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公开(公告)号：US20240014098A1
公开(公告)日：2024-01-11
申请号：US18332816
申请日：2023-06-12
IPC分类号： H01L23/373 , G06F1/20
CPC分类号： H01L23/3733 , G06F1/20
摘要： A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.
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公开(公告)号：US20230266816A1
公开(公告)日：2023-08-24
申请号：US18159797
申请日：2023-01-26
IPC分类号： G06F1/3296
CPC分类号： G06F1/3296
摘要： An information processing apparatus includes: a processor with variable rated power; and a power control unit which controls power consumption of the processor. When processing based on a specific application as an application program to implement a specific function is executed in foreground, the power control unit sets rated power corresponding to at least the specific function.
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公开(公告)号：US11723170B2
公开(公告)日：2023-08-08
申请号：US17644111
申请日：2021-12-14
CPC分类号： H05K7/20154 , G06F1/1616 , G06F1/1626 , G06F1/1681 , H05K5/0017 , H05K5/0226
摘要： An electronic apparatus includes a first chassis having a heat generating element, a second chassis, a hinge device that connects the first chassis and the second chassis such that the first chassis and the second chassis can be rotated relative to each other between a 0-degree attitude and a 180-degree attitude, and a display provided across the first chassis and the second chassis. The hinge device has a metal hinge main body, a metal first support plate provided to be relatively movable with respect to the inner surface of the first chassis, and a metal second support plate provided to be relatively movable with respect to the inner surface of the second chassis. The electronic apparatus further includes a flexible heat conductive member in the first chassis. The heat conductive member thermally connects a heat receiving member that receives heat from a heat generating element, and the first support plate.
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公开(公告)号：US20230069684A1
公开(公告)日：2023-03-02
申请号：US17805043
申请日：2022-06-02
摘要： An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.
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公开(公告)号：US20220015260A1
公开(公告)日：2022-01-13
申请号：US17358772
申请日：2021-06-25
摘要： A cooling module reduces the number of parts and achieves weight reduction. An electronic apparatus includes: the cooling module; a chassis; first and second heating elements provided inside the chassis; and a cooling module configured to absorb heat generated by the first and second heating elements. The cooling module includes: a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate having an outer shape larger than that of the first metal plate; a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene.
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公开(公告)号：US10831247B2
公开(公告)日：2020-11-10
申请号：US15671467
申请日：2017-08-08
IPC分类号： G06F1/20 , F28D15/02 , F28F1/20 , F28F3/02 , F28F7/02 , G06F1/16 , H01L23/427 , H05K7/20 , F28F3/06 , H01L23/367 , H01L23/467
摘要： There is provided an electronic apparatus that includes a heat radiation unit capable of radiating heat efficiently from a heat pipe. The electronic apparatus includes: a blower fan that blows air toward an exhaust port formed in a main body chassis; a heat radiation fin provided in an air-blowing outlet of the blower fan; and a heat pipe fixed to the heat radiation fin. In a region in contact with the heat pipe, the heat radiation fin is of a partial connection structure in which multiple fin members are partially fixed and connected to one another, and in a region with no contact with the heat pipe, the heat radiation fin is a structure of continuous fins.
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公开(公告)号：US10681840B2
公开(公告)日：2020-06-09
申请号：US16022656
申请日：2018-06-28
摘要： The present invention aims to reduce noise derived from an operation sound of a fan while maintaining cooling capacity of the fan. A cooling system includes a fan which is disposed in a chassis in which a CPU which is exemplified as a heating element is housed, one temperature sensor which is disposed in the chassis, another temperature sensor which is disposed at a position which is different from a position of the one temperature sensor, and a fan control unit which drives the fan in a case where one temperature, which is based on a measured value of one temperature sensor, is at least a first threshold value or in a case where another temperature, which is based on a measured value of the other temperature sensor, is at least a second threshold value which is set to a value lower than the first threshold value.
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公开(公告)号：US10546799B2
公开(公告)日：2020-01-28
申请号：US16040317
申请日：2018-07-19
发明人： Akinori Uchino , Kazuo Fujii , Takuroh Kamimura , Kenji Watamura , Hiroshi Yamazaki , Takanori Hoshino
IPC分类号： G06F1/16 , H01L23/427 , G06F1/20 , G06F1/18
摘要： An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.
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公开(公告)号：US10401925B2
公开(公告)日：2019-09-03
申请号：US15365277
申请日：2016-11-30
摘要： An electronic apparatus having a cooling device that can reduce size and cost thereof while maintaining sufficient cooling performance of cooling a portable information apparatus is disclosed. The electronic apparatus includes a portable information apparatus and a cooling device. The portable information apparatus includes a heat-dissipation heat sink thermally connected to a heating body. The cooling device includes a cooling unit for absorbing heat from the heating body. The cooling unit includes a heat-receiving heat sink that is thermally connected to a heat-dissipation heat sink when the portable information apparatus is connected to the cooling device, and a radiator that dissipates heat absorbed in the heat-receiving heat sink to outside. The radiator is disposed on an exhaust path from an air outlet of the portable information apparatus while the portable information apparatus is connected to the cooling device.
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公开(公告)号：US10356947B2
公开(公告)日：2019-07-16
申请号：US15634844
申请日：2017-06-27
摘要： An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20.
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