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公开(公告)号：US09947854B2
公开(公告)日：2018-04-17
申请号：US14913220
申请日：2014-08-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho , Sang Gon Kim , Sook Hyun Kim , Chae Hoon Kim , Myoung Lae Roh , Jong Bae Shin , Boone Won , Jong Min Lee
CPC classification number: H01L35/325 , H01L35/30 , H01L35/32
Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
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公开(公告)号：US20160218266A1
公开(公告)日：2016-07-28
申请号：US14917162
申请日：2014-09-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Gon Kim , Yong Sang Cho , Boone Won , Hyung Eui Lee
Abstract: Embodiments of the present invention relate to a thermoelectric module used for cooling, and provide a thermoelectric module comprising: substrates facing each other; and a first semiconductor element and a second semiconductor element arranged between the substrates and electrically connected to each other, wherein the first semiconductor element and the second semiconductor element have mutually different volumes. The present invention has a structure allowing the cooling effect to be raised by having, in a unit cell comprising thermoelectric semiconductor elements, any one from among the semiconductor elements facing each other to have a volume greater than the other to enhance the rise in electrical conductivity.
Abstract translation: 本发明的实施例涉及一种用于冷却的热电模块，并且提供一种热电模块，包括：彼此面对的基板; 以及布置在所述基板之间并彼此电连接的第一半导体元件和第二半导体元件，其中所述第一半导体元件和所述第二半导体元件具有相互不同的体积。 本发明具有通过在包含热电半导体元件的单电池中彼此面对的半导体元件中的任何一个具有大于另一个半导体元件的体积而增加导电性的升高的结构，从而提高冷却效果 。
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公开(公告)号：US20180094823A1
公开(公告)日：2018-04-05
申请号：US15562708
申请日：2016-03-30
Applicant: LG Innotek Co., Ltd.
Inventor： Jong Min Lee , Yong Sang Cho
Abstract: Provided is a dehumidifier including: a dehumidification module including a compressor unit for compressing a refrigerant, a cooling unit for cooling air through the refrigerant, and a drying unit for drying air that passes through the cooling unit; and a thermoelectric module including a first substrate, a second substrate disposed to face the first substrate, a thermoelectric element disposed between the first substrate and the second substrate, a first heat conversion unit connected to the first substrate and disposed adjacent to the drying unit of the dehumidification module, and a second heat conversion unit connected to the second substrate and disposed adjacent to the cooling unit of the dehumidification module.
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公开(公告)号：US09903620B2
公开(公告)日：2018-02-27
申请号：US14622129
申请日：2015-02-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Sang Cho
CPC classification number: F25B21/04 , F24F5/0042 , H01L35/30
Abstract: Provided is a heat conversion device including a thermoelectric element, the heat conversion device capable of implementing a heat conversion function of high efficiency in spite of low power consumption by disposing a heat absorption module and a heat emission module in a horizontal direction in a structure of a heat exchange device to which a thermoelectric module is applied, and by implementing a heat conversion effect for air while maintaining a desired air volume and air velocity without flow path resistance.
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公开(公告)号：US12156470B2
公开(公告)日：2024-11-26
申请号：US17620442
申请日：2020-06-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Lae Roh , Jin Gyeong Park , Yong Sang Cho
Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first insulating layer disposed on the first substrate, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer, and a semiconductor structure disposed on the first electrode, wherein the first insulating layer includes an uneven portion, a partial region of the first electrode is buried in the second insulating layer, the second insulating layer includes a concave portion which is concave in a direction toward the first insulating layer from a side surface of the first electrode, and the concave portion vertically overlaps the uneven portion.
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Patent Agency Ranking
公开(公告)号：US12063860B2
公开(公告)日：2024-08-13
申请号：US17041695
申请日：2019-04-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Lae Roh , Jong Min Lee , Yong Sang Cho
IPC: H10N10/856 , H10N10/17 , H10N10/817
CPC classification number: H10N10/17 , H10N10/856
Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metal substrate; a first resin layer disposed on the first metal substrate and in direct contact with the first metal substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metal substrate disposed on the second resin layer, wherein the first resin layer comprises a polymeric resin and an inorganic filler and at least a part of side surfaces of the plurality of first electrodes are embedded in the first resin layer.
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公开(公告)号：US11469361B2
公开(公告)日：2022-10-11
申请号：US16766856
申请日：2018-11-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Min Lee , Yong Sang Cho , Jong Hyun Kang
IPC: H01L35/32
Abstract: Disclosed is an embodiment is a thermoelectric module comprising: a first thermally conductive plate; a thermoelectric element arranged on the first thermally conductive plate; a second thermally conductive plate arranged on the thermoelectric element; and a cover frame, which is arranged on the first thermally conductive plate, and has an accommodation space such that the thermoelectric element is accommodated in the accommodation space, wherein the thermoelectric element includes: a first substrate; a plurality of thermoelectric legs arranged on the first substrate; a second substrate arranged on the plurality of thermoelectric legs; and electrodes comprising a plurality of first electrodes arranged between the first substrate and the plurality of thermoelectric legs; and a plurality of second electrodes arranged between the second substrate and the plurality of thermoelectric legs, and the cover frame includes: an outer frame arranged to be spaced from the thermoelectric element on the first thermally conductive plate; and an upper frame extending toward the second thermally conductive plate so as to be inclined from the upper end of the outer frame toward the downward direction thereof.
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公开(公告)号：US11417816B2
公开(公告)日：2022-08-16
申请号：US16962606
申请日：2019-01-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Lae Roh , Jong Min Lee , Yong Sang Cho
Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metallic substrate; a first resin layer which is disposed on the first metallic substrate and comes in direct contact with the first metallic substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metallic substrate disposed on the second resin layer, wherein a surface of the first metallic substrate that faces the first resin layer comprises a first region and a second region disposed inside the first region, wherein a surface roughness of the second region is greater than a surface roughness of the first region, wherein the first resin layer is disposed on the second region.
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公开(公告)号：US11355689B2
公开(公告)日：2022-06-07
申请号：US17287654
申请日：2019-10-23
Applicant: LG INNOTEK CO., LTD.
Inventor： Jin Gyeong Park , Jeung Ook Park , Yong Sang Cho
Abstract: A thermoelectric module according to one embodiment of the present invention comprises: a first substrate; a thermoelectric element disposed on the first substrate; a second substrate disposed on the thermoelectric element and having a smaller area than the first substrate; a sealing part disposed on the first substrate and surrounding a side surface of the thermoelectric element; and a wire part connected to the thermoelectric element, drawn out through the sealing part, and supplying power to the thermoelectric element, wherein the sealing part has a through hole through which the wire part passes, and the through hole is disposed closer to the second substrate than the first substrate.
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公开(公告)号：US20160290684A1
公开(公告)日：2016-10-06
申请号：US15086771
申请日：2016-03-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Min Lee , Yong Sang Cho , Boone Won
CPC classification number: F25B21/04 , F24F5/0042 , H01L35/02 , H01L35/16 , H01L35/18 , H01L35/30 , H01L35/32
Abstract: A thermoelectric converter capable of improving cooling efficiency. The thermoelectric converter includes a first thermoelectric module including a first substrate, a second substrate disposed to face the first substrate, and a first thermoelectric element disposed between the first substrate and the second substrate; first and second thermoelectric conversion members disposed on the first and second substrates, respectively; a second thermoelectric module including a third substrate, a fourth substrate disposed to face the third substrate, and a second thermoelectric element disposed between the third substrate and the fourth substrate; third and fourth thermoelectric conversion members disposed on the third and fourth substrates, respectively; wherein the first and third substrates may be heat generation substrates, the second and fourth substrates may be heat absorption substrates, and the first and second thermoelectric modules may be arranged in a structure in which the second and fourth substrates face each other.
Abstract translation: 一种能够提高冷却效率的热电转换器。 热电转换器包括：第一热电模块，包括第一基板，设置成面对第一基板的第二基板;以及设置在第一基板和第二基板之间的第一热电元件; 分别设置在第一和第二基板上的第一和第二热电转换部件; 第二热电模块，包括第三基板，设置成面对第三基板的第四基板和设置在第三基板和第四基板之间的第二热电元件; 分别设置在第三和第四基板上的第三和第四热电转换构件; 其中第一和第三基板可以是发热基板，第二和第四基板可以是吸热基板，并且第一和第二热电模块可以布置成第二和第四基板彼此面对的结构。
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