公开(公告)号：US20230044413A1

公开(公告)日：2023-02-09

申请号：US17786269

申请日：2020-12-01

Applicant: LINTEC Corporation

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Tsuyoshi MUTO

IPC: H01L35/26 ,  H01L35/32 ,  H01L35/34

Abstract: Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.

公开(公告)号：US20160215172A1

公开(公告)日：2016-07-28

申请号：US15021094

申请日：2014-09-24

Applicant: LINTEC CORPORATION

Inventor： Wataru MORITA ,  Kunihisa KATO ,  Tsuyoshi MUTOU

IPC: C09J7/00 ,  H01L35/32 ,  C09J9/02

CPC classification number: C09J7/00 ,  C08G18/6229 ,  C08G18/6254 ,  C08G18/8116 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/385 ,  C08K2201/001 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  C09J175/04 ,  C09J183/04 ,  C09J201/00 ,  C09J2201/40 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2475/00 ,  C09J2483/00 ,  H01L35/30 ,  H01L35/32 ,  H01L35/34

Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

Abstract translation: 本发明提供一种导热粘合片，其可以容易地层叠在电子设备上，而不会在其间具有粘合剂层，并且可以进一步选择性地在特定方向上散热，以向电子设备的内部提供足够的温差， 制造它们以及使用该装置的电子装置。 本发明包括一种导热粘合片，其包括导热部分和导热性较差的部分，其中高导热部分和低导热部分具有粘合性，并且高导热部分和低导热部分各自 独立地构成导热性粘合片的整个厚度，或者导热性高的导热部或低导热性部中的至少一方构成导热性粘合片的厚度的一部分，以及导热性粘合片的制造方法 ，以及使用导热性粘合片的电子装置。

公开(公告)号：US20240023441A1

公开(公告)日：2024-01-18

申请号：US18034430

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Wataru MORITA ,  Mutsumi MASUMOTO

IPC: H10N10/01 ,  H10N10/17 ,  H10N10/857

CPC classification number: H10N10/01 ,  H10N10/17 ,  H10N10/857

Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).

公开(公告)号：US20230133754A1

公开(公告)日：2023-05-04

申请号：US17913487

申请日：2021-03-18

Applicant: LINTEC CORPORATION

Inventor： Toshiya YAMASAKI ,  Kunihisa KATO ,  Yuta SEKl

IPC: H10N10/852 ,  H10N10/855 ,  H10N10/857

Abstract: Provided is a thermoelectric conversion module including a thermoelectric conversion material layer that has high thermoelectric performance, the thermoelectric conversion material layer containing a thermoelectric conversion material with its electrical resistivity reduced. The thermoelectric conversion module includes the thermoelectric conversion material layer including the thermoelectric conversion material containing at least thermoelectric semiconductor particles. The thermoelectric conversion material layer has voids, and when a proportion of the area occupied by the thermoelectric conversion material within the area of a longitudinal cross-section that includes the center portion of the thermoelectric conversion material layer is defined as a filling ratio, the filling ratio is greater than 0.900 and less than 1.000.

公开(公告)号：US20160222256A1

公开(公告)日：2016-08-04

申请号：US15021854

申请日：2014-09-24

Applicant: LINTEC CORPORATION

Inventor： Kunihisa KATO ,  Wataru MORITA ,  Tsuyoshi MUTOU

IPC: C09J9/02 ,  C09J7/02 ,  H01L35/02

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/046 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C09J7/22 ,  C09J2201/122 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2483/00 ,  H01L35/02 ,  H01L35/32

Abstract: The present invention provides a thermally conductive adhesive sheet that can be laminated on an electronic device to efficiently dissipate heat and to selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a base material comprising a high thermally conductive portion and a low thermally conductive portion; and an adhesive layer, wherein the adhesive layer is laminated on one face of the base material, and the other face of the base material is composed of a face of the low thermally conductive portion opposite to a face in contact with the adhesive layer and a face of the high thermally conductive portion opposite to a face in contact with the adhesive layer, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the base material, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

Abstract translation: 本发明提供一种可以层压在电子设备上以有效散热并选择性地在特定方向上散热以向电子设备内部提供足够的温度差的导热粘合片，其制造方法 ，以及使用该装置的电子装置。 本发明包括一种导热粘合片，其包括包含高导热部分和低导热部分的基底材料; 以及粘合剂层，其中所述粘合剂层层压在所述基材的一个面上，并且所述基材的另一个面由与所述粘合剂层接触的面相对的所述低导热部分的面和 高导热部分与与粘合剂层接触的面相反的表面，或至少高导热部分或低导热部分中的至少一个构成基材厚度的一部分，以及制造 导热性粘合片，以及使用导热性粘合片的电子装置。

公开(公告)号：US20230200240A1

公开(公告)日：2023-06-22

申请号：US18000109

申请日：2021-05-26

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Wataru MORITA ,  Kunihisa KATO

IPC: H10N10/817 ,  H10N10/01 ,  H10N10/17

CPC classification number: H10N10/817 ,  H10N10/01 ,  H10N10/17

Abstract: A thermoelectric conversion module including, a first substrate having a first electrode, a second substrate having a second electrode, a chip of a thermoelectric conversion material made from a thermoelectric semiconductor composition, a first bonding material layer made from a first bonding material and bonding one surface of the chip of the thermoelectric conversion material and the first electrode, and a second bonding material layer made from a second bonding material and bonding another surface of the chip of the thermoelectric conversion material and the second electrode. A melting point of the second bonding material is lower than a melting point of the first bonding material, or the melting point of the second bonding material is lower than a curing temperature of the first bonding material.

公开(公告)号：US20210328124A1

公开(公告)日：2021-10-21

申请号：US17271057

申请日：2019-08-27

Applicant: LINTEC CORPORATION

Inventor： Wataru MORITA ,  Kunihisa KATO ,  Tsuyoshi MUTO ,  Yuma KATSUTA

IPC: H01L35/34 ,  H01L35/16

Abstract: The present invention is to provide a method of producing a thermoelectric conversion device having a thermoelectric element layer with excellent shape controllability and capable of being highly integrated. The present invention relates to a method of producing a thermoelectric conversion device including a thermoelectric element layer formed of a thermoelectric semiconductor composition containing a thermoelectric semiconductor material on a substrate, the method including a step of providing a pattern frame having openings on a substrate; a step of filling the thermoelectric semiconductor composition in the openings; a step of drying the thermoelectric semiconductor composition filled in the openings, to form a thermoelectric element layer; and a step of releasing the pattern frame from the substrate.

公开(公告)号：US20210098672A1

公开(公告)日：2021-04-01

申请号：US17041063

申请日：2019-03-25

Applicant: LINTEC CORPORATION

Inventor： Kunihisa KATO ,  Tsuyoshi MUTO ,  Yuma KATSUTA

IPC: H01L35/08 ,  H01L35/16 ,  H01L35/32 ,  H01L35/34

Abstract: Provided is a thermoelectric conversion module that improves the solderability between a thermoelectric element layer containing a resin and a solder layer. The thermoelectric conversion module includes a first substrate having a first electrode, a second substrate having a second electrode, a thermoelectric element layer, a solder-receiving layer that directly bonds to the thermoelectric element layer, and a solder layer, wherein the first electrode of the first substrate and the second electrode of the second substrate face each other, and wherein the thermoelectric element layer is formed of a thin film of a thermoelectric semiconductor composition containing a resin, and the solder-receiving layer contains a metal material.

公开(公告)号：US20230380288A1

公开(公告)日：2023-11-23

申请号：US18034442

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Wataru MORITA ,  Katsuhiko HORIGOME ,  Mutsumi MASUMOTO

IPC: H10N10/17

CPC classification number: H10N10/17

Abstract: Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material, and both surfaces of the thermoelectric conversion module are provided with no base material.

公开(公告)号：US20210376218A1

公开(公告)日：2021-12-02

申请号：US17271091

申请日：2019-08-27

Applicant: LINTEC CORPORATION

Inventor： Masaya TODAKA ,  Kunihisa KATO ,  Tsuyoshi MUTO ,  Yuma KATSUTA

IPC: H01L35/34 ,  H01L35/08 ,  H01L35/16

Abstract: Provided are: a method for producing a chip of a thermoelectric conversion material that enables annealing treatment of a thermoelectric conversion material in the form not having a junction with an electrode, and enables annealing of a thermoelectric semiconductor material at an optimum annealing temperature; and a method for producing a thermoelectric conversion module using the chip (13). Also provided are: a method for producing a chip of a thermoelectric conversion material formed of a thermoelectric semiconductor composition, including (A) a step of forming a sacrificial layer (2) on a substrate (1), (B) a step of forming a chip of a thermoelectric conversion material on the sacrificial layer formed in the step (A), (C) a step of annealing the chip of a thermoelectric conversion material formed in the step (B), and (D) a step of peeling the chip of a thermoelectric conversion material annealed in the step (C); and a method for producing a thermoelectric conversion module using the chip produced according to the production method.