公开(公告)号：US10103286B2

公开(公告)日：2018-10-16

申请号：US15438164

申请日：2017-02-21

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Ching-I Lin ,  Ming-Te Tu

IPC: H01L31/173 ,  H01L31/18 ,  H01L33/58 ,  H01L31/0232 ,  H01L33/54 ,  H01L31/0203 ,  H01L33/52

Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively and are separated from each other. The cap is disposed on the bearing surface and the packaging gel bodies, fastened to the bearing surface and the packaging gel bodies by adhesive, and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.

公开(公告)号：US10090427B2

公开(公告)日：2018-10-02

申请号：US15434667

申请日：2017-02-16

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Ching-I Lin ,  Ming-Te Tu

IPC: H01L33/00 ,  H01L31/00 ,  H01L31/173 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/60 ,  H01L33/54

Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, a cap, and two sheltering devices. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively. The top surface of each of the packaging gel bodies is formed with a lens portion and a shoulder portion. The cap is formed on the bearing surface and the packaging gel bodies and provided with a light-emitting hole and a light-receiving hole accommodating the lens portions and the shoulder portions of the top surfaces of the packaging gel bodies respectively. The two sheltering devices are disposed on the shoulder portions respectively for blocking light from passing through the shoulder portions.

公开(公告)号：US10396234B2

公开(公告)日：2019-08-27

申请号：US15830284

申请日：2017-12-04

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Ching-I Lin ,  Ming-Te Tu

IPC: H01L31/173 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/58 ,  H01L33/54 ,  H01L25/16

Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively and are separated from each other. The cap is disposed on the bearing surface and the packaging gel bodies, fastened to the bearing surface and the packaging gel bodies by adhesive, and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.

公开(公告)号：US20180190858A1

公开(公告)日：2018-07-05

申请号：US15830284

申请日：2017-12-04

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Ching-I Lin ,  Ming-Te Tu

IPC: H01L31/173 ,  H01L31/18 ,  H01L33/58 ,  H01L33/54 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H01L31/173 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/18 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L2933/005 ,  Y02P70/521

Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively and are separated from each other. The cap is disposed on the bearing surface and the packaging gel bodies, fastened to the bearing surface and the packaging gel bodies by adhesive, and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.