公开(公告)号：US10903410B2

公开(公告)日：2021-01-26

申请号：US16402582

申请日：2019-05-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang Cho ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Jong Bae Shin ,  Boone Won ,  Jong Min Lee

IPC: H01L35/32 ,  H01L35/30

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

公开(公告)号：US09947854B2

公开(公告)日：2018-04-17

申请号：US14913220

申请日：2014-08-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang Cho ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Jong Bae Shin ,  Boone Won ,  Jong Min Lee

IPC: H01L35/26 ,  H01L35/32 ,  H01L35/30

CPC classification number: H01L35/325 ,  H01L35/30 ,  H01L35/32

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

公开(公告)号：US10326070B2

公开(公告)日：2019-06-18

申请号：US15914116

申请日：2018-03-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang Cho ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Jong Bae Shin ,  Boone Won ,  Jong Min Lee

IPC: H01L35/32 ,  H01L35/30

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

公开(公告)号：US20160204325A1

公开(公告)日：2016-07-14

申请号：US14913530

申请日：2014-08-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang Cho ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Jong Bae Shin ,  Boone Won ,  Jong Min Lee

IPC: H01L35/04 ,  H01L35/16 ,  H01L35/30

CPC classification number: H01L35/04 ,  H01L35/16 ,  H01L35/30

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module, and may provide a thermoelectric element and a thermoelectric module having notably improved cooling capacity (Qc) and rate of temperature change (AT) to be provided by constructing the thermoelectric element by stacking unit members, each of which comprises a semiconductor layer on a substrate, thereby lowering thermal conductivity and raising electric conductivity.

Abstract translation: 本发明的实施例涉及一种热电元件和热电模块，并且可以提供一种热电元件和热电模块，其具有明显提高的冷却能力（Qc）和温度变化率（AT），其通过构造热电元件 通过堆叠单元构件，每个单元构件在衬底上包括半导体层，从而降低导热性并提高导电性。

公开(公告)号：US20150333246A1

公开(公告)日：2015-11-19

申请号：US14710946

申请日：2015-05-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Min Lee ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Joong Hyun Park ,  Hyung Min Sohn ,  Jong Bae Shin ,  Boone Won ,  Yong Sang Cho ,  Yun Kyoung Jo

IPC: H01L35/32 ,  H01L35/30

CPC classification number: H01L35/30 ,  H01L35/32

Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.

Abstract translation: 提供一种热转换装置，包括：单元热电模块，包括第一半导体元件和第二半导体元件; 以及通过与所述单元热电模块接触来进行热转换的热转换模块，其中所述热转换模块包括：热转换衬底，其与所述第一半导体元件的一端和另一端中的至少任一个直接接触 或第二半导体元件; 以及设置在所述热转换基板上的辐射单元。