公开(公告)号：US20240023294A1

公开(公告)日：2024-01-18

申请号：US18215365

申请日：2023-06-28

Applicant: LG ELECTRONICS INC.

Inventor： Heejoong JANG ,  Dongkeun YANG ,  Hyoungsuk Woo ,  Jihye YI

IPC: H05K7/20 ,  H01M10/42 ,  H01M10/613 ,  H01M10/6554 ,  H01M10/6556 ,  H01M10/6568 ,  H01M10/63 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01M10/425 ,  H01M10/613 ,  H01M10/6554 ,  H01M10/6556 ,  H01M10/6568 ,  H01M10/63 ,  H01L23/473 ,  H05K7/20945 ,  H05K7/20909 ,  H01M2010/4271 ,  H02J7/0069

Abstract: An energy storage system may include a plurality of cooling plates disposed in contact with the plurality of semiconductor devices on a power conditioning system (PCS) circuit board, a cooling module including a pump for flowing a coolant, a first flow path connected to the cooling plates and the cooling module, through which a coolant discharged from the cooling module flows, and a second flow path connected to the cooling plates and the cooling module, through which a coolant discharged from the cooling plates flows. Each of the cooling plates includes an internal flow path including a first channel connected to the first flow path and a second channel connected to the first channel and the second flow path, and an area occupied by the first channel is larger than an area occupied by the second channel in a first area in contact with the semiconductor devices.