to generate plasma, chemistry and/or flow rate of gas or gases used to generate plasma, settings of thermal control units or chillers, and so on. Additionally, non-uniformities inherent in the substrate support are sensed using the zone and matrix heaters and are compensated by adjusting the one or more parameters.

公开(公告)号：US20220246404A1

公开(公告)日：2022-08-04

申请号：US17617271

申请日：2020-06-10

Applicant: Lam Research Corporation

Inventor： Benjamin Philip HEINE ,  Darrell EHRLICH ,  Robin KOSHY ,  Slobodan MITROVIC ,  John DAUGHERTY

IPC: H01J37/32 ,  H01L21/683 ,  C23C14/12 ,  C23C14/58

Abstract: A component for use in a plasma processing chamber is provided. A metal containing component body is provided. A sealant coating is over a surface of the metal containing component body, wherein the sealant coating comprises at least one of a silicone sealant, an organic sealant, or epoxy sealant, wherein the sealant coating is not covered and directly exposed to plasma in the plasma processing chamber.

公开(公告)号：US20220130705A1

公开(公告)日：2022-04-28

申请号：US17429909

申请日：2020-02-14

Applicant: Lam Research Corporation

Inventor： Jeremy George SMITH ,  Oleksandr MIKHNENKO ,  Slobodan MITROVIC

IPC: H01L21/683 ,  H01J37/32 ,  C23C16/455 ,  C23C16/458 ,  C23C16/02

Abstract: An electrostatic chuck (ESC) is provided. An ESC body is provided. An organic coating is disposed on at least a surface of the ESC body

公开(公告)号：US20210292893A1

公开(公告)日：2021-09-23

申请号：US17261812

申请日：2019-07-19

Applicant: Lam Research Corporation

Inventor： Slobodan MITROVIC ,  Jeremy George SMITH ,  Tony Shaleen KAUSHAL ,  Eric A. PAPE

IPC: C23C16/44 ,  C23C16/455 ,  H01J37/32 ,  C25D11/24 ,  C23C16/40

Abstract: A method for coating a component of a plasma processing chamber is provided. An electrolytic oxidation coating is formed over a surface of the component, wherein the electrolytic oxidation coating has a plurality of pores, wherein the electrolytic oxidation coating has a thickness and at least some of the plurality of pores extends through the thickness of the electrolytic oxidation coating. An atomic layer deposition is deposited on the electrolytic oxidation coating. The atomic layer deposition comprises a plurality of cycles, where each cycle comprises flowing a first reactant, wherein the first reactant forms a first reactant layer in the pores of the electrolytic oxidation coating, wherein the first reactant layer extends through the thickness of the electrolytic oxidation coating, stopping the flow of the first reactant, flowing a second reactant, wherein the second reactant reacts with the first reactant layer, and stopping the flow of the second reactant.

公开(公告)号：US20250069866A1

公开(公告)日：2025-02-27

申请号：US18940259

申请日：2024-11-07

Applicant: LAM RESEARCH CORPORATION

Inventor： Changyou JING ,  Benny WU ,  Oleksandr MIKHNENKO ,  Slobodan MITROVIC

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/48 ,  H01L21/67 ,  H01L21/683

Abstract: Systems and methods of the disclosure perform in situ sensing and real time compensation of various non-uniformities in substrate processing systems. A plasma non-uniformity is sensed by determining a temperature distribution across a matrix of a plurality of micro-heaters disposed in the substrate support. Alternatively, the plasma non-uniformity is sensed by determining heat flux through the substrate support using the matrix heaters and one or more heaters used to heat one or more zones of the substrate support. The plasma non-uniformity is compensated by adjusting one or more parameters such as power supplied to the matrix heaters, RF power supplied to generate plasma, chemistry and/or flow rate of gas or gases used to generate plasma, settings of thermal control units or chillers, and so on. Additionally, non-uniformities inherent in the substrate support are sensed using the zone and matrix heaters and are compensated by adjusting the one or more parameters.

公开(公告)号：US20230274954A1

公开(公告)日：2023-08-31

申请号：US18013445

申请日：2021-08-02

Applicant: LAM RESEARCH CORPORATION

Inventor： Harmeet SINGH ,  Slobodan MITROVIC ,  Darrell EHRLICH ,  Benny WU

IPC: H01L21/67 ,  H05B3/28

CPC classification number: H01L21/67103 ,  H01L21/67248 ,  H05B3/283

Abstract: A substrate support assembly for supporting a substrate includes a baseplate, a ceramic plate arranged on the baseplate, and N resistive heaters arranged in X rows and Y columns and coupled to the ceramic plate. X, Y, and N are integers greater than 1, and N is less than or equal to X*Y. Each of the N resistive heaters have a first terminal and a second terminal. The ceramic plate includes Y conductors arranged in a first layer of the ceramic plate, and X conductors arranged in a second layer of the ceramic plate. The first terminals of each resistive heater in one of the X rows are directly connected to the Y conductors, respectively, by first vias. Second terminals of each resistive heater in the one of the X rows are directly connected to one of the X conductors by second vias.