公开(公告)号：US20230044413A1

公开(公告)日：2023-02-09

申请号：US17786269

申请日：2020-12-01

Applicant: LINTEC Corporation

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Tsuyoshi MUTO

IPC: H01L35/26 ,  H01L35/32 ,  H01L35/34

Abstract: Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.

公开(公告)号：US20240023441A1

公开(公告)日：2024-01-18

申请号：US18034430

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Wataru MORITA ,  Mutsumi MASUMOTO

IPC: H10N10/01 ,  H10N10/17 ,  H10N10/857

CPC classification number: H10N10/01 ,  H10N10/17 ,  H10N10/857

Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).

公开(公告)号：US20230139556A1

公开(公告)日：2023-05-04

申请号：US17915549

申请日：2021-03-19

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Tsuyoshi MUTO

IPC: H10N10/17

Abstract: Provided is a thermoelectric conversion module in which heat dissipation is further improved with a simple structure. The thermoelectric conversion module is a thermoelectric conversion module including a first electrode, a P-type thermoelectric element layer and an N-type thermoelectric element layer, and a second electrode disposed opposite the first electrode. The thermoelectric conversion module includes a plurality of PN-junction pairs in which the P-type thermoelectric element layer and the N-type thermoelectric element layer are PN-joined through the first electrode or the second electrode, the plurality of PN-junction pairs being electrically connected in series alternately by the first electrode and the second electrode. An area of the second electrode is larger than an area of the first electrode.

公开(公告)号：US20210391523A1

公开(公告)日：2021-12-16

申请号：US17282047

申请日：2019-10-02

Applicant: LINTEC CORPORATION

Inventor： Tsuyoshi MUTO ,  Kunihisa KATO ,  Taku NEMOTO ,  Wataru MORITA ,  Yuta SEKI

IPC: H01L35/34 ,  H01L35/32

Abstract: A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.

公开(公告)号：US20230380288A1

公开(公告)日：2023-11-23

申请号：US18034442

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Wataru MORITA ,  Katsuhiko HORIGOME ,  Mutsumi MASUMOTO

IPC: H10N10/17

CPC classification number: H10N10/17

Abstract: Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material, and both surfaces of the thermoelectric conversion module are provided with no base material.

公开(公告)号：US20230200240A1

公开(公告)日：2023-06-22

申请号：US18000109

申请日：2021-05-26

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Wataru MORITA ,  Kunihisa KATO

IPC: H10N10/817 ,  H10N10/01 ,  H10N10/17

CPC classification number: H10N10/817 ,  H10N10/01 ,  H10N10/17

Abstract: A thermoelectric conversion module including, a first substrate having a first electrode, a second substrate having a second electrode, a chip of a thermoelectric conversion material made from a thermoelectric semiconductor composition, a first bonding material layer made from a first bonding material and bonding one surface of the chip of the thermoelectric conversion material and the first electrode, and a second bonding material layer made from a second bonding material and bonding another surface of the chip of the thermoelectric conversion material and the second electrode. A melting point of the second bonding material is lower than a melting point of the first bonding material, or the melting point of the second bonding material is lower than a curing temperature of the first bonding material.